Abstract: A system for controlling exit of saved data from a security zone, comprising an access control device, the access control device comprising an access detection module for detecting access of an application to a security zone and access of an application to a general zone, a target checking module for comparing the application, detected by the access detection module, with a list and then controlling access of the application to the security zone and access of the application to the general zone, and a processing control module for controlling writing of data of the application to the general zone.

Abstract: A system for controlling exit of saved data from a security zone, comprising an access control device, the access control device comprising an access detection module for detecting access of an application to a security zone and access of an application to a general zone, a target checking module for comparing the application, detected by the access detection module, with a list and then controlling access of the application to the security zone and access of the application to the general zone, and a processing control module for controlling writing of data of the application to the general zone.

Abstract: An application-based access control system is disclosed. The access control system includes a Virtual space of a hard disk in a file form; a VSD drive for processing security-sensitive access control module 50 files within the VSD image file module; an encryption and decryption module for encrypting and decrypting data input/output between the VSD image file module and the VSD drive; a VSD file system module for allowing an operating system to recognize a separate disk volume at a time of access to the security-sensitive files within the VSD image file module; and an access control module for determining access by determining whether an access location is a disk drive or the VSD drive and the application module has been authorized to access a certain file at a time of access to the file, which is stored on the hard disk, to perform tasks in the application module.

Abstract: A lead on chip package comprising a semiconductor chip having a plurality of bonding pads and a plurality of minute protrusions formed at both side portions of the upper surface thereof, an insulating film made of a fluoroethylene film having knurled surfaces, and a plurality of inner leads each directly connected to each corresponding bonding pad of the semiconductor chip and provided with knurled surfaces. The formation of minute protrusions is accomplished by using a radio frequency (RF)-sputtering process at a low temperature. The formation of the knurled surfaces at the inner leads can be accomplished by passing the inner leads between rollers each having a knurled outer surface or by coating a nodule or dendrite layer over the surfaces of inner leads by an electro-plating using a high current density. Using the fluoroethylene film, the insulating film can reduce in thickness. By virtue of the knurled surfaces formed at the inner leads and the insulating film, the adhesion can be improved.