Patents by Inventor Hee-Jun Park

Hee-Jun Park has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 12340299
    Abstract: A method for an artificial neural network includes receiving a set of input values to be convolved with multiple kernels via multiple computing units. One or more thermally-stressed computing units of the multiple computing units are determined. The multiple kernels are mapped to the multiple computing units of a system-on-chip (SOC) based on the one or more thermally-stressed computing units. A convolution is performed on the set of input values and a most sparse kernel of the multiple kernels on the most thermally-stressed computing unit.
    Type: Grant
    Filed: March 5, 2021
    Date of Patent: June 24, 2025
    Assignee: QUALCOMM Incorporated
    Inventors: Hee Jun Park, Colin Beaton Verrilli
  • Publication number: 20250190174
    Abstract: Techniques and apparatuses are described for overcoming memory, bandwidth, and/or power constraints in a processing-in-memory architecture. Example techniques include on-the-fly type conversion and/or sparsity support. On-the-fly type conversion converts data of a first numerical data type to a second numerical data type that matches an expected numerical data type of a logic circuit of a memory device. With on-the-fly type conversion, the memory device can conserve memory and realize a higher effective internal bandwidth while having a flexible design that can support a variety of different memory architectures and/or different machine-learned models. With sparsity support, the processing-in-memory can avoid performing operations that involve data having values equal to zero to conserve power. Also, sparsity support can increase an effective bandwidth for transferring data and conserve memory.
    Type: Application
    Filed: December 11, 2024
    Publication date: June 12, 2025
    Applicant: Google LLC
    Inventors: Hongil Yoon, Wenzhi Cui, Sai Srivatsa Bhamidipati, Hee Jun Park
  • Publication number: 20250191642
    Abstract: Techniques and apparatuses are described for overcoming memory, bandwidth, and/or power constraints in a processing-in-memory architecture. In example aspects, a memory device includes a logic circuit that is coupled to at least two banks. The memory device receives commands for concurrently performing at least a portion of a page operation and at least a portion of a processing-in-memory computation. The processing-in-memory computation is performed using the logic circuit and using data that was previously read from one of the active banks. The page operation is performed on another one of the banks that is idle to enable the logic circuit to access the data within this other bank for a later processing-in-memory computation. By performing the page operation during a same time as the processing-in-memory computation, a latency associated with the page operation can be effectively masked, thereby improving an overall efficiency of the memory device.
    Type: Application
    Filed: December 11, 2024
    Publication date: June 12, 2025
    Applicant: Google LLC
    Inventors: Hongil Yoon, Inho Hwang, John Joseph, Wenzhi Cui, Benjamin Youngjae Cho, Hee Jun Park
  • Patent number: 12299969
    Abstract: Systems and techniques are provided for vision perception processing. An example method can include determining an attention demand score or characteristic per region of a frame from a sequence of frames; generating attention votes per region of the frame based on the attention demand score or characteristic per region, the attention votes per region providing attention demands and/or attention requests; determining an attention score or characteristic per region of the frame based on a number of attention votes from one or more computer vision functions; based on the attention score or characteristic per region of the frame, selecting one or more regions of the frame for processing using a neural network; and detecting or tracking one or more objects in the one or more regions of the frame based on processing of the one or more regions using the neural network.
    Type: Grant
    Filed: March 22, 2022
    Date of Patent: May 13, 2025
    Assignee: QUALCOMM Incorporated
    Inventors: Hee Jun Park, Abhinav Goel, Young Hoon Kang
  • Patent number: 12272869
    Abstract: An antenna structure according to an embodiment of the present invention includes a first antenna unit including a first radiator, a first transmission line connected to the first radiator, and a guide pattern disposed around the first transmission line and separated from the first transmission line, a second antenna unit at least partially covered by the guide pattern of the first antenna unit in a plan view, and a dielectric layer interposed between the first antenna unit and the second antenna unit. An antenna structure implementing low-frequency and high-frequency properties with high reliability is provided.
    Type: Grant
    Filed: June 24, 2022
    Date of Patent: April 8, 2025
    Assignee: DONGWOO FINE-CHEM CO., LTD.
    Inventors: Young Ju Kim, Yoon Ho Huh, Hee Jun Park, Young Su Lee, In Kak Song, Dong Pil Park
  • Patent number: 12255414
    Abstract: A package board according to an embodiment of the present disclosure includes a first core layer, a feeding wiring disposed on the first core layer, and a first connector mounted on the first core layer and electrically connected to the feeding wiring through a row directional side thereof. The feeding wiring includes a first portion extending in a column direction of the first core layer and a second portion bent from the first portion to extend in a row direction of the first core layer.
    Type: Grant
    Filed: July 12, 2022
    Date of Patent: March 18, 2025
    Assignee: DONGWOO FINE-CHEM CO., LTD.
    Inventors: Na Yeon Kim, Young Ju Kim, Hee Jun Park, Won Hee Lee
  • Patent number: 12255386
    Abstract: An antenna package according to an embodiment includes antenna units, and a circuit board electrically connected to the antenna units. The circuit board includes a core layer, antenna feeding lines distributed on a surface of the core layer and connected to the antenna units, power/data lines distributed on the surface of the core layer, power/data ports connected to end portions of the power/data lines, and antenna feeding ports connected to end portions of the antenna feeding lines and arranged to be closer to the antenna units than the power/data ports.
    Type: Grant
    Filed: October 26, 2022
    Date of Patent: March 18, 2025
    Assignee: DONGWOO FINE-CHEM CO., LTD.
    Inventors: Byung Jin Choi, Jae Hyun Lee, Hee Jun Park
  • Patent number: 12244059
    Abstract: An antenna device according to an embodiment of the present invention includes a dielectric layer, a first radiator disposed on the dielectric layer in a first direction, a second radiator formed in a shape different from that of the first radiator and disposed on the dielectric layer in a second direction, a first transmission line which extends in the first direction to be connected to the first radiator, and a second transmission line which extends in the second direction to be connected to the second radiator, and intersects the first transmission line with being physically or electrically spaced apart therefrom.
    Type: Grant
    Filed: December 8, 2022
    Date of Patent: March 4, 2025
    Assignees: DONGWOO FINE-CHEM CO., LTD., POSTECH RESEARCH AND BUSINESS DEVELOPMENT FOUNDATION
    Inventors: Jae Hyun Lee, Dong Pil Park, Won Hee Lee, Hee Jun Park, Won Bin Hong
  • Patent number: 12230872
    Abstract: An antenna device according to an embodiment includes a dielectric layer, a rhombus-shaped first radiator disposed on an upper surface of the dielectric layer, a transmission line connected to the first radiator, a signal pad connected to one end of the transmission line, ground pads disposed around the signal pad, and second radiators extending from the ground pad along lower sides of the first radiator.
    Type: Grant
    Filed: December 9, 2022
    Date of Patent: February 18, 2025
    Assignee: DONGWOO FINE-CHEM CO., LTD.
    Inventors: Hee Jun Park, Dong Pil Park, Jae Hyun Lee
  • Patent number: 12206170
    Abstract: An antenna device according to an embodiments of the present invention includes a substrate layer, a ground layer disposed on a bottom surface of the substrate layer, a radiation control layer disposed on a top surface of the substrate layer, the radiation control layer including a plurality of radiation control patterns formed of a conductive mesh structure, each of the radiation control patterns having a hollow portion, an antenna dielectric layer disposed on the radiation control layer, and an antenna unit disposed on the antenna dielectric layer.
    Type: Grant
    Filed: March 8, 2023
    Date of Patent: January 21, 2025
    Assignee: DONGWOO FINE-CHEM CO., LTD.
    Inventors: Young Ju Kim, Sung Hoe Kim, Hee Jun Park, Young Sub Son
  • Publication number: 20240388746
    Abstract: Systems and methods for generating a rendered composition for a multi-stream contents on a display are provided. One or more content item streams are received. Each content item stream is associated with a user experience metric. Based on the user experience metric, a rendering frames per second (FPS) metric for the plurality of content item streams is determined. A rendered composition of the plurality of content item streams is generated based on the rendering FPS metric.
    Type: Application
    Filed: May 17, 2023
    Publication date: November 21, 2024
    Inventors: Hee Jun Park, Figo Wang, Amin Khajeh
  • Patent number: 12144242
    Abstract: The present disclosure relates to an organic metal compound having the following structure, and an organic light emitting diode (OLED) and an organic light emitting device including the organic metal compound of the following structure. Incorporating the organic metal compound of the following structure into an emitting unit makes the OLED with improved luminous efficiency, luminous color purity and luminous lifetime.
    Type: Grant
    Filed: September 1, 2020
    Date of Patent: November 12, 2024
    Assignee: LG Display Co., Ltd.
    Inventors: Hee-Jun Park, Do-Han Kim, Hye-Seung Kang
  • Patent number: 12116377
    Abstract: The present disclosure provides an organometallic compound below and an organic light emitting diode and an organic light emitting display device including the organometallic compound.
    Type: Grant
    Filed: October 28, 2020
    Date of Patent: October 15, 2024
    Assignee: LG Display Co., Ltd.
