Patents by Inventor Hea-Yean Park

Hea-Yean Park has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME
    Publication number: 20120193794
    Abstract: A semiconductor device and methods of fabricating the same, wherein insulation layers are interposed to sequentially dispose the semiconductor device on a semiconductor substrate. The semiconductor device includes a first conductive plate, a second conductive plate, a third conductive plate, and a fourth conductive plate. At least two of the first, second, third and fourth conductive plates are electrically connected and constitute at least two capacitors.
    Type: Application
    Filed: April 10, 2012
    Publication date: August 2, 2012
    Inventors: Yoon-Hae Kim, Myoung-Hwan Oh, Myung-Soo Yeo, Hea-Yean Park
  • SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME
    Publication number: 20110070718
    Abstract: A semiconductor device and methods of fabricating the same, wherein insulation layers are interposed to sequentially dispose the semiconductor device on a semiconductor substrate. The semiconductor device includes a first conductive plate, a second conductive plate, a third conductive plate, and a fourth conductive plate. At least two of the first, second, third and fourth conductive plates are electrically connected and constitute at least two capacitors.
    Type: Application
    Filed: December 3, 2010
    Publication date: March 24, 2011
    Inventors: Yoon-Hae Kim, Myoung-Hwan Oh, Myung-Soo Yeo, Hea-Yean Park
  • Semiconductor device and method of fabricating the same
    Patent number: 7884409
    Abstract: A semiconductor device and methods of fabricating the same, wherein insulation layers are interposed to sequentially dispose the semiconductor device on a semiconductor substrate. The semiconductor device includes a first conductive plate, a second conductive plate, a third conductive plate, and a fourth conductive plate. At least two of the first second, third and fourth conductive plates are electrically connected and constitute at least two capacitors.
    Type: Grant
    Filed: June 8, 2007
    Date of Patent: February 8, 2011
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Yoon-Hae Kim, Myoung-Hwan Oh, Myung-Soo Yeo, Hea-Yean Park
  • SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME
    Publication number: 20080054329
    Abstract: A semiconductor device and methods of fabricating the same, wherein insulation layers are interposed to sequentially dispose the semiconductor device on a semiconductor substrate. The semiconductor device includes a first conductive plate, a second conductive plate, a third conductive plate, and a fourth conductive plate. At least two of the first second, third and fourth conductive plates are electrically connected and constitute at least two capacitors.
    Type: Application
    Filed: June 8, 2007
    Publication date: March 6, 2008
    Inventors: Yoon-Hae Kim, Myoung-Hwan Oh, Myung-Soo Yeo, Hea-Yean Park