Abstract: A display device includes: a substrate; a display element on the substrate; a capping layer on the display element; and a thin film encapsulation layer on the capping layer, wherein the capping layer includes: a first capping layer on the display element; a second capping layer on the first capping layer, the second capping layer having a refractive index greater than that of the first capping layer; and a third capping layer on the second capping layer, the third capping layer having a refractive index smaller than that of the second capping layer, wherein the second capping layer has a thickness of 30 nanometers (nm) to 60 nm.

Abstract: A display apparatus including a display panel, a light source configured to emit light, and a light guide disposed on the light source and covering a side of the light source, the light source including a substrate, a light emitter including a light emitting stacked layer and disposed on the substrate, a light blocking layer disposed on a side surface of the light emitting stacked layer, and a reflector disposed between the substrate and the light guide, in which the light emitter has a first length direction and a second length direction, wherein orientation angles of the light emitter in the first and second length directions are different from each other, the substrate includes a first pad electrode and second pad electrode electrically connected to the light emitter, and the first and second pad electrodes are spaced apart from each other by at least 50 ?m.

Abstract: A ceramic electronic component includes a body, including a dielectric layer and an internal electrode, and an external electrode disposed on the body and connected to the internal electrode. At least a region of the dielectric layer includes tin (Sn) and a lanthanide rare earth element (RE) including dysprosium (Dy). In the at least a region of the dielectric layer, a molar ratio of tin (Sn) to dysprosium (Dy) is from 0.15 to 0.30.

Abstract: The present invention provides an electrode assembly in which a negative electrode coated with a negative electrode active material on a surface of a negative electrode collector, a separator, and a positive electrode coated with a positive electrode active material on a surface of a positive electrode collector are repeatedly laminated, the electrode assembly comprising: monocells in which the positive electrode, the separator, the negative electrode, and the separator are laminated, wherein at least two or more monocells are laminated, wherein, in any one of the monocells, an expansion part extending lengthily to one side is formed on the separators, and the expansion part of the separator surrounds the monocells laminated to be disposed at the outermost layers to fix the laminated monocells.

Abstract: A ceramic electronic component includes: a body including an active portion, including a first dielectric layer and an internal electrode, and a margin portion disposed a side surface of the active portion and including a second dielectric layer; and an external electrode disposed on the body and connected to the internal electrode. The first and second dielectric layers have different dielectric compositions. The first dielectric layer includes tin (Sn) and dysprosium (Dy). The second dielectric layer includes magnesium (Mg).

Abstract: A package board according to an embodiment includes a first core layer having a first surface and a second surface that face each other, a feeding wiring extending on the first surface of the first core layer, a first via structure penetrating through the first core layer, a first connection pad disposed on the second surface of the first core layer to be electrically connected to the feeding wiring through the first via structure, the first connection pad including a head portion in contact with the first via structure and an extension portion protruding from the head portion, and a first connector mounted on the second surface of the first core layer, the first connector including a first terminal electrically connected to the extension portion of the first connection pad.

Abstract: One embodiment of the present invention provides a method of manufacturing an electronic device using a cyclic doping process including i) an operation of forming a unit transfer thin film including a two-dimensional material on a transfer substrate, ii) an operation of doping the unit transfer thin film in a low-damage doping process, iii) an operation of transferring the unit transfer thin film doped according to the operation ii) on a transfer target substrate, and iv) an operation of repeatedly performing the operations i) to iii) several times to reach a target thickness.

Abstract: One embodiment of the present invention provides a method of manufacturing an electronic device using a cyclic doping process including i) an operation of forming a unit transfer thin film including a two-dimensional material on a transfer substrate, ii) an operation of doping the unit transfer thin film in a low-damage doping process, iii) an operation of transferring the unit transfer thin film doped according to the operation ii) on a transfer target substrate, and iv) an operation of repeatedly performing the operations i) to iii) several times to reach a target thickness.

Abstract: The present invention introduces a plasma etching method and apparatus. The plasma etching method may include forming a photoresist pattern on a target etching layer, hardening the surface of the photoresist pattern by exposing to a first plasma generated from a first discharge gas containing a reforming gas including carbon (C) and sulfur (S) and sequentially annealing, and etching the target etching layer with a second plasma generated from a second discharge gas using the surface-hardened photoresist pattern as a mask.

Abstract: The present disclosure relates to a microorganism of the genus Corynebacterium producing L-amino acid, a method for producing L-amino acid using the same, use of L-amino acid production, and a composition for producing L-amino acid.

Abstract: An L-methionine-producing microorganism into which a metZ gene is introduced and a method of producing L-methionine using the same.

Abstract: Embodiments of the present disclosure relate to a storage device based on a daisy chain topology. According to embodiments of the present disclosure, a storage device may include a plurality of memory package chips each including a plurality of memory dies capable of storing data; and a controller communicating with the plurality of memory package chips and connected to the plurality of memory package chips through one or more daisy chain circuits.

Abstract: A dry etching method includes a first step of adsorbing first radicals into a surface of an etching target, wherein the first radicals are contained in first plasma generated from a plasma generator; and a second step of irradiating ion-beams extracted from second plasma generated from the plasma generator onto the surface of the etching target into which the radicals have been adsorbed, thereby desorbing a surface atomic layer of the etching target, wherein the first step is performed such that: a positive potential greater than a potential of the first plasma is applied to one or two selected from first to third grids, while a ground potential is applied to the rest thereof; and a negative potential equal to or lower than a potential of the third grid is applied to a substrate support structure.

Abstract: A method of producing sulfur-containing amino acids or derivatives of the sulfur-containing amino acids.

Abstract: A method of producing sulfur-containing amino acids or derivatives of the sulfur-containing amino acids.

Abstract: The present disclosure relates to a microorganism of the genus Corynebacterium producing a purine nucleotide and a method for producing a purine nucleotide using the same.

Abstract: The present disclosure relates to a microorganism of the genus Corynebacterium producing a purine nucleotide and a method for producing a purine nucleotide using the same.

Abstract: A printed circuit board including: a circuit layer including a plurality of circuit layers; a first structure including a plurality of first unit vias, each first unit via being vertically disposed and formed between successive circuit layers that are vertically adjacent to each other; and a second structure including a plurality of second unit vias, each second unit via being vertically disposed and horizontally spaced apart from a respective first unit via, wherein a horizontal spaced distance between each respective first unit via and the second unit via is a set value or less.

Abstract: Provided is a method of manufacturing a plastic substrate with lower auto-fluorescence and better specificity. The method includes: (a) preparing a plastic substrate having an Atomic Force Microscopic (AFM) surface roughness of Ra<3 nm or Rq<4 nm under the condition of 50 ?m×50 ?m or less; (b) treating the plastic substrate with plasma; and (c) treating the plastic substrate with a surface-modifying monomer. A plastic substrate manufactured by the method is also provided. The plastic substrate exhibits a remarkably low auto-fluorescence and thus better specificity for detection of target biomolecules, which enables the broad application of a plastic substrate, which can be easily designed to include a microfluidic structure relative to a glass substrate but has been limitedly used due to high auto-fluorescence, to microarrays, biochips, or well plates.