Abstract: A mounting device, for mounting a plurality of fans (50) to a server chassis (70), includes a tray (20), a plurality of brackets (30), and a plurality of fasteners (40). The tray includes a plurality of pairs of mounting sections each pair fixed with a corresponding bracket. Each bracket is U-shaped and includes a pair of side plates (32) for sandwiching a corresponding fan therebetween. Each bracket defines a pair of coaxial locking holes (35?) in the side plates. Each fastener includes a pair of locking ends (42) received in the locking holes of a corresponding bracket to thereby sandwich the corresponding fan in the bracket. Each side plate defines an outlet (34) having a contour corresponding to a contour of an outlet of a corresponding fan, and each mounting section of the tray has a contour corresponding to a contour of the outlet of a corresponding fan.

Abstract: A heat dissipation device includes a first heat sink (10) mounted on one side of a video graphics adapter (VGA) card (70) on which a heat generating componnent is mounted to dissipate heat generated by the heat generating componnent, a second heat sink (10?) mounted on an opposite side of the card, a pair of heat pipes (40) independent from and intercrossed with each other and connected between the first and second heat sinks for transferring heat from the first heat sink to the second heat sink, a pair of covers (26) attached on the respective first and second heat sinks to form enclosed channels (15) between the covers and the first and second heat sinks respectively, a pair of fans (22) mounted between the covers and the first and second heat sinks for producing airflow through the channels to improve heat dissipation efficiency of the heat dissipation device.

Abstract: A cooling device (10) for heat dissipation for a heat-generating component includes a heat sink (14) and a heat pipe (13). The heat sink attached to the component includes a base (11) and a plurality of fins (12) extending from the base. A bottom portion of the heat pipe formed between the base and the fins, the remainder of the heat pipe formed through the fins. An apparatus for making the cooling device includes a mold (20) and a core (30) accommodated in the mold. The mold includes a base part (21) and a pair of symmetrical forming parts (22) slidably engaged on the base part. The forming parts defines a plurality of slots (222), a cavity (224), and a recess (225) respectively corresponding to the fins of the heat sink, the base of the heat sink, and the heat pipe.

Abstract: A heat dissipation device includes a first heat sink (10) mounted on one side of a video graphics adapter (VGA) card (70) on which a heat generating componnent is mounted to dissipate heat generated by the heat generating componnent, a second heat sink (10?) mounted on an opposite side of the card, a pair of heat pipes (40) independent from and intercrossed with each other and connected between the first and second heat sinks for transferring heat from the first heat sink to the second heat sink, a pair of covers (26) attached on the respective first and second heat sinks to form enclosed channels (15) between the covers and the first and second heat sinks respectively, a pair of fans (22) mounted between the covers and the first and second heat sinks for producing airflow through the channels to improve heat dissipation efficiency of the heat dissipation device.

Abstract: A heat sink assembly includes a heat sink (30), a retention frame (10), a rectangular fastener (50), four pins (20), and four springs (40). The heat sink includes a base (32) defining four bores (38) therein. The frame is secured to a printed circuit board (60) around an electronic package (70), and defines a pair of screw holes (16). The pins are received through the bores of the base and in the fastener. The springs surround the pins respectively between the base and the fastener. A pair of posts (90) is extended through positioning holes defined in the fastener and the through holes of the heat sink, and engaged in the screw holes of the frame, thereby securing the fastener to the retention frame with the spring members pressing toward the base. The heat sink is thus easily, firmly and evenly secured to the electronic package.

Abstract: A heat sink assembly (20) includes a number of parallel first fins (40) and a number of parallel second fins (60) each having a main body (44, 64). A number of latch slots (46) is defined in the main body of each first fin. A number of latches (66) extends from the main body of each second fin in opposite directions. The first fins and the second fins are assembled together in interleaved fashion, so that the latches of each second fin engage in the latch slots of two adjacent first fins respectively.

Abstract: A fixing apparatus (30) for pressing a heat sink (70) against an electronic device (20) positioned in a retention module (62), includes two pressing members (32) and a fastener (52). An elongate slot (34) is defined in a center of each pressing member. Two spring fingers (36) extend inwardly and downwardly from the pressing member at opposite ends of the slot respectively. An engaging portion (42) is formed at an end of the pressing member. A locking leg (47) depends from an opposite end of the pressing member. Two engaging slots (54) are defined in opposite ends of the fastener for receiving the engaging portion of the pressing member. Two locking legs (56) depend from opposite ends of the fastener respectively. A hook (48, 57) is defined at a distal end of each locking leg.

