Abstract: The present invention refers to a composition, a low halogen and fast curing conductive adhesive and its preparation method. The composition includes the following raw materials measured by weight: epoxy resin 5-15 parts, curing agent 0.5-3 parts, acrylic acid component 5-12 parts, initiator 0.5-2 parts, flexibilizer 2-5 parts, wetting dispersant 0.1-1 parts, coupling agent 0.1-1 parts, antioxidant 0.1-1 parts, defoamer 0.1-1 parts and conductive silver filler 75-85 parts. The low halogen and fast curing conductive adhesive of the present invention has the advantages of fast curing (within 10 min), low halogen content, high bond strength, good moisture-heat aging resistance, good electric conductivity and thermal conductivity and so on, and has wide application prospects in the field of microelectronic packaging.

Abstract: The present invention refers to a recyclable conductive adhesive composition for LED packaging and preparation method thereof, and its recycling method and the obtained recycled conductive silver powder, wherein the recyclable conductive adhesive composition for LED packaging comprises epoxy resin, epoxy resin diluent, curing agent containing imine bond, amine curing agent, curing accelerator, wetting dispersant, coupling agent, defoamer and conductive silver powder. The epoxy curing agent containing imine bond adopted in the present invention can introduce the dynamic imine chemical bond into the epoxy resin matrix of the conductive adhesive by curing reaction, and can endow the epoxy resin matrix with degradable function by its imine bond's feature of occurring dynamic exchange reaction with amine solvent under heating condition, therefore the conductive silver powder in the conductive adhesive can be recycled and reused.

Abstract: The present invention refers to a composition, a low halogen and fast curing conductive adhesive and its preparation method. The composition includes the following raw materials measured by weight: epoxy resin 5-15 parts, curing agent 0.5-3 parts, acrylic acid component 5-12 parts, initiator 0.5-2 parts, flexibilizer2-5 parts, wetting dispersant 0.1-1 parts, coupling agent 0.1-1 parts, antioxidant 0.1-1 parts, defoamer 0.1-1 parts and conductive silver filler 75-85 parts. The low halogen and fast curing conductive adhesive of the present invention has the advantages of fast curing (within 10 min), low halogen content, high bond strength, good moisture-heat aging resistance, good electric conductivity and thermal conductivity and so on, and has wide application prospects in the field of microelectronic packaging.

Abstract: The present invention refers to a recyclable conductive adhesive composition for LED packaging and preparation method thereof, and its recycling method and the obtained recycled conductive silver powder, wherein the recyclable conductive adhesive composition for LED packaging comprises epoxy resin, epoxy resin diluent, curing agent containing imine bond, amine curing agent, curing accelerator, wetting dispersant, coupling agent, defoamer and conductive silver powder. The epoxy curing agent containing imine bond adopted in the present invention can introduce the dynamic imine chemical bond into the epoxy resin matrix of the conductive adhesive by curing reaction, and can endow the epoxy resin matrix with degradable function by its imine bond's feature of occurring dynamic exchange reaction with amine solvent under heating condition, therefore the conductive silver powder in the conductive adhesive can be recycled and reused.