Patents by Inventor Hee-jun HAN

Hee-jun HAN has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20250058569
    Abstract: In a method for forming a thick layer of a thickness on a substrate by using an inkjet printing apparatus comprising a head module for ejecting an ink, a dot print layer is formed such that dot-shaped arrays are formed at predetermined intervals in order to prevent ink droplets, which are deposited on the substrate, from pulling each other, ink is ejected in an amount enabling a thick coating of uniform thickness to be overlapped and printed on the dot print layer, thereby forming a thick print layer with the thickness.
    Type: Application
    Filed: October 17, 2022
    Publication date: February 20, 2025
    Inventors: HEE JUN HAN, SEOG SOON KIM, GIL HWAN YEO
  • Patent number: 11718093
    Abstract: An inkjet printing method may includes a dot pattern printing process of printing a dot pattern group by discharging ink at a preset position of a surface of an object using a nozzle group for forming a dot pattern so that dropped droplets are not in overlap with each other, a connection pattern printing process of printing a connection pattern group by discharging ink at a position between neighboring patterns using a nozzle group for forming a connection pattern so that the same attractive force acts to the neighboring patterns dropped on the surface of the object, and a finishing printing process of finishing a coating of the surface of the object by discharging ink to an area except for neighboring dropped droplets using a nozzle group for finishing so that the same attractive force act to the dropped droplets that are dropped on the surface of the object.
    Type: Grant
    Filed: February 10, 2021
    Date of Patent: August 8, 2023
    Assignee: UNIJET CO., LTD.
    Inventors: Seog-soon Kim, Hee-jun Han, Se-hyun Sim, Jong-gyun Lee
  • Publication number: 20230182488
    Abstract: A method for forming a resist fine pattern uses inkjet printing for printing an ink along a path to form a resist fine pattern on a substrate having the same surface energy. The method includes an ejecting step of simultaneously discharging a photocurable resist ink and a partition-forming ink that are spaced from each other on the front side and the rear side of the path and applying the light energy to the discharged photocurable resist ink. The intensity of light is set so that, as the photocurable resist ink is semi-cured and is ejected on the substrate in a gelatinous state, the ink forms a boundary that is vertical with respect to the partition-forming ink ejected on the substrate and the spreading of the photocurable resist ink is prevented, and the photocurable resist ink is cured after both the photocurable resist ink and the partition-forming ink are completely ejected.
    Type: Application
    Filed: February 3, 2021
    Publication date: June 15, 2023
    Inventors: Seog-soon KIM, Jong-gyun LEE, Hee-jun HAN
  • Publication number: 20220402266
    Abstract: An inkjet printing method may includes a dot pattern printing process of printing a dot pattern group by discharging ink at a preset position of a surface of an object using a nozzle group for forming a dot pattern so that dropped droplets are not in overlap with each other, a connection pattern printing process of printing a connection pattern group by discharging ink at a position between neighboring patterns using a nozzle group for forming a connection pattern so that the same attractive force acts to the neighboring patterns dropped on the surface of the object, and a finishing printing process of finishing a coating of the surface of the object by discharging ink to an area except for neighboring dropped droplets using a nozzle group for finishing so that the same attractive force act to the dropped droplets that are dropped on the surface of the object.
    Type: Application
    Filed: February 10, 2021
    Publication date: December 22, 2022
    Inventors: Seog-soon KIM, Hee-jun HAN, Se-hyun SIM, Jong-gyun LEE