Patents by Inventor Hee-Bae Lee

Hee-Bae Lee has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Metal line in semiconductor device and fabricating method thereof
    Patent number: 7691738
    Abstract: A metal line in a semiconductor device and fabricating method thereof includes a first contact plug on a substrate, a first insulating interlayer over the substrate including the first contact plug, a first etch stop layer formed over the first insulating interlayer; a trench in the first insulating interlayer and the first etch stopper layer, a metal line in the trench, the metal line including a second contact plug projecting from the trench, wherein the metal line and the trench are formed as a single body, and a second insulating interlayer over the substrate including the metal line and the second contact plug.
    Type: Grant
    Filed: October 20, 2008
    Date of Patent: April 6, 2010
    Assignee: Dongbu HiTek Co., Ltd.
    Inventor: Hee-Bae Lee
  • METAL LINE IN SEMICONDUCTOR DEVICE AND FABRICATING METHOD THEREOF
    Publication number: 20090108454
    Abstract: A metal line in a semiconductor device and fabricating method thereof includes a first contact plug on a substrate, a first insulating interlayer over the substrate including the first contact plug, a first etch stop layer formed over the first insulating interlayer; a trench in the first insulating interlayer and the first etch stopper layer, a metal line in the trench, the metal line including a second contact plug projecting from the trench, wherein the metal line and the trench are formed as a single body, and a second insulating interlayer over the substrate including the metal line and the second contact plug.
    Type: Application
    Filed: October 20, 2008
    Publication date: April 30, 2009
    Inventor: Hee-Bae Lee