Patents by Inventor Hee-Joon Chun

Hee-Joon Chun has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 12101880
    Abstract: A printed circuit board includes: a first insulating layer; a first metal layer disposed on one surface of the first insulating layer; a second metal layer disposed on the other surface facing the one surface of the first insulating layer; a via penetrating through the first insulating layer to connect the first and second metal layers to each other; and a heterogeneous metal region disposed in at least one of an area in which the via is adjacent to the first insulating layer and an area in which the via is adjacent to the first metal layer, and including a material different from that of the via, wherein the heterogeneous metal region includes at least one of nickel (Ni), silicon (Si), and titanium (Ti).
    Type: Grant
    Filed: March 7, 2022
    Date of Patent: September 24, 2024
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Hee-Joon Chun, Jae Sung Sim, Hak Young Lee, Kwang Hee Kwon, Hee Jung Jung
  • Publication number: 20220408559
    Abstract: A printed circuit board includes: a first insulating layer; a first metal layer disposed on one surface of the first insulating layer; a second metal layer disposed on the other surface facing the one surface of the first insulating layer; a via penetrating through the first insulating layer to connect the first and second metal layers to each other; and a heterogeneous metal region disposed in at least one of an area in which the via is adjacent to the first insulating layer and an area in which the via is adjacent to the first metal layer, and including a material different from that of the via, wherein the heterogeneous metal region includes at least one of nickel (Ni), silicon (Si), and titanium (Ti).
    Type: Application
    Filed: March 7, 2022
    Publication date: December 22, 2022
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Hee-Joon CHUN, Jae Sung SIM, Hak Young LEE, Kwang Hee KWON, Hee Jung JUNG
  • Patent number: 10849226
    Abstract: A printed circuit board includes: an insulating layer having a via hole formed therein; a single layer metal pad disposed in the insulating layer and having a center portion that is exposed by the via hole, the center portion of the pad having a higher roughness than peripheral portions of the pad; and a via formed in the via hole and connected to the center portion of the pad.
    Type: Grant
    Filed: October 25, 2019
    Date of Patent: November 24, 2020
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Mi-Sun Hwang, Hye-Won Jung, Jae-Sung Sim, Byung-Duk Na, Hee-Joon Chun, Sun-A Kim, Deok-Man Kang
  • Patent number: 10779409
    Abstract: A printed circuit board including: an insulating material; a metal layer stacked on a surface of the insulating material; and a via hole passing through the metal layer and the insulating material. The metal layer decreases in thickness in a region adjacent to the via hole, and an interface between the insulating material and the metal layer includes a region that is directed toward the via hole.
    Type: Grant
    Filed: November 5, 2019
    Date of Patent: September 15, 2020
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Byung-Duk Na, Hye-Won Jung, Jae-Sung Sim, Mi-Sun Hwang, Hee-Joon Chun, Deok-Man Kang, Sun-A Kim
  • Publication number: 20200178392
    Abstract: A printed circuit board includes: an insulating layer having a via hole formed therein; a single layer metal pad disposed in the insulating layer and having a center portion that is exposed by the via hole, the center portion of the pad having a higher roughness than peripheral portions of the pad; and a via formed in the via hole and connected to the center portion of the pad.
    Type: Application
    Filed: October 25, 2019
    Publication date: June 4, 2020
    Applicant: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Mi-Sun HWANG, Hye-Won JUNG, Jae-Sung SIM, Byung-Duk NA, Hee-Joon CHUN, Sun-A KIM, Deok-Man KANG
  • Publication number: 20200154568
    Abstract: A printed circuit board including: an insulating material; a metal layer stacked on a surface of the insulating material; and a via hole passing through the metal layer and the insulating material. The metal layer decreases in thickness in a region adjacent to the via hole, and an interface between the insulating material and the metal layer includes a region that is directed toward the via hole.
    Type: Application
    Filed: November 5, 2019
    Publication date: May 14, 2020
    Applicant: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Byung-Duk NA, Hye-Won JUNG, Jae-Sung SIM, Mi-Sun HWANG, Hee-Joon CHUN, Deok-Man KANG, Sun-A KIM
  • Patent number: 8980474
    Abstract: A lithium secondary battery includes a positive electrode, a negative electrode, and an electrolyte. The negative electrode includes a current collector, an active material layer on the current collector and including an amorphous silicon oxide represented by SiOx (0.95<x<1.7), and an SEI layer on the active material layer and including about 70 area % or more of protrusion parts having a size of about 5 nm to 300 nm during charging of the battery.
    Type: Grant
    Filed: March 29, 2012
    Date of Patent: March 17, 2015
    Assignee: Samsung SDI Co., Ltd.
    Inventors: Tae-Gon Kim, Hee-Joon Chun, Joon-Sup Kim, Wan-Uk Choi, Hisaki Tarui, Jea-Woan Lee, Jae-Yul Ryu, Young-Chang Lim, Seung-Hee Park
  • Publication number: 20130052533
    Abstract: In one aspect, a negative active material for a lithium secondary battery including silicon oxide represented by a chemical formula SiOx (1.1<x<1.5) and a negative electrode and a lithium secondary battery including the negative active material is provided. The silicon oxide may be amorphous silicon oxide.
    Type: Application
    Filed: February 8, 2012
    Publication date: February 28, 2013
    Applicant: Samsung SDI Co., Ltd.
    Inventors: Hee-Joon Chun, Tae-Gon Kim, Joon-Sup Kim, Wan-Uk Choi, Tarui Hisaki, Jea-Woan Lee, Jae-Yul Ryu, Chang-Keun Back, Young-Chang Lim, Seung-Hee Park
  • Publication number: 20130052508
    Abstract: A lithium secondary battery includes a positive electrode, a negative electrode, and an electrolyte. The negative electrode includes a current collector, an active material layer on the current collector and including an amorphous silicon oxide represented by SiOx (0.95<x<1.7), and an SEI layer on the active material layer and including about 70 area % or more of protrusion parts having a size of about 5 nm to 300 nm during charging of the battery.
    Type: Application
    Filed: March 29, 2012
    Publication date: February 28, 2013
    Inventors: Tae-Gon Kim, Hee-Joon Chun, Joon-Sup Kim, Wan-Uk Choi, Hisaki Tarui, Jea-Woan Lee, Jae-Yul Ryu, Young-Chang Lim, Seung-Hee Park
  • Publication number: 20130045419
    Abstract: Provided are a negative active material for a rechargeable lithium battery, which includes a first silicon oxide (SiOx) and a second silicon oxide (SiOx) with a particle diameter differing from the one of the first silicon oxide (SiOx), a negative electrode including the negative active material, and a method of manufacturing the negative electrode, and a rechargeable lithium battery including the negative electrode. The first silicon oxide (SiOx) and second silicon oxide (SiOx) have a particle distribution peak area ratio ranging from 3 to 8.
    Type: Application
    Filed: December 19, 2011
    Publication date: February 21, 2013
    Inventors: Hee-Joon Chun, Tae-Gon Kim, Joon-Sup Kim, Wan-Uk Choi, Hisaki Tarui, Jea-Woan Lee, Jae-Yul Ryu, Chang-Keun Back, Young-Chang Lim, Seung-Hee Park