Patents by Inventor Hee Cheol Kim

Hee Cheol Kim has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11492517
    Abstract: Provided are a foldable back plate film and a method of manufacturing the same.
    Type: Grant
    Filed: November 14, 2019
    Date of Patent: November 8, 2022
    Assignee: LG CHEM, LTD.
    Inventors: Hee Song, Hyon Gyu Park, Hyun Cheol Kim
  • Publication number: 20220332988
    Abstract: The present invention relates to a foldable adhesive film and a fabrication method therefor, and particularly, to a foldable adhesive film having improved folding performance by minimizing the deformation thereof at high temperature, maintaining the creep strain and recovery thereof at constant levels in a temperature range from low temperature to high temperature, minimizing the force that is applied for deformation of the adhesive film in a low-temperature region, improving the recovery thereof in a low-temperature region, and maintaining the recovery thereof at constant levels in a temperature range from a low-temperature region to a high-temperature region, and a fabrication method therefor.
    Type: Application
    Filed: December 3, 2020
    Publication date: October 20, 2022
    Applicant: LG CHEM, LTD.
    Inventors: Hyon Gyu PARK, Hyun Cheol KIM, Hee SONG, Seung Yeon RYU
  • Patent number: 11404026
    Abstract: A display device according to an embodiment includes a plurality of display panels arranged adjacent to each other and each display panel including first pixels in the display panel and second pixels in the display panel and adjacent to a boundary area of the display panels, and a luminance correction unit configured to generate a correction grayscale value for the second pixel. The luminance correction unit includes an image mapping unit configured to map a captured luminance image to a unit pixel image, a de-blurring unit configured to perform a de-blurring operation on the mapped unit pixel image to calculate a correction luminance value for the second pixel, and a correction unit configured to calculate a correction grayscale value for the second pixel corresponding to the calculated correction luminance value of the second pixel.
    Type: Grant
    Filed: April 15, 2021
    Date of Patent: August 2, 2022
    Assignee: Samsung Display Co., Ltd.
    Inventors: Se Yun Kim, Sang Cheol Park, Si Hun Jang, Min Gyu Kim, Hee Joon Kim, Jun Pyo Lee
  • Publication number: 20220236802
    Abstract: Provided is an input feedback-based smart pen including: a main body having a shape that enables manipulation of a user; an input unit connected to the main body and performing an input operation by a manipulation of the user; an input information recognition unit configured to recognize information input by a user through the manipulation of the input unit; and an expression unit including one or more expression members formed in an area of an outer surface of the main body to be detectable by the user to express information corresponding to input information recognized by the input information recognition unit.
    Type: Application
    Filed: December 10, 2019
    Publication date: July 28, 2022
    Applicant: DOT INCORPORATION
    Inventors: Ju Yoon KIM, Ji Ho KIM, Hyeon Cheol PARK, Hee Su LEE
  • Publication number: 20220228042
    Abstract: The present invention relates to an adhesive composition including an acrylic polymer having a glass transition temperature of ?40° C. or less and a citric acid ester-based compound whose ends are substituted with hydrogen or an alkyl group, an adhesive film, and a foldable display device.
    Type: Application
    Filed: September 28, 2020
    Publication date: July 21, 2022
    Applicant: LG CHEM, LTD.
    Inventors: Hee SONG, Hyon Gyu PARK, Hyun Cheol KIM, Seung Yeon RYU
  • Publication number: 20220221462
    Abstract: The present invention relates to a marker for diagnosing colorectal cancer, a method for providing information required for the diagnosis of colorectal cancer by using same, and a method for providing information for monitoring the response to colorectal cancer therapy by using same.
    Type: Application
    Filed: April 29, 2020
    Publication date: July 14, 2022
    Inventors: Eun Suk KANG, Hee Cheol KIM, Jae Won YUN
  • Publication number: 20220074002
    Abstract: Oligomer nucleotides, compositions, methods, kits, and uses are provided for detecting or quantifying a Human Cytomegalovirus virus 1 (CMV (human herpesvirus 5, HHV5) nucleic acid, e.g., using nucleic acid amplification and hybridization assays. Multiphase amplification of a CMV target sequence is also described. The oligomer nucleotides, compositions, methods, kits, and uses can be used to amplify and/or detect the UL56 gene of CMV.
