Abstract: A wafer stacked semiconductor package (WSP) having a vertical heat emission path and a method of fabricating the same are provided. The WSP comprises a substrate on which semiconductor chips are mounted; a plurality of semiconductor chips stacked vertically on the substrate; a cooling through-hole formed vertically in the plurality of semiconductor chips, and sealed; micro holes formed on the circumference of the cooling through-hole; and coolant filling the inside of the cooling through-hole. Accordingly, the WSP reduces a temperature difference between the semiconductor chips and quickly dissipates the heat generated by the stacked semiconductor chips.

Abstract: An apparatus and method are provided for setting a printing option using a preview image. Setting the printing option includes an image preview unit displaying a preview image corresponding to printing data and enabling the preview image to be manipulated for setting a printing setting, a control unit controlling printing of the preview image according to the printing setting of the manipulated preview image, and a printing option setting unit setting a printing option, wherein the control unit applies the printing setting of the preview image to the printing option of the printing option setting unit.

Abstract: An apparatus and method are provided for setting a printing option using a preview image. Setting the printing option includes an image preview unit displaying a preview image corresponding to printing data and enabling the preview image to be manipulated for setting a printing setting, a control unit controlling printing of the preview image according to the printing setting of the manipulated preview image, and a printing option setting unit setting a printing option, wherein the control unit applies the printing setting of the preview image to the printing option of the printing option setting unit.

Abstract: The present invention relates to a novel cyclic olefin compound, a polymer including the cyclic olefin compound, a liquid crystal alignment film including the polymer, and a liquid crystal display device including the liquid crystal alignment film. Since the polymer includes the cyclic olefin compound as a main chain, the thermal stability is excellent and the photoreactive speed is high. Accordingly, the production time can be reduced, the production cost can be reduced, and the anchoring force of the liquid crystal can be increased because the alignment property is stabilized due to the curing.

Abstract: The present invention relates to particulate tin powder and a manufacturing method thereof. More particularly, the present invention relates to a method of manufacturing particulate tin powder including i) preparing tin salt solution, ii) adding chelating agents to the tin salt solution, iii) adjusting pH of the tin salt solution to which the chelating agents are added, and iv) reductively depositing tin powder by adding reductant to the tin salt solution.

Abstract: A semiconductor module includes a semiconductor package generating thermal energy, a heat collecting member transferring thermal energy from the semiconductor package to a heat collection area in the heat collecting member, a heat radiating member transferring thermal energy received from the heat collecting member and package to the outside, and a thermoelectric device transferring thermal energy through the heat collection area to the heat radiating member via the thermoelectric effect. The heat collecting member and heat radiating member may be otherwise insulated so thermal energy is transferred and controlled by the thermoelectric device. The package may be a dynamic random access memory (DRAM), microprocessor, central processing unit (CPU), graphic processing unit (GPU), or flash memory. The heat radiating member may be an external case of a solid state disk (SSD), and the thermoelectric device may be a Peltier cooler controlled through a power line.

Abstract: The present invention relates to a WLAN virtualization system which is capable of efficiently separating a Basic Service Set (BSS) into a plurality of virtual BSSs in a Time Division Multiplexing (TDM) manner. The WLAN virtualization system includes an Access Point (AP) for providing a plurality of vBSSs, and a plurality of stations corresponding to the vBSSs provided by the AP. Each of the vBSSs is operated on a superframe basis, the superframe being scheduled by a beacon frame transmitted from the AP. The superframe includes the beacon frame, one contention-free period, and one contention period. The CPs of the vBSSs include intervals which do not overlap each other. The vBSSs can be classified into any groups designated by a service provider based on certain criteria such as physical layer, QoS, security level, or network access authority, and times can be allocated to superframes at different rates or frequencies.

Abstract: Provided is a semiconductor memory module allowing a filling member formed between a module substrate and memory chips mounted on the module substrate to completely fill the space between the module substrate and the memory chips. According to embodiments of the present invention, the semiconductor memory module includes a module substrate having at least one memory chip mounted on the substrate such that its edges are oblique to major and minor axes bisecting the module substrate. The oblique orientation allows for an improved opening between memory chips formed on the substrate so that the filling member may be properly formed between the module substrate and the memory chips to prevent voids where the filling member is not formed.

Abstract: A light emitting device with improved heat dissipation is provided. The light emitting device includes a first lead frame, a second lead frame, a light emitting element and a housing. The first lead frame includes a light emitting element mounting portion, a first heat dissipation portion extending from the light emitting element mounting portion in a first direction, and second and third heat dissipation portions extending from the light emitting element mounting portion in a second direction opposite to the first direction. The second lead frame extends in the second direction and is disposed between and spaced apart from the second and third heat dissipation portions. The light emitting element is mounted on the light emitting element mounting portion and is electrically coupled to the first and second lead frames. The housing encapsulates the first and second lead frames.

