Abstract: A method for selectively removing a layer of electrolytically dissoluble metal such as copper overplate from a substrate such as a low-k dielectric comprising: providing a substrate bearing on a major surface thereof a layer of electrolytically dissoluble metal, the metal layer serving as a dissoluble electrode and having a central region and an adjacent peripheral region; providing at least a first counterelectrode and a second counterelectrode; positioning the counterelectrodes opposite the metal layer and spaced from the metal layer and spaced from each other; in a first electrolytic step, passing an electric current between the first counterelectrode and the central region of the metal layer, wherein the first counterelectrode is cathodic with respect to the metal layer, and the first electrolytic step includes a first phase, a second phase, and a third phase and during the first phase the electric current is a low amperage current, during the second phase the electric current includes a train of anodi

Abstract: A method for selectively removing a layer of electrolytically dissoluble metal from a substrate comprising providing a substrate bearing' on a major surface thereof a layer of electrolytically dissoluble metal, said metal layer serving; as a dissoluble electrode; providing at least a first counterelectrode and a second counterelectrode; positioning said counterelectrodes opposite said metal layer and spaced from said metal layer; in a first electrolytic step, interposing an electrolyte between said metal and said first counterelectrode and in electrical contact with said metal layer and said electrode and passing an electric current between said first counterelectrode and said metal layer, wherein said first counterelectrode is maintained cathodic to said metal layer, for a period of time until said metal layer has been removed from a first central region of said surface of said substrate opposite said first counterelectrode; in a second electrolytic step, interposing an electrolyte between said metal and sai

Abstract: A method for selectively removing a layer of electrolytically dissoluble metal such as copper overplate from a substrate such as a low-k dielectric comprising: