Abstract: An integrated circuit layout includes: a first chip area; and a second chip area, wherein the first chip area includes: a first main area including a first main pattern; a first mark area adjacent to the first main area, wherein a first mark pattern is formed in the first mark area; and a first dummy area including a first dummy pattern, wherein the second chip area includes: a second main area including a second main pattern; a second mark area adjacent to the second main area, wherein a second mark pattern is formed in the second mark area; and a second dummy area including a second dummy pattern, wherein the first and second mark patterns are used to check alignment states of the first chip area and the second chip area, respectively, and wherein each of the first and second mark patterns has a standard cell structure.

Abstract: A display device includes first data lines including first color data lines connected to first sub-pixels, second color data lines connected to second sub-pixels, and third color data lines connected to third sub-pixels, and fan out lines including first fan out lines, second fan out lines alternately arranged with the first fan out lines in a peripheral region, and third fan out lines, a data driver outputting data voltages to the first fan out lines and the second fan out lines connected to the first data lines in a first arrangement according to the first arrangement, and output the data voltages to the third fan out lines connected to the first data lines in a second arrangement according to the second arrangement, and a timing controller remapping input image data based on the first arrangement.

Abstract: Provided are a method and server for providing a content list. The method and server for providing a content list includes: providing source content to a chat room, receiving a request for providing a content list related to the source content from a first terminal of a first member; providing at least one of a first content list including at least one keyword-related content selected from among the entire contents stored in the server based on a keyword of the source content and a second content list including at least one group-related content belonging to the same group as a group of the source content among the entire contents, receiving information on selection content selected by the first member among the contents included in the at least one content list, from the first terminal, and providing the selection content to the chat room.

Abstract: A novel compound for a light emitting device, and an organic light emitting device containing the same are disclosed.

Abstract: The present invention provides a novel Lactobacillus sp. strain, which has high antibacterial activity against various pathogenic bacteria, including bacteria associated with fish diseases and dental cavities, inhibits the production of melanin and promotes the synthesis of collagen, and thus can be utilized as a material for a variety of foods and medicines, and the use thereof.

Abstract: A novel compound for a capping layer, and an organic light-emitting device containing the same are disclosed.

Abstract: Disclosed are a method and apparatus for estimating lithofacies by learning well logs. The method includes a model formation step of forming lithofacies estimation model to output lithofacies corresponding to measured depth when the well logs are input based on train data sets including train data having values of multiple factors included in the well logs, the values being arranged corresponding to measured depth, and label data having lithofacies corresponding to measured depth as answers, and lithofacies estimation step of inputting unseen data having values of multiple factors included in well logs acquired from a well at which lithofacies are to be estimated, the values being arranged corresponding to measured depth, to the lithofacies estimation model to estimate lithofacies corresponding to measured depth.

Abstract: Disclosed is a semiconductor package comprising first and second semiconductor structures spaced apart on a first substrate, a heat sink covering the first and second semiconductor structure and the first substrate, and a thermal interface material layer between the heat sink and the first and second semiconductor structures. The first semiconductor structure includes a first sidewall adjacent to the second semiconductor structure and a second sidewall opposite the first sidewall. The thermal interface material layer includes a first segment between the first and second semiconductor structures and a second segment protruding beyond the second sidewall. A first distance from a top surface of the first substrate to a lowest point of a bottom surface of the first segment is less than a second distance from the top surface of the first substrate to a lowest point of a bottom surface of the second segment.

Abstract: The present invention relates to a catalyst composition including an oxonium ion-based catalyst and an aluminum-based cocatalyst, and a method for preparing an isobutene-based polymer using the same.

Abstract: The present invention relates to a catalyst composition including an imidazolinium ion-based catalyst and an aluminum-based cocatalyst, and a method for preparing an isobutene-isoprene copolymer using the same.

Abstract: The present invention relates to a method for preparing a liquid rubber, and relates to a method for preparing a liquid rubber, including performing polymerization reaction of a conjugated diene-based monomer in the presence of an organic solvent and a catalyst composition (S10), wherein the catalyst composition includes a catalyst including a compound represented by the following Formula 1, and a liquid rubber prepared therefrom: wherein R, R1 to R4, and o, p, q and r are described herein.

Abstract: The present invention relates to a catalyst composition including an oxonium ion-based catalyst and an aluminum-based cocatalyst, and a method for preparing an isobutene-based polymer using the same.