Abstract: Provided is a prokaryotic expansin protein capable of expanding cellulose. The prokaryotic expansin protein performs the same function as existing plant expansin proteins. The prokaryotic expansin protein can be produced at greatly reduced cost on an industrial scale, unlike plant expansin proteins. Particularly, when lignocellulosic biomass is hydrolyzed into glucose using the prokaryotic expansin protein and cellulase, the hydrolysis rate of cellulose can be markedly increased by the cellulase, resulting in improved yield of the glucose. In actuality, the use of the prokaryotic expansin enables the production of bioenergy at low cost with a reduced amount of enzyme used. The prokaryotic expansin protein softens the textures of pulp, cotton fibers (e.g., jeans), etc. Therefore, the prokaryotic expansin protein can be used for various purposes, such as biopulping and biostoning.

Abstract: An optical component includes a lens holder including a first electrode, an insulating structure formed on the first electrode and having a through hole provided as an optical path, and at least one second electrode formed inside the insulating structure to encompass the through hole, and at least one microlens located in the through hole and formed of transparent resin.

Abstract: A cooling apparatus for a circuit module having a substrate extending axially with an IC chip of a first type and IC chips of a second type mounted thereon, comprising: a first heat spreading element disposed to form a heat conduction path with the IC chip of the first type; and a second heat spreading element disposed to form a heat conduction path with the IC chips of the second type, wherein there is at least one IC chip of the second type mounted axially away from opposite sides of the IC chip of the first type, wherein the first type of IC chip is capable of generating a larger amount of heat than the second type of IC chips, and the first heat spreading element has a higher thermal conductivity than the second heat spreading element.

Abstract: The present invention relates to a novel cyclic olefin compound, a polymer including the cyclic olefin compound, a liquid crystal alignment film including the polymer, and a liquid crystal display device including the liquid crystal alignment film. Since the polymer includes the cyclic olefin compound as a main chain, the thermal stability is excellent and the photoreactive speed is high. Accordingly, the production time can be reduced, the production cost can be reduced, and the anchoring force of the liquid crystal can be increased because the alignment property is stabilized due to the curing.

Abstract: A wafer stacked semiconductor package (WSP) having a vertical heat emission path and a method of fabricating the same are provided. The WSP comprises a substrate on which semiconductor chips are mounted; a plurality of semiconductor chips stacked vertically on the substrate; a cooling through-hole formed vertically in the plurality of semiconductor chips, and sealed; micro holes formed on the circumference of the cooling through-hole; and coolant filling the inside of the cooling through-hole. Accordingly, the WSP reduces a temperature difference between the semiconductor chips and quickly dissipates the heat generated by the stacked semiconductor chips.

Abstract: A wafer stacked semiconductor package (WSP) having a vertical heat emission path and a method of fabricating the same are provided. The WSP comprises a substrate on which semiconductor chips are mounted; a plurality of semiconductor chips stacked vertically on the substrate; a cooling through-hole formed vertically in the plurality of semiconductor chips, and sealed; micro holes formed on the circumference of the cooling through-hole; and a coolant filling the inside of the cooling through-hole. Accordingly, the WSP reduces a temperature difference between the semiconductor chips and quickly dissipates the heat generated by the stacked semiconductor chips.

Abstract: Provided are a heat sink and a heat sink semiconductor module assembly which may include an improved, cooling function. Each of the heat sinks may include a flat heat sink base having a first surface attached to semiconductor devices and a second surface externally exposed; first fins provided on a portion of the second surface of the heat sink base to which no clip is coupled; and second fins provided on portions of the second surface of the heat sink base to which a clip may be coupled. The semiconductor module assembly may secure the heat sinks to both surfaces of a semiconductor module using the clip. Accordingly, air may flow smoothly through the second fins on the portions to which the clip may be coupled, thereby improving the cooling function of the heat sinks.

Abstract: A host device to install a printer driver and a method thereof. The host device includes a storage unit to store option information set in previously installed printer driver, and a central processing unit to read the option information when a new printer driver is installed and setting the read option information as option information of the new printer driver. Accordingly, when installing the new printer driver, the user does not need to separately set the option information of the new printer driver, to thus enhance the convenience of a user.

Abstract: There is provided an optical component. An optical component according to an aspect of the invention includes a lens holder including a first electrode, an insulating structure formed on the first electrode and having a through hole provided as an optical path, and at least one second electrode formed inside the insulating structure to encompass the through hole, and at least one microlens located in the through hole and formed of transparent resin.

Abstract: Provided is a semiconductor plating system for plating a semiconductor object with a desired layer. The semiconductor plating system include a plating tank configured to accommodate a plating solution for use in plating the semiconductor object, and a plating solution induction device configured to induce the plating solution to spirally flow toward the semiconductor object.

Abstract: A wafer stacked semiconductor package (WSP) having a vertical heat emission path and a method of fabricating the same are provided. The WSP comprises a substrate on which semiconductor chips are mounted; a plurality of semiconductor chips stacked vertically on the substrate; a cooling through-hole formed vertically in the plurality of semiconductor chips, and sealed; micro holes formed on the circumference of the cooling through-hole; and a coolant filling the inside of the cooling through-hole. Accordingly, the WSP reduces a temperature difference between the semiconductor chips and quickly dissipates the heat generated by the stacked semiconductor chips.