    Type: Application
    Filed: August 21, 2019
    Publication date: March 10, 2022
    Inventors: Paul Darby, Siobhan Miick, Jo Ann Jackson, Hee Cheol Kim, Amber Hillius, Ankur Shah
  • Publication number: 20220056011
    Abstract: This patent document relates to the crystalline forms of a quinazoline compound and the hydrochloride salts thereof. More particularly, this patent document relates to a preparation method of the crystalline forms of 1-(4-(4-(3,4-dichloro-2-fluorophenylamino)-7-methoxyquinazolin-6-yloxy)piperidin-1-yl)prop-2-en-1-one and its hydrochloride salts.
    Type: Application
    Filed: September 12, 2019
    Publication date: February 24, 2022
    Inventors: Jong Ouk Baek, Hee Cheol Kim, Tae Hee Ha, Kweehyun Suh
  • Publication number: 20210288005
    Abstract: A semiconductor package includes a semiconductor chip having at least one chip pad disposed on one surface thereof; a wiring pattern disposed on top of the semiconductor chip and having at least a portion thereof in contact with the chip pad to be electrically connected to the chip pad; and a solder bump disposed on outer surface of the wiring pattern to be electrically connected to the chip pad through the wiring pattern.
    Type: Application
    Filed: February 19, 2021
    Publication date: September 16, 2021
    Applicant: Nepes CO., LTD.
    Inventors: Hyun Sik KIM, Seung Hwan SHIN, Yong Tae KWON, Dong Hoon SEO, Hee Cheol KIM, Dong Soo LEE
  • Patent number: 11008333
    Abstract: A crystalline form of an alkyl benzene sulfonyl urea compound that is useful as an oral antidiabetics is disclosed. Specifically, the compound is a hydrochloride salt of N-(3-(2-(4-(4-methylpiperazin-1-yl)phenylamino)thieno[3,2-d]pyrimidin-4-yloxy)phenyl)acrylamide of the following formula I.
    Type: Grant
    Filed: December 30, 2016
    Date of Patent: May 18, 2021
    Assignee: HANMI PHARM. CO., LTD.
    Inventors: Jong Ouk Baek, Ji Young Jeon, Hee Sook Oh, Hee Cheol Kim, Sun Young Jang, Tae Hee Ha
  • Publication number: 20210135285
    Abstract: The present invention relates to a lithium secondary battery electrolyte and a lithium secondary battery including the same and, more specifically, to a flame retardant or nonflammable lithium secondary battery electrolyte having excellent stability even at a high voltage and a lithium secondary battery including the same.
    Type: Application
    Filed: July 31, 2018
    Publication date: May 6, 2021
    Inventors: HEE CHEOL KIM, YOUNGGIL KWON, EUI HYEONG HWANG, JI HEE JANG, SANG HO LEE, SEUNG WAN SONG, QUANG HIEU PHAM
  • Patent number: 10964656
    Abstract: The present invention relates to a semiconductor package and a method of manufacturing the same. In a semiconductor package which electrically connects a semiconductor chip and a printed circuit board using a solder ball, the semiconductor package further includes a thermal buffer layer which is positioned on a semiconductor chip, absorbs and disperse heat generated by the semiconductor chip, increases a distance between the semiconductor chip and a printed circuit board to decrease a deviation of a heat conduction process, and has a thickness ranging from 7.5 to 50% of a diameter of a solder ball.
    Type: Grant
    Filed: May 30, 2019
    Date of Patent: March 30, 2021
    Assignee: NEPES CO., LTD.
    Inventors: Yong Tae Kwon, Hee Cheol Kim, Seung Jun Moon, Jini Shim
  • Publication number: 20200283401
    Abstract: A novel method for preparing a compound of Chemical Formula 1 is disclosed. The method includes a step of obtaining a compound of Chemical Formula 1 by performing a reduction reaction on a compound of Chemical Formula 2; and an intermediate used therein.
    Type: Application
    Filed: September 27, 2018
    Publication date: September 10, 2020
    Applicant: HANMI PHARM. CO., LTD.
    Inventors: Wook JANG, Jong Ouk BAEK, Hee Cheol KIM, Tae Hee HA
  • Publication number: 20200270268
    Abstract: The present invention relates to a crystalline form of a hydrochloride salt of N-(3-(2-(4-(4-methylpiperazin-1-yl)phenylamino)thieno[3,2-d]pyrimidin-4-yloxy)phenyl)acrylamide, and a pharmaceutical composition containing the same. The crystalline form of the hydrochloride salt of the compound can be easily used for preparing a pharmaceutical composition containing the same as an active ingredient.
    Type: Application
    Filed: December 30, 2016
    Publication date: August 27, 2020
    Applicant: HANMI PHARM. CO., LTD.
