Abstract: A method of and system for surface finishing an additive manufactured part. A part having a surface roughness with macroasperities is placed in a chamber with an electrolyte and an electrode. A pulse/pulse reverse power supply is connected to the part rendering it anodic and connected to the electrode rendering it cathodic.

Abstract: A method of and system for surface finishing an additive manufactured pint. A part having a surface roughness with macroasperities is placed in a chamber with an electrolyte and an electrode. A pulse/pulse reverse power supply is connected to the part rendering it anodic and connected to the electrode rendering it cathodic.

Abstract: A method of and system for surface finishing an additive manufactured part. A part having a surface roughness with macroasperities is placed in a chamber with an electrolyte and an electrode. A pulse/pulse reverse power supply is connected to the part rendering it anodic and connected to the electrode rendering it cathodic.

Abstract: A method of and system for surface finishing an additive manufactured part. A part having a surface roughness with macroasperities is placed in a chamber with an electrolyte and an electrode. A pulse/pulse reverse power supply is connected to the part rendering it anodic and connected to the electrode rendering it cathodic.

Abstract: An apparatus for the concentration of suspended algae particles in an aqueous solution. The apparatus includes an electrolytic cell containing at least an anode and a cathode, and a filter. The electrolytic cell receives a solution containing suspended algae particles therein. A power supply is near the filter. A zone of depleted suspended algae particles is near the filter, formed under the influence of an applied electric field from the power supply.

Abstract: An apparatus for the concentration of suspended algae particles in an aqueous solution. The apparatus includes an electrolytic cell containing at least an anode and a cathode, and a filter. The electrolytic cell receives a solution containing suspended algae particles therein. A power supply is near the filter. A zone of depleted suspended algae particles is near the filter, formed under the influence of an applied electric field from the power supply.

Abstract: An electrolytic filtration method and apparatus for the concentration and collection of suspended particulates from aqueous solutions is disclosed. The electrolytic cell contains at least an anode and a cathode, and in one embodiment contains a plurality of anodes and cathodes. The electrolytic cell also contains a filter, and in one embodiment the filter is a moving belt filter. While not bound by theory, the electrolytic filtration method and apparatus is based on the electrophoretic movement of algae particles suspended in an aqueous solution away from the filter under the influence of an electric field. In one embodiment the electric field is a pulsed waveform with unidirectional voltage or current pulses. In another embodiment, the electric field is a pulsed waveform with bidirectional voltage or current pulses.

Abstract: An electrolytic filtration method and apparatus for the concentration and collection of suspended particulates from aqueous solutions is disclosed. The electrolytic cell contains at least an anode and a cathode, and in one embodiment contains a plurality of anodes and cathodes. The electrolytic cell also contains a filter, and in one embodiment the filter is a moving belt filter. While not bound by theory, the electrolytic filtration method and apparatus is based on the electrophoretic movement of algae particles suspended in an aqueous solution away from the filter under the influence of an electric field. In one embodiment the electric field is a pulsed waveform with unidirectional voltage or current pulses. In another embodiment, the electric field is a pulsed waveform with bidirectional voltage or current pulses.

Abstract: A method for electrochemically etching a metal layer through an etch-resist layer pattern using a non-active electrolyte solution is described. The method is particularly useful in fabrication of advanced fuel delivery systems for land-based power generation turbines and aerospace turbine engines; of components for advanced thermal management in aerospace electronic devices and in cooling channels; of stents used in medicine; and of microchannels for sensors, chemical reactors, and dialysis and the like. In one embodiment of the invention the metal layer is copper and the non-active electrolyte solution is a mixture of sodium nitrate and sodium chloride and a pulse electric current is employed to accomplish the electrochemical etching.

Abstract: A method for electrochemically etching a metal layer deposited on a dielectric with an etch resist layer pattern to form circuitry for high density interconnect electronic modules using a nonactive electrolyte solution is described. The method is particularly useful for printed wiring boards, chip scale packages, wafer level packages and the like. The circuit tracks generally range from 50 to 125 micrometers for printed wiring boards, from 5 to 50 micrometers for chip scale packages, and from 0.1 to 5 micrometers for wafer level packages. In one embodiment of the invention the metal layer is copper and the nonactive electrolyte solution is a mixture of sodium nitrate and sodium chloride and a pulse electric current is employed to accomplish the electrochemical etching.