    Inventors: Hee-Jun Park, Do-Han Kim, Hye-Seung Kang, Jae-Min Moon
  • Publication number: 20240334815
    Abstract: The organic light emitting diode according to an embodiment of the present disclosure includes a first electrode, a second electrode disposed opposite to the first electrode, one or more organic layers positioned on the inside of the first electrode and the second electrode, and a capping layer positioned on at least one outside of the first electrode and the second electrode, wherein a color viewing angle (?u?v?) at viewing angles of 30°, 45° and 60° of light produced from the organic layer and emitted through the capping layer, is less than 0.010.
    Type: Application
    Filed: September 7, 2023
    Publication date: October 3, 2024
    Inventors: Hee-Jun PARK, Seung-Hyun KIM, Sun-Jung KIM, Seok-Geun JIN
  • Patent number: 12100891
    Abstract: An antenna module according to an embodiment of the present invention includes a plurality of first sensing electrode rows, a plurality of second sensing electrode columns spaced apart from the first sensing electrode rows, an insulating interlayer formed between the first sensing electrode rows and the second sensing electrode columns, and an antenna unit inserted in at least one second sensing electrode column of the second sensing electrode columns to be electrically and physically separated from the second sensing electrode columns. The antenna unit does not overlap the first sensing electrode rows in a planar view.
    Type: Grant
    Filed: May 4, 2022
    Date of Patent: September 24, 2024
    Assignee: DONGWOO FINE-CHEM CO., LTD.
    Inventors: Byung Jin Choi, Hee Jun Park, Jae Hyun Lee
  • Patent number: 12093155
    Abstract: Certain aspects of the present disclosure provide techniques for improved hardware utilization. An input data tensor is divided into a first plurality of sub-tensors, and a plurality of logical sub-arrays in a physical multiply-and-accumulate (MAC) array is identified. For each respective sub-tensor of the first plurality of sub-tensors, the respective sub-tensor is mapped to a respective logical sub-array of the plurality of logical sub-arrays, and the respective sub-tensor is processed using the respective logical sub-array.
    Type: Grant
    Filed: September 24, 2021
    Date of Patent: September 17, 2024
    Assignee: QUALCOMM Incorporated
    Inventors: Hee Jun Park, Bohuslav Rychlik, Niraj Shantilal Paliwal
  • Publication number: 20240300990
    Abstract: A compound represented by the Chemical Formula 1 has a high-density and thus constitutes a dense film structure. Moreover, the compound represented by the Chemical Formula 1 binds to oxygen or moisture, thereby suppressing penetration of oxygen or moisture into the organic light-emitting device. In addition, the organic light-emitting device including a novel compound represented by a Chemical Formula 1 has a low operation voltage and has excellent luminous efficiency, excellent external quantum efficiency (EQE), a long lifetime, and excellent stability.
    Type: Application
    Filed: February 28, 2024
    Publication date: September 12, 2024
    Inventors: Hee-Jun PARK, Seung-Hyun KIM
  • Publication number: 20240291153
    Abstract: An antenna structure may include a transmission antenna unit group, and a reception antenna unit group spaced apart from the transmission antenna unit group in a first direction. The transmission antenna unit group includes a first transmission antenna unit and a second transmission antenna unit having a length in a second direction greater than a length of the first transmission antenna unit in the second direction, the second direction being perpendicular to the first direction. The reception antenna unit group includes a plurality of reception antenna units spaced apart from the first transmission antenna unit in the first direction and being arranged in a single row.
    Type: Application
    Filed: February 21, 2024
    Publication date: August 29, 2024
    Inventors: KI HUN SUNG, SUNG JOON HONG, DAE KYU KIM, HEE JUN PARK, MEE AE HUR
  • Publication number: 20240283166
    Abstract: An antenna structure may include a transmission antenna unit group, and a reception antenna unit group spaced apart from the transmission antenna unit group in a first direction. The transmission antenna unit group includes a first transmission antenna unit, and a second transmission antenna unit having a length in a second direction greater than a length of the first transmission antenna unit in the second direction, the second direction being perpendicular to the first direction. The reception antenna unit group includes a first reception antenna unit spaced apart from the first transmission antenna unit in the first direction and including a first reception radiator, and a second reception antenna unit including a second reception radiator spaced apart the first reception radiator in the second direction.
    Type: Application
    Filed: February 21, 2024
    Publication date: August 22, 2024
    Inventors: KI HUN SUNG, SUNG JOON HONG, DAE KYU KIM, HEE JUN PARK, MEE AE HUR
  • Publication number: 20240268017
    Abstract: A circuit board includes a core layer, a first via structure penetrating the core layer, a circuit wiring disposed on one surface of the core layer and including a head portion in contact with the first via structure, a connection portion extending from the head portion and an extension portion electrically connected to the head portion through the connection portion, and a first ground pattern disposed on the one surface of the core layer and disposed around the circuit wiring to be spaced apart from the circuit wiring. A shortest distance between the extension portion and the first ground