Patents by Inventor Hector Andrew Hamilton Steen

Hector Andrew Hamilton Steen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Soldering material based on Sn Ag and Cu
    Patent number: 11285569
    Abstract: The invention relates to a soldering material comprising an alloy that in addition to Sn (tin) as the major constituent, comprises 10 wt. % or less Ag (silver), 10 wt. % or less Bi (bismuth), 10 wt. % or less Sb (antimony) and 3 wt. % or less Cu (copper). Furthermore, the invention relates to a soldering material comprising a plurality of soldering components with such alloy compositions and contents in the soldering material that on fusing the soldering components an alloy is formed that comprises Sn, Ag, Bi, Sb and Cu in the abovementioned alloy contents.
    Type: Grant
    Filed: August 2, 2019
    Date of Patent: March 29, 2022
    Assignees: Henkel AG & Co. KGaA, Heraeus Duetschland GmbH & Co. KG, Alpha Assembly Solutions Inc.
    Inventors: Hans-Jurgen Albrecht, Gunnar Petzold, Klaus Wilke, Klaus Heinrich Georg Bartl, Hector Andrew Hamilton Steen, Klaus Muller, Werner Kruppa, Mathias Nowottnick, Klaus Wittke
  • SOLDERING MATERIAL BASED ON SN AG AND CU
    Publication number: 20200023472
    Abstract: The invention relates to a soldering material comprising an alloy that in addition to Sn (tin) as the major constituent, comprises 10 wt. % or less Ag (silver), 10 wt. % or less Bi (bismuth), 10 wt. % or less Sb (antimony) and 3 wt. % or less Cu (copper). Furthermore, the invention relates to a soldering material comprising a plurality of soldering components with such alloy compositions and contents in the soldering material that on fusing the soldering components an alloy is formed that comprises Sn, Ag, Bi, Sb and Cu in the abovementioned alloy contents.
    Type: Application
    Filed: August 2, 2019
    Publication date: January 23, 2020
    Inventors: Hans-Jurgen Albrecht, Gunnar Petzold, Klaus Wilke, Klaus Heinrich Georg Bartl, Hector Andrew Hamilton Steen, Klaus Muller, Werner Kruppa, Mathias Nowottnick, Klaus Wittke
  • Soldering material based on Sn Ag and Cu
    Patent number: 10376994
    Abstract: The invention relates to a soldering material comprising an alloy that in addition to Sn (tin) as the major constituent, comprises 10 wt. % or less Ag (silver), 10 wt. % or less Bi (bismuth), 10 wt. % or less Sb (antimony) and 3 wt. % or less Cu (copper). Furthermore, the invention relates to a soldering material comprising a plurality of soldering components with such alloy compositions and contents in the soldering material that on fusing the soldering components an alloy is formed that comprises Sn, Ag, Bi, Sb and Cu in the abovementioned alloy contents.
    Type: Grant
    Filed: April 21, 2004
    Date of Patent: August 13, 2019
    Inventors: Hans-Jürgen Albrecht, Klaus Heinrich Georg Bartl, Werner Kruppa, Klaus Müller, Mathias Nowottnick, Gunnar Petzold, Hector Andrew Hamilton Steen, Klaus Wilke, Klaus Wittke
  • Lead-free solder alloy powder paste use in PCB production
    Patent number: 6648210
    Abstract: Tombstoning susceptibility and reflow peak temperature reduction of solder alloys, in particularly lead-free solder alloys, has been found to be achieved effectively by mixing the solder alloy in the form of an alloy paste with a low melting alloy utilised in powder form, in particular a Bi-containing alloy.
    Type: Grant
    Filed: February 9, 2001
    Date of Patent: November 18, 2003
    Assignee: Multicore Solders Limited
    Inventor: Hector Andrew Hamilton Steen