Patents by Inventor Hea Kon Oh

Hea Kon Oh has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8853064
    Abstract: The present invention is directed to a method of manufacturing a substrate, which includes loading a base substrate into a reaction furnace; forming a buffer layer on the base substrate; forming a separation layer on the buffer layer; forming a semiconductor layer on the separation layer at least two; and separating the semiconductor layer from the base substrate via the separation layer through natural cooling by unloading the base substrate from the reaction furnace.
    Type: Grant
    Filed: October 21, 2012
    Date of Patent: October 7, 2014
    Assignee: Lumigntech Co., Ltd.
    Inventors: Hae Yong Lee, Young Jun Choi, Jin Hun Kim, Hyun soo Jang, Hea Kon Oh, Hyun Hee Hwang