Abstract: Pin probes and pin probe arrays are provided that allow electric contact to be made with selected electronic circuit components. Some embodiments include one or more compliant pin elements located within a sheath. Some embodiments include pin probes that include locking or latching elements that may be used to fix pin portions of probes into sheaths. Some embodiments provide for fabrication of probes using multi-layer electrochemical fabrication methods.

Abstract: Embodiments are directed to the formation micro-scale or millimeter scale structures or methods of making such structures wherein the structures are formed from at least one sheet structural material and may include additional sheet structural materials or deposited structural materials wherein all or a portion of the patterning of the structural materials occurs via laser cutting. In some embodiments, selective deposition is used to provide a portion of the patterning. In some embodiments the structural material or structural materials are bounded from below by a sacrificial bridging material (e.g. a metal) and possibly from above by a sacrificial capping material (e.g. a metal).

Abstract: Embodiments are directed to the formation micro-scale or millimeter scale structures or methods of making such structures wherein the structures are formed from at least one sheet structural material and may include additional sheet structural materials or deposited structural materials wherein all or a portion of the patterning of the structural materials occurs via laser cutting. In some embodiments, selective deposition is used to provide a portion of the patterning. In some embodiments the structural material or structural materials are bounded from below by a sacrificial bridging material (e.g. a metal) and possibly from above by a sacrificial capping material (e.g. a metal).

Abstract: Embodiments are directed to the formation micro-scale or millimeter scale structures or method of making such structures wherein the structures are formed from at least one sheet structural material and may include additional sheet structural materials or deposited structural materials wherein all or a portion of the patterning of the structural materials occurs via laser cutting. In some embodiments, selective deposition is used to provide a portion of the patterning. In some embodiments the structural material or structural materials are bounded from below by a sacrificial bridging material (e.g. a metal) and possibly from above by a sacrificial capping material (e.g. a metal).

Abstract: Embodiments are directed to forming three-dimensional millimeter scale or micro-scale structures from single or multiple sheets or layers of material via electro discharge machining (EDM). In some embodiments, the electrodes are formed by single layer or multi-layer, single material or multi-material deposition processes. In some embodiments single electrodes form a plurality of parts or structures simultaneously. In some embodiments a sacrificial bridging material is used to hold parts together during and after EDM processing.

Abstract: Embodiments are directed to the formation micro-scale or millimeter scale structures or method of making such structures wherein the structures are formed from at least one sheet structural material and may include additional sheet structural materials or deposited structural materials wherein all or a portion of the patterning of the structural materials occurs via laser cutting. In some embodiments, selective deposition is used to provide a portion of the patterning. In some embodiments the structural material or structural materials are bounded from below by a sacrificial bridging material (e.g. a metal) and possibly from above by a sacrificial capping material (e.g. a metal).

Abstract: Embodiments of the invention provide methods of crosslinking various compounds and materials made by these methods. Materials made by embodiments of the invention include glucose sensors used in the management of diabetes.

Abstract: An apparatus for high speed labeling of produce including a turret which carries label depositor arms and continuously rotates so that its fully extended tangential speed matches the produce conveyor speed. The label depositor arms are reciprocated along a predetermined path by a mechanical linkage. A supply of pressurized air and vacuum are selectively delivered to the label depositor arms to pick-up a print-on-demand label and adhere it to the produce. One or more rotating turrets are included within a system for high speed labeling. The system monitors a common shaft which drives a conveyor that moves multiple lanes of produce under corresponding turrets. A conveyor offset signal in combination with a printer offset control, allows the system to independently synchronize the high-speed labeling operation at each lane.

Abstract: An apparatus for high speed labeling of produce including a turret which carries label depositor arms and continuously rotates so that its fully extended tangential speed matches the produce conveyor speed. The label depositor arms are reciprocated along a predetermined path by a mechanical linkage. A supply of pressurized air and vacuum are selectively delivered to the label depositor arms to pick-up a print-on-demand label and adhere it to the produce. One or more rotating turrets are included within a system for high speed labeling. The system monitors a common shaft which drives a conveyor that moves multiple lanes of produce under corresponding turrets. A conveyor offset signal in combination with a printer offset control, allows the system to independently synchronize the high-speed labeling operation at each lane.