Patents by Inventor Hee Hyuk LEE

Hee Hyuk LEE has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11978883
    Abstract: Provided is a fabrication method of an electrode for a secondary battery including coating an electrode slurry containing an electrode active material and a binder on a current collector; drying the current collector on which the electrode slurry is coated to form an electrode active material layer; and surface-treating the electrode active material layer formed on the current collector to remove a binder layer on a surface of the electrode active material layer.
    Type: Grant
    Filed: December 15, 2021
    Date of Patent: May 7, 2024
    Assignee: SK On Co., Ltd.
    Inventors: Jong Hyuk Lee, Mi Ryeong Lee, Hee Gyoung Kang
  • Patent number: 11956411
    Abstract: An image signal processor includes a register and a disparity correction unit. The register stores disparity data obtained from a pattern image data that an image senor generates, and the image sensor includes a plurality of pixels, and each of the pixel includes at least a first photoelectric conversion element and a second photoelectric conversion element. The image sensor generates the pattern image data in response to a pattern image located at a first distance from the image sensor. The disparity correction unit corrects a disparity distortion of an image data based on the disparity data to generate a result image data, and the image senor generates the image data by capturing an object.
    Type: Grant
    Filed: September 28, 2022
    Date of Patent: April 9, 2024
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Hee Kang, Young-Jun Song, Dong-Ki Min, Jong-Min You, Jee-Hong Lee, Seok-Jae Kang, Taek-Sun Kim, Joon-Hyuk Im
  • Publication number: 20230368951
    Abstract: A soft magnetic powder composition for an inductor core comprises 60 to 80 wt % Fe—Ni alloy powder, 5 to 25 wt % Fe—Si alloy powder, and 10 to 30 wt % Fe—Si—Al alloy powder based on a total alloy powder and a method of manufacturing the inductor uses the soft magnetic powder composition.
    Type: Application
    Filed: December 14, 2022
    Publication date: November 16, 2023
    Applicants: HYUNDAI MOBIS CO., LTD., ELECTRO M CO.,LTD.
    Inventors: Deuk Kyu HWANG, Hee Hyuk LEE, Kee Yang LEE, Suk Yi KANG, Tae Hyun KIM