Abstract: The present invention relates to a catalyst composition including an oxonium ion-based catalyst represented by the following Formula 1, and an additive, and a method for preparing polyisobutene using the same: wherein R, R1 to R4, and o, p, q and r are described herein.

Abstract: Disclosed is a semiconductor package comprising first and second semiconductor structures spaced apart on a first substrate, a heat sink covering the first and second semiconductor structure and the first substrate, and a thermal interface material layer between the heat sink and the first and second semiconductor structures. The first semiconductor structure includes a first sidewall adjacent to the second semiconductor structure and a second sidewall opposite the first sidewall. The thermal interface material layer includes a first segment between the first and second semiconductor structures and a second segment protruding beyond the second sidewall. A first distance from a top surface of the first substrate to a lowest point of a bottom surface of the first segment is less than a second distance from the top surface of the first substrate to a lowest point of a bottom surface of the second segment.

Abstract: Disclosed is a semiconductor package comprising first and second semiconductor structures spaced apart on a first substrate, a heat sink covering the first and second semiconductor structure and the first substrate, and a thermal interface material layer between the heat sink and the first and second semiconductor structures. The first semiconductor structure includes a first sidewall adjacent to the second semiconductor structure and a second sidewall opposite the first sidewall. The thermal interface material layer includes a first segment between the first and second semiconductor structures and a second segment protruding beyond the second sidewall. A first distance from a top surface of the first substrate to a lowest point of a bottom surface of the first segment is less than a second distance from the top surface of the first substrate to a lowest point of a bottom surface of the second segment.

Abstract: Provided are an apparatus for managing customer information, a method for managing customer information, a system for managing customer information, and a non-transitory computer readable storage medium having a computer program recorded thereon. That is, customer identification information may be transmitted to a customer managing apparatus through a customer identification information receiving apparatus positioned in the store. The customer managing apparatus may transmit customer management information corresponding to the customer identification information to a store managing apparatus in the store and user equipment of a clerk. The customer may be managed in the store based on the customer management information. Therefore, it is possible to indirectly acquire customer information from the customer and properly provide required information to the customer.

Abstract: An optical sheet module consisting of optical sheets having different thicknesses, includes: a first base film having a predetermined thickness and transmitting light from a lower portion thereof through an upper portion thereof; an upper optical sheet formed on the first base film and having a first structural pattern in which the upper optical sheet protrudes upwardly and the cross-sectional area thereof decreases when progressing toward an upper portion thereof; a second based film laminated beneath the upper optical sheet so as to transmit light from a lower portion thereof to the upper optical sheet; and a lower optical sheet formed on the second base film and having a second structural pattern in which the lower optical sheet protrudes toward the upper optical sheet and the cross-sectional area thereof decreases when progressing toward an upper portion thereof. The first base film is relatively thicker than the second base film.

Abstract: Disclosed is a semiconductor package comprising first and second semiconductor structures spaced apart on a first substrate, a heat sink covering the first and second semiconductor structure and the first substrate, and a thermal interface material layer between the heat sink and the first and second semiconductor structures. The first semiconductor structure includes a first sidewall adjacent to the second semiconductor structure and a second sidewall opposite the first sidewall. The thermal interface material layer includes a first segment between the first and second semiconductor structures and a second segment protruding beyond the second sidewall. A first distance from a top surface of the first substrate to a lowest point of a bottom surface of the first segment is less than a second distance from the top surface of the first substrate to a lowest point of a bottom surface of the second segment.

Abstract: Disclosed herein are compounds, compositions and methods for the treatment of a disease or disorder related to activation of deacetylase enzymes. The compounds and methods are related to boronic acid derivatives of resveratrol. In some forms, the compound, compositions and methods relate to treatment of prostate cancer, colon cancer, or breast cancer, a cardiovascular disease, inflammation, obesity, diabetes, or a neurodegenerative disease.

Abstract: A stacking-type optical sheet module includes an upper optical sheet having a first structural pattern with first unit light-condensing bodies successively repeated and cross-sectional areas gradually decreasing towards the top. A lower optical sheet has a second structural pattern and is below the upper optical sheet in a stack. Second and third unit light-condensing bodies are successively disposed in the second structural pattern. The second unit bodies have a gradually decreasing cross-sectional area toward the top and are joined with the upper optical sheet, and the third unit bodies have a gradually decreasing cross-sectional area toward the top, a vertical distance from a lowest to a highest portion thereof being relatively shorter than a corresponding vertical distance of the second unit bodies. A vertical angle of the highest portion of the second unit bodies is relatively smaller than a vertical angle of the highest portion of the third unit bodies.