Patents by Inventor Hector Amador

Hector Amador has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Architecture and processes to enable high capacity memory packages through memory die stacking
    Patent number: 11456281
    Abstract: Embodiments include electronic packages and methods of forming such packages. An electronic package includes a memory module comprising a first memory die. The first memory die includes first interconnects with a first pad pitch and second interconnects with a second pad pitch, where the second pad pitch is less than the first pad pitch. The memory module also includes a redistribution layer below the first memory die, and a second memory die below the redistribution layer, where the second memory die has first interconnects with a first pad pitch and second interconnects with a second pad pitch. The memory module further includes a mold encapsulating the second memory die, where through mold interconnects (TMIs) provide an electrical connection from the redistribution layer to mold layer. The TMIs may be through mold vias. The TMIs may be made through a passive interposer that is encapsulated in the mold.
    Type: Grant
    Filed: September 29, 2018
    Date of Patent: September 27, 2022
    Assignee: Intel Corporation
    Inventors: Yí Li, Zhiguo Qian, Prasad Ramanathan, Saikumar Jayaraman, Kemal Aygun, Hector Amador, Andrew Collins, Jianyong Xie, Shigeki Tomishima
  • ARCHITECTURE AND PROCESSES TO ENABLE HIGH CAPACITY MEMORY PACKAGES THROUGH MEMORY DIE STACKING
    Publication number: 20200105719
    Abstract: Embodiments include electronic packages and methods of forming such packages. An electronic package includes a memory module comprising a first memory die. The first memory die includes first interconnects with a first pad pitch and second interconnects with a second pad pitch, where the second pad pitch is less than the first pad pitch. The memory module also includes a redistribution layer below the first memory die, and a second memory die below the redistribution layer, where the second memory die has first interconnects with a first pad pitch and second interconnects with a second pad pitch. The memory module further includes a mold encapsulating the second memory die, where through mold interconnects (TMIs) provide an electrical connection from the redistribution layer to mold layer. The TMIs may be through mold vias. The TMIs may be made through a passive interposer that is encapsulated in the mold.
    Type: Application
    Filed: September 29, 2018
    Publication date: April 2, 2020
    Inventors: Yi LI, Zhiguo QIAN, Prasad RAMANATHAN, Saikumar JAYARAMAN, Kemal AYGUN, Hector AMADOR, Andrew COLLINS, Jianyong XIE, Shigeki TOMISHIMA
  • Vehicle with headlight control
    Patent number: 10025424
    Abstract: A vehicle including: a headlight that produces a beam, a touchscreen, a camera, processor(s) configured to: (a) display images captured by the camera on the touchscreen; (b) recast the beam according to touch inputs on the images; (c) disable (b) when the vehicle exceeds a predetermined speed; (d) recast the beam by sweeping the beam from an original position to a final position.
    Type: Grant
    Filed: August 15, 2016
    Date of Patent: July 17, 2018
    Assignee: Ford Global Technologies, LLC
    Inventors: Fernando Cruz Solis, Tania Garcia, Jhammel Montes, Hector Amador
  • VEHICLE WITH HEADLIGHT CONTROL
    Publication number: 20180046310
    Abstract: A vehicle including: a headlight that produces a beam, a touchscreen, a camera, processor(s) configured to: (a) display images captured by the camera on the touchscreen; (b) recast the beam according to touch inputs on the images; (c) disable (b) when the vehicle exceeds a predetermined speed; (d) recast the beam by sweeping the beam from an original position to a final position.
    Type: Application
    Filed: August 15, 2016
    Publication date: February 15, 2018
    Inventors: Fernando Cruz Solis, Tania Garcia, Jhammel Montes, Hector Amador