    Inventors: Jong Ouk BAEK, Ji Young JEON, Hee Sook OH, Hee Cheol KIM, Sun Young JANG, Tae Hee HA
  • Patent number: 10654419
    Abstract: A luggage compartment screen apparatus of a vehicle may include a moving housing movable along guide rails; a push mechanism to be drawn out or drawn in from the moving housing toward the luggage compartment and be rotatable and formed to have a step in a rotation direction thereof; and a locking mechanism rotatably disposed on the moving housing to be configured to be selectively locked to the guide rail, formed to have a step in a drawn-out and drawn-in direction of the push mechanism, and having a stepped portion in contact with a stepped portion of the push mechanism to be rotated to be locked to the guide rail at the time of a drawn-in operation or a rotation operation of the push mechanism and be rotated to be separated from the guide rail at the time of a drawn-out operation of the push mechanism.
    Type: Grant
    Filed: August 20, 2018
    Date of Patent: May 19, 2020
    Assignees: Hyundai Motor Company, Kia Motors Corp
    Inventors: Jang Hyun Cho, Won Jong Lee, Hee Cheol Kim, Dong Hwan Kim, Dong Ha Lee
  • Patent number: 10578310
    Abstract: A cooking apparatus includes a body, an input unit configured to receive a command in relation to controlling the cooking apparatus from a user, a knob configured to be attachable to one surface of the body or detachable from the body, and a controller configured to sense whether the knob is attached to the body, to receive the command via the knob when the knob is attached, and to receive the command from the input unit when the knob is not attached. As is apparent from the above description, the cooking apparatus may be controlled according to a user's preferences by using the knob attachable to and detachable from the body of the cooking apparatus and may be more conveniently controlled by using the knob in several sides of the cooking apparatus rather than a limited space.
    Type: Grant
    Filed: September 1, 2017
    Date of Patent: March 3, 2020
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Young Woong Joo, Bon Ju Koo, Hee Cheol Kim, Myoung Jin Ham, Hong-Joo Kang
  • Publication number: 20190378807
    Abstract: The present invention relates to a semiconductor package and a method of manufacturing the same. In a semiconductor package which electrically connects a semiconductor chip and a printed circuit board using a solder ball, the semiconductor package further includes a thermal buffer layer which is positioned on a semiconductor chip, absorbs and disperse heat generated by the semiconductor chip, increases a distance between the semiconductor chip and a printed circuit board to decrease a deviation of a heat conduction process, and has a thickness ranging from 7.5 to 50% of a diameter of a solder ball.
    Type: Application
    Filed: May 30, 2019
    Publication date: December 12, 2019
    Inventors: Yong Tae KWON, Hee Cheol KIM, Seung Jun MOON, Jini SHIM
  • Patent number: 10504933
    Abstract: The present disclosure relates to an array substrate, a display panel and a display device. The array substrate includes a substrate, data lines, gate lines, and a pixel unit, wherein a pixel electrode and a light shielding portion are disposed in the pixel unit, and for the light shielding portion and the data line corresponding to each other, an orthographic projection on the substrate of the light shielding portion is partially overlapped with an orthographic projection on the substrate of the data line, and wherein a part of each side, that is parallel to the data line, of an orthographic projection on the substrate of the pixel electrode is only overlapped with the orthographic projection on the substrate of the data line, and the other part of the each side is only overlapped with the orthographic projection on the substrate of the light shielding portion.
    Type: Grant
    Filed: March 30, 2018
    Date of Patent: December 10, 2019
    Assignees: BOE TECHNOLOGY GROUP CO., LTD., CHONGQING BOE OPTOELECTRONICS TECHNOLOGY CO., LTD.
    Inventors: Shaoru Li, Hee Cheol Kim
  • Patent number: 10464946
    Abstract: The present invention relates to crystalline forms of N-(3-(2-(4-(4-methylpiperazin-1-yl)phenylamino)thieno[3,2-d]pyrimidin-4-yloxy)phenyl)acrylamide, and pharmaceutical compositions containing the same. The crystalline forms can be easily used for the preparation of a pharmaceutical composition containing the same as an active ingredient.
    Type: Grant
    Filed: December 30, 2016
    Date of Patent: November 5, 2019
    Assignee: HANMI PHARM. CO., LTD.
    Inventors: Jae Hyuk Jung, Jong Ouk Baek, Sun Young Jung, Eun Joo Kwak, Hee Cheol Kim, Tae Hee Ha
  • Patent number: D887952
    Type: Grant
    Filed: May 9, 2018
    Date of Patent: June 23, 2020
    Assignees: Hyundai Motor Company, Kia Motors Corporation
    Inventors: Jang Hyun Cho, Hee Cheol Kim, Chang Mo Seong