Patents by Inventor Hee Hyun Lee

Hee Hyun Lee has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20090143037
    Abstract: A receiver apparatus for tracking and rejecting a Transmit (Tx) signal in a wireless communication system and an operation method thereof are provided. The receiver apparatus includes a controller for receiving channel frequency information of the Tx signal and for controlling an operation for tracking and rejecting a frequency of the Tx signal; a phase locked loop for generating an oscillation frequency by generating a control voltage according to the channel frequency information of the Tx signal under the control of the controller and for filtering a signal corresponding to the oscillation frequency among signals input to a low noise amplifier; and the low noise amplifier for amplifying power while minimizing noise of a signal filtered by the phase locked loop.
    Type: Application
    Filed: December 2, 2008
    Publication date: June 4, 2009
    Inventors: Hee-Hyun Lee, Hoon-Tae Kim, Jong-Won Choi
  • Publication number: 20090075623
    Abstract: A low-noise amplification apparatus and method in a receiver in a wireless communication system are provided, in which a main amplifier amplifies a received signal, a sub-amplifier amplifies a third-order harmonic component more strongly than a signal component in the received signal and cancels the third-order harmonic component by combining the amplified signal with the signal received from the main amplifier. A noise eliminator amplifies noise included in the received signal and eliminates the noise by combining the amplified noise with the signal received from the main amplifier or the signal received from the sub-amplifier.
    Type: Application
    Filed: September 18, 2008
    Publication date: March 19, 2009
    Inventors: Hee-Hyun LEE, Hoon-Tae Kim
  • Publication number: 20080248205
    Abstract: The invention provides a method to form a pattern of functional material on a substrate for use in electronic devices and components. The method uses a stamp having a relief structure to transfer a mask material to a substrate and form a pattern of open area on the substrate. The functional material is applied to the substrate in at least the open area. Contact of an adhesive material to an exterior surface opposite the substrate and separation of the adhesive from the substrate forms the pattern of functional material on the substrate. The method is suitable for the fabrication of microcircuitry for electronic devices and components.
    Type: Application
    Filed: April 5, 2007
    Publication date: October 9, 2008
    Inventors: Graciela Beatriz Blanchet, Hee Hyun Lee
  • Publication number: 20080233489
    Abstract: The invention provides a method to form a pattern of functional material on a substrate. The method uses an elastomeric stamp having a relief structure with a raised surface and having a modulus of elasticity of at least 10 MegaPascal. A surface modifying material is applied to the relief structure and forms a layer at least on the raised surface. A composition of the functional material and a liquid is applied to the layer of the surface modifying material on the relief structure and the liquid is removed to form a film. The elastomeric stamp transfers the functional material from the raised surface to the substrate to form a pattern of the functional material on the substrate. The method is suitable for the fabrication of microcircuitry for electronic devices and components.
    Type: Application
    Filed: March 22, 2007
    Publication date: September 25, 2008
    Inventors: Graciela Beatriz Blanchet, Hee Hyun Lee, Gary Delmar Jaycox
  • Publication number: 20080233280
    Abstract: The invention provides a method to form a pattern of functional material on a substrate. The method uses an elastomeric stamp having a relief structure with a raised surface and having a modulus of elasticity of at least 10 MegaPascal. At least the raised surface of the stamp is treated by exposing the stamp to heat, radiation, electrons, a stream of charged gas, chemical fluids, chemical vapors, and combinations thereof, to enhance wettability of the surface. A composition of the functional material and a liquid is applied to the relief structure and the liquid is removed to form a film on the raised surface. The elastomeric stamp transfers the functional material from the raised surface to the substrate to form a pattern of the functional material on the substrate. The method is suitable for the fabrication of microcircuitry for electronic devices and components.
    Type: Application
    Filed: March 22, 2007
    Publication date: September 25, 2008
    Inventors: Graciela Beatriz Blanchet, Hee Hyun Lee, Gary Delmar Jaycox
  • Publication number: 20080083484
    Abstract: The invention provides a method to form a pattern of a functional material on a substrate. The method uses an elastomeric stamp having a relief structure with a raised surface and having a modulus of elasticity of at least 10 MegaPascal. A liquid composition of the functional material and a liquid is applied to the relief structure and the liquid is removed to form a film on the raised surface. The elastomeric stamp transfers the functional material from the raised surface to the substrate to form a pattern of the functional material on the substrate. The method is suitable for the fabrication of microcircuitry for electronic devices and components.
    Type: Application
    Filed: September 28, 2006
    Publication date: April 10, 2008
    Inventors: Graciela Beatriz Blanchet, Hee Hyun Lee, Gary Delmar Jaycox
  • Publication number: 20080047930
    Abstract: The invention provides a method to form a pattern of a functional material on a substrate for use in electronic devices and components. The method uses a stamp having a relief structure to transfer a mask material to a substrate and form a pattern of open area on the substrate. The functional material is applied to the substrate in at least the open area. The mask material is removed from the substrate, forming the pattern of functional material on the substrate. The method is suitable for the fabrication of microcircuitry for electronic devices and components.
    Type: Application
    Filed: August 23, 2006
    Publication date: February 28, 2008
    Inventors: Graciela Beatriz Blanchet, Hee Hyun Lee
  • Publication number: 20080000373
    Abstract: The invention pertains to a printing form precursor and a method for preparing a stamp from the precursor for use in soft lithographic applications. The printing form precursor includes a composition layer of a fluorinated compound capable of polymerization upon exposure to actinic radiation and a flexible support transparent to the actinic radiation adjacent the composition layer.
    Type: Application
    Filed: June 30, 2006
    Publication date: January 3, 2008
    Inventors: Maria Petrucci-Samija, Graciela Beatriz Blanchet, Robert Blomquist, Hee Hyun Lee