Patents by Inventor Hedan Zhang

Hedan Zhang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240371447
    Abstract: A data storage device including, in one implementation, a number of memory die packages disposed on a substrate within the data storage device. Each memory die package has a die density that includes one or more memory dies. The die density of each memory die package is configured to provide an even thermal distribution across the number of memory die packages. The respective die densities of two memory of the die packages are different from each other.
    Type: Application
    Filed: July 17, 2024
    Publication date: November 7, 2024
    Inventors: Shrikar Bhagath, Dean Jenkins, Hedan Zhang, Bret Winkler, Ning Ye
  • Patent number: 12068041
    Abstract: A data storage device including, in one implementation, a number of memory die packages disposed on a substrate within the data storage device. Each memory die package has a die density that includes one or more memory dies. The die density of each memory die package is configured to provide an even thermal distribution across the number of memory die packages. The respective die densities of two memory of the die packages are different from each other.
    Type: Grant
    Filed: March 12, 2021
    Date of Patent: August 20, 2024
    Assignee: Sandisk Technologies, Inc.
    Inventors: Shrikar Bhagath, Dean Jenkins, Hedan Zhang, Bret Winkler, Ning Ye
  • Patent number: 12013749
    Abstract: Methods and apparatus for detecting a failed temperature sensor within a data storage device and for mitigating the loss of the sensor are provided. One such data storage device includes a non-volatile memory (NVM), a set of temperature sensors, and a processor coupled to the NVM and the temperature sensors. The processor is configured to detect failure of one of the temperature sensors and obtain temperature data from the other temperature sensors. The processor is further configured to estimate, based on the obtained temperature data, the temperature at the failed sensor, and then control at least one function of the data storage device based on the estimated temperature, such as controlling entry into a Read Only mode. In some examples, the processor estimates the temperature at the failed sensor or at various virtual sensor locations using pre-determined formulas having offsets and coefficients determined during an initial machine learning calibration procedure.
    Type: Grant
    Filed: June 29, 2022
    Date of Patent: June 18, 2024
    Assignee: Western Digital Technologies, Inc.
    Inventors: Hedan Zhang, Chaolun Zheng, Ning Ye, Bret Dee Winkler, Yanjun Xia, Wei Wu
  • Publication number: 20240004749
    Abstract: Methods and apparatus for detecting a failed temperature sensor within a data storage device and for mitigating the loss of the sensor are provided. One such data storage device includes a non-volatile memory (NVM), a set of temperature sensors, and a processor coupled to the NVM and the temperature sensors. The processor is configured to detect failure of one of the temperature sensors and obtain temperature data from the other temperature sensors. The processor is further configured to estimate, based on the obtained temperature data, the temperature at the failed sensor, and then control at least one function of the data storage device based on the estimated temperature, such as controlling entry into a Read Only mode. In some examples, the processor estimates the temperature at the failed sensor or at various virtual sensor locations using pre-determined formulas having offsets and coefficients determined during an initial machine learning calibration procedure.
    Type: Application
    Filed: June 29, 2022
    Publication date: January 4, 2024
    Inventors: Hedan Zhang, Chaolun Zheng, Ning Ye, Bret Dee Winkler, Yanjun Xia, Wei Wu
  • Publication number: 20220293195
    Abstract: A data storage device including, in one implementation, a number of memory die packages disposed on a substrate within the data storage device. Each memory die package has a die density that includes one or more memory dies. The die density of each memory die package is configured to provide an even thermal distribution across the number of memory die packages. The respective die densities of two memory of the die packages are different from each other.
    Type: Application
    Filed: March 12, 2021
    Publication date: September 15, 2022
    Inventors: Shrikar Bhagath, Dean Jenkins, Hedan Zhang, Bret Winkler, Ning Ye