Patents by Inventor Hedeaki SAKAGUCHI

Hedeaki SAKAGUCHI has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Wiring substrate and method for manufacturing the wiring substrate
    Patent number: 8446013
    Abstract: A wiring substrate includes a substrate body including a first substrate surface and a second substrate surface, a trench being open toward the first substrate surface, the trench having an inner bottom surface and an inner side surface, a through-hole having a first end communicating with the inner bottom surface of the trench and a second end being open toward the second substrate surface, a first conductive layer having a first surface toward the trench and being filled inside at least a portion of the through-hole from the second end, a second conductive layer covering the first surface and at least a part of the inner bottom surface of the trench, and a third conductive layer covering the second conductive layer and being filled inside the trench.
    Type: Grant
    Filed: June 20, 2011
    Date of Patent: May 21, 2013
    Assignee: Shinko Electric Industries Co., Ltd.
    Inventors: Masahiro Sunohara, Takayuki Tokunaga, Hedeaki Sakaguchi, Akihito Takano
  • WIRING SUBSTRATE AND METHOD FOR MANUFACTURING THE WIRING SUBSTRATE
    Publication number: 20110316169
    Abstract: A wiring substrate includes a substrate body including a first substrate surface and a second substrate surface, a trench being open toward the first substrate surface, the trench having an inner bottom surface and an inner side surface, a through-hole having a first end communicating with the inner bottom surface of the trench and a second end being open toward the second substrate surface, a first conductive layer having a first surface toward the trench and being filled inside at least a portion of the through-hole from the second end, a second conductive layer covering the first surface and at least a part of the inner bottom surface of the trench, and a third conductive layer covering the second conductive layer and being filled inside the trench.
    Type: Application
    Filed: June 20, 2011
    Publication date: December 29, 2011
    Applicant: SHINKO ELECTRIC INDUSTRIES CO., LTD.
    Inventors: Masahiro SUNOHARA, Takayuki TOKUNAGA, Hedeaki SAKAGUCHI, Akihito TAKANO