Abstract: A heat dissipating apparatus (10) includes a heat pipe (20) and a heat sink (30). The heat sink is made by die-casting, and includes a chassis (32) and a plurality of fins (34) extending upwardly from the chassis. The heat pipe is U-shaped, and is embedded in the heat sink in intimate contact with the chassis and the fins. The heat pipe includes a first end (12) and a second end (14). The first end is partially embedded in the chassis of the heat sink, for transfer of heat from the chassis to the first end by way of vaporization of working medium in the heat pipe. The second end is embedded in upper portions of the fins, for transfer of heat from the heat pipe to the fins by way of condensation of the vaporized working medium.

Abstract: A heat sink assembly having a retaining device includes a heat sink (30), a retention frame (10), a rectangular fastener (50), four pins (20), and four springs (40). The heat sink includes a base (32) defining four bores (38) therein. The frame is secured to a printed circuit board (60) around an electronic package (70), and defines a pair of through holes (16). A pair of posts (55) depends from opposite sides of the fastener. The pins are received through the bores of the base and in the fastener. The springs surround the pins respectively between the base and the fastener. The posts are deformably extended through the through holes thereby compressing the springs and sandwiching the base between the frame and the springs. The springs cooperatively provide evenly distributed pressing forces on the base. The heat sink is thus easily, firmly and evenly secured to the electronic package.

Abstract: A heat sink assembly includes a heat sink (10), a fan (20), and a retaining bar (30). The heat sink includes a base (12), and a plurality of parallel fins (14) extending upwardly from the base. The fins include a first outmost fin (18) and a second outmost fin (19) at opposite sides of the heat sink. The first outmost fin and intervening fins each define a longitudinal opening. All of the openings are aligned with each other, and cooperatively define a hexahedral chamber (16) that is parallel with the base. The fan is received in the chamber. The retaining bar is secured to the first outmost fin by fasteners such as screws (40). A pressing portion (36) is formed on the retaining bar, the pressing portion resiliently pressing one side wall of the fan. The fan is thus firmly retained in the chamber.

Abstract: A heat sink assembly (20) includes a number of parallel first fins (40) and a number of parallel second fins (60) each having a main body (44, 64). A number of latch slots (46) is defined in the main body of each first fin. A number of latches (66) extends from the main body of each second fin in opposite directions. The first fins and the second fins are assembled together in interleaved fashion, so that the latches of each second fin engage in the latch slots of two adjacent first fins respectively.

Abstract: A mounting device, for mounting a plurality of fans (50) to a server chassis (70), includes a tray (20), a plurality of brackets (30), and a plurality of fasteners (40). The tray includes a plurality of pairs of mounting sections each pair fixed with a corresponding bracket. Each bracket is U-shaped and includes a pair of side plates (32) for sandwiching a corresponding fan therebetween. Each bracket defines a pair of coaxial locking holes (35′) in the side plates. Each fastener includes a pair of locking ends (42) received in the locking holes of a corresponding bracket to thereby sandwich the corresponding fan in the bracket. Each side plate defines an outlet (34) having a contour corresponding to a contour of an outlet of a corresponding fan, and each mounting section of the tray has a contour corresponding to a contour of the outlet of a corresponding fan.

Abstract: A retaining device for attaching a heat sink (2) to a CPU (3) mounted on a circuit board (4). The retaining device includes a pair of clips (1), a backplate (6), and four pins (5). Each clip includes a central pressing portion (10), two resilient portions (12) adjacent the pressing portion, two shoulders (13) adjacent the resilient portions, and two arms (17). Each shoulder defines first and second cutouts (14a, 14b). Each pin forms a blocking head (50), and a bottom blocking stop (58). The pins are extended through the backplate, the circuit board and the heat sink. The heads are initially received through the first cutouts, and then engaged on the shoulders at the second cutouts. The heads press downwardly on the clips, and the stops press upwardly on the backplate. Thus, the clips and the backplate firmly sandwich the heat sink, the CPU and the circuit board therebetween.

Abstract: A cooling device (10) for heat dissipation for a heat-generating component includes a heat sink (14) and a heat pipe (13). The heat sink attached to the component includes a base (11) and a plurality of fins (12) extending from the base. A bottom portion of the heat pipe formed between the base and the fins, the remainder of the heat pipe formed through the fins. An apparatus for making the cooling device includes a mold (20) and a core (30) accommodated in the mold. The mold includes a base part (21) and a pair of symmetrical forming parts (22) slidably engaged on the base part. The forming parts defines a plurality of slots (222), a cavity (224), and a recess (225) respectively corresponding to the fins of the heat sink, the base of the heat sink, and the heat pipe.

