Patents by Inventor Hea Kyung Kim

Hea Kyung Kim has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • In situ crosslinking hydrogel comprising ?-polyglutamic acid and method for producing the same
    Patent number: 9254348
    Abstract: Disclosed are a biodegradable, biocompatible hydrogel that can be used for sealants of suppressing the leakage of blood or air during surgical operation, tissue adhesives, anti-adhesive agents and drug delivery carriers, and a method for producing the same.
    Type: Grant
    Filed: December 28, 2012
    Date of Patent: February 9, 2016
    Assignee: SAMYANG BIOPHARMACEUTICALS CORPORATION
    Inventors: Young-Joo Koh, Hea-Kyung Kim, Sun-Woo Kim, Guw-Dong Yeo
  • IN SITU CROSSLINKING HYDROGEL COMPRISING gamma-POLYGLUTAMIC ACID AND METHOD FOR PRODUCING THE SAME
    Publication number: 20140336276
    Abstract: Disclosed are a biodegradable, biocompatible hydrogel that can be used for sealants of suppressing the leakage of blood or air during surgical operation, tissue adhesives, anti-adhesive agents and drug delivery carriers, and a method for producing the same
    Type: Application
    Filed: December 28, 2012
    Publication date: November 13, 2014
    Inventors: Young-Joo Koh, Hea-Kyung Kim, Sun-Woo Kim, Guw-Dong Yeo
  • ADHESIVE FILM FOR SEMICONDUCTOR ASSEMBLY
    Publication number: 20120029117
    Abstract: An adhesive film composition includes a polymer binder; a curable resin; and about 40 to about 60 wt. % of solvent, wherein the solvent is a binary solvent consisting essentially of at least a first solvent with a boiling point of about 40° C. to about 100° C. and at least a second solvent with a boiling point of about 140° C. to about 200° C.
    Type: Application
    Filed: October 6, 2011
    Publication date: February 2, 2012
    Applicant: CHEIL INDUSTRIES, INC.
    Inventors: Han Nim CHOI, Ki Tae Song, Chi Seok Hwang, Hea Kyung Kim, Chang Beom Chung
  • Adhesive compostion for die bonding in semiconductor assembly, adhesive film prepared therefrom, dicing die-bonding film prepared therefrom, device package including the same, and associated methods
    Publication number: 20090136748
    Abstract: An adhesive film composition includes a polymer binder; a curable resin; and about 40 to about 60 wt. % of solvent, wherein the solvent is a binary solvent consisting essentially of at least a first solvent with a boiling point of about 40° C. to about 100° C. and at least a second solvent with a boiling point of about 140° C. to about 200° C.
    Type: Application
    Filed: November 28, 2008
    Publication date: May 28, 2009
    Inventors: Han Nim Choi, Ki Tae Song, Chi Seok Hwang, Hea Kyung Kim, Chang Beom Chung