Abstract: The present invention relates to a solid electrolytic capacitor and a production method thereof. A solid electrolytic capacitor of the present invention includes: a capacitor element having an anode wire inserted in one side surface thereof; a cathode terminal disposed on one side under the capacitor element to be electrically connected to the capacitor element; an anode terminal disposed on the other side under the capacitor element and having a bending portion integrally formed to be inclined to the capacitor element for electrical connection with the anode wire; and a molding portion surrounding the outside of the capacitor element and formed to expose lower surfaces of the cathode terminal and the anode terminal.

Abstract: A tantalum capacitor may include: a capacitor body containing a tantalum powder and having a tantalum wire exposed to one end surface thereof; a positive electrode lead frame including a positive electrode terminal part, a vertical support part vertically extended from one leading edge of the positive electrode terminal part, and a positive electrode connection part extended from the vertical support part toward the positive electrode terminal part and connected to the tantalum wire; a negative electrode lead frame having the capacitor body mounted on an upper surface thereof; and a molding part formed to allow a lower surface of the positive electrode terminal part of the positive electrode lead frame and a lower surface of the negative electrode lead frame to be exposed, while enclosing the capacitor body.

Abstract: There is provided a tantalum capacitor including: a capacitor body containing tantalum powder and having a tantalum wire exposed to one end thereof; a positive electrode lead frame including a positive electrode terminal part and a positive electrode connection part formed by upwardly bending a portion of the positive electrode terminal part from the outside toward the inside and connected to the tantalum wire; a negative electrode lead frame having the capacitor body mounted thereon; and a molded part formed to enclose the capacitor body while exposing a lower surface of the positive electrode terminal part of the positive electrode lead frame and a lower surface of the negative electrode lead frame.

Abstract: A tantalum capacitor may include: a capacitor body containing a tantalum powder and having a tantalum wire exposed to one end surface thereof; a positive electrode lead frame including a positive electrode terminal part, a vertical support part vertically extended from one leading edge of the positive electrode terminal part, and a positive electrode connection part extended from the vertical support part toward the positive electrode terminal part and connected to the tantalum wire; a negative electrode lead frame having the capacitor body mounted on an upper surface thereof; and a molding part formed to allow a lower surface of the positive electrode terminal part of the positive electrode lead frame and a lower surface of the negative electrode lead frame to be exposed, while enclosing the capacitor body.

Abstract: There is provided a tantalum capacitor including: a capacitor body containing tantalum powder and having a tantalum wire exposed to one end thereof; a positive electrode lead frame including a positive electrode terminal part and a positive electrode connection part formed by upwardly bending a portion of the positive electrode terminal part from the outside toward the inside and connected to the tantalum wire; a negative electrode lead frame having the capacitor body mounted thereon; and a molded part formed to enclose the capacitor body while exposing a lower surface of the positive electrode terminal part of the positive electrode lead frame and a lower surface of the negative electrode lead frame.

Abstract: A solid electrolytic capacitor of the present invention includes: a capacitor element having an anode wire inserted in one side surface thereof; a cathode terminal disposed on one side under the capacitor element to be electrically connected to the capacitor element; an anode terminal disposed on the other side under the capacitor element and having a bending portion integrally formed to be inclined to the capacitor element for electrical connection with the anode wire; and a molding portion surrounding the outside of the capacitor element and formed to expose lower surfaces of the cathode terminal and the anode terminal.

Abstract: Disclosed herein is a tantalum capacitor capable of improving equivalent series resistance (ESR) characteristic by increasing the bond between a tantalum wire and a tantalum powder. The tantalum capacitor according to the present invention includes: a tantalum wire; a tantalum powder having embedded a front end of the tantalum wire and then being sintered; and a rough part formed on a surface of the tantalum wire so as to strengthen a bond between the tantalum wire and the tantalum powder.

Abstract: A chip capacitor which can be miniaturized with structural stability. In the chip capacitor, a capacitor device has a cathode layer formed on an outer surface thereof and an anode wire is protruded from a portion thereof. A cathode lead is electrically connected to the cathode layer. An anode lead is electrically connected to the anode wire through a weld reinforcement. A molding is configured to cover the capacitor device in such a way that the cathode and anode leads are only partially exposed. Protrusions are protruded from outer surfaces of the cathode and anode leads, respectively, thereby forming steps on the outer surfaces thereof. In the chip capacitor, the leads and molding are bonded with much greater strength, thus more structurally robust. Also, this prevents external moisture from penetrating inside the chip capacitor, thereby significantly enhancing moisture resistance.