Abstract: A heat sink assembly includes a heat sink (30), a retention frame (10), a rectangular fastener (50), four pins (20), and four springs (40). The heat sink includes a base (32) defining four bores (38) therein. The frame is secured to a printed circuit board (60) around an electronic package (70), and defines a pair of screw holes (16). The pins are received through the bores of the base and in the fastener. The springs surround the pins respectively between the base and the fastener. A pair of posts (90) is extended through positioning holes defined in the fastener and the through holes of the heat sink, and engaged in the screw holes of the frame, thereby securing the fastener to the retention frame with the spring members pressing toward the base. The heat sink is thus easily, firmly and evenly secured to the electronic package.

Abstract: A heat sink assembly includes a heat sink (10), a fan (20), and a retaining bar (30). The heat sink includes a base (12), and a plurality of parallel fins (14) extending upwardly from the base. The fins include a first outmost fin (18) and a second outmost fin (19) at opposite sides of the heat sink. The first outmost fin and intervening fins each define a longitudinal opening. All of the openings are aligned with each other, and cooperatively define a hexahedral chamber (16) that is parallel with the base. The fan is received in the chamber. The retaining bar is secured to the first outmost fin by fasteners such as screws (40). A pressing portion (36) is formed on the retaining bar, the pressing portion resiliently pressing one side wall of the fan. The fan is thus firmly retained in the chamber.

Abstract: A heat dissipating apparatus (10) includes a heat pipe (20) and a heat sink (30). The heat sink is made by die-casting, and includes a chassis (32) and a plurality of fins (34) extending upwardly from the chassis. The heat pipe is U-shaped, and is embedded in the heat sink in intimate contact with the chassis and the fins. The heat pipe includes a first end (12) and a second end (14). The first end is partially embedded in the chassis of the heat sink, for transfer of heat from the chassis to the first end by way of vaporization of working medium in the heat pipe. The second end is embedded in upper portions of the fins, for transfer of heat from the heat pipe to the fins by way of condensation of the vaporized working medium.

Abstract: A heat sink assembly having a retaining device includes a heat sink (30), a retention frame (10), a rectangular fastener (50), four pins (20), and four springs (40). The heat sink includes a base (32) defining four bores (38) therein. The frame is secured to a printed circuit board (60) around an electronic package (70), and defines a pair of through holes (16). A pair of posts (55) depends from opposite sides of the fastener. The pins are received through the bores of the base and in the fastener. The springs surround the pins respectively between the base and the fastener. The posts are deformably extended through the through holes thereby compressing the springs and sandwiching the base between the frame and the springs. The springs cooperatively provide evenly distributed pressing forces on the base. The heat sink is thus easily, firmly and evenly secured to the electronic package.

Abstract: A fixing apparatus (30) for pressing a heat sink (70) against an electronic device (20) positioned in a retention module (62), includes two pressing members (32) and a fastener (52). An elongate slot (34) is defined in a center of each pressing member. Two spring fingers (36) extend inwardly and downwardly from the pressing member at opposite ends of the slot respectively. An engaging portion (42) is formed at an end of the pressing member. A locking leg (47) depends from an opposite end of the pressing member. Two engaging slots (54) are defined in opposite ends of the fastener for receiving the engaging portion of the pressing member. Two locking legs (56) depend from opposite ends of the fastener respectively. A hook (48, 57) is defined at a distal end of each locking leg.

Abstract: A retaining device for attaching a heat sink (2) to a CPU (3) mounted on a circuit board (4). The retaining device includes a pair of clips (1), a backplate (6), and four pins (5). Each clip includes a central pressing portion (10), two resilient portions (12) adjacent the pressing portion, two shoulders (13) adjacent the resilient portions, and two arms (17). Each shoulder defines first and second cutouts (14a, 14b). Each pin forms a blocking head (50), and a bottom blocking stop (58). The pins are extended through the backplate, the circuit board and the heat sink. The heads are initially received through the first cutouts, and then engaged on the shoulders at the second cutouts. The heads press downwardly on the clips, and the stops press upwardly on the backplate. Thus, the clips and the backplate firmly sandwich the heat sink, the CPU and the circuit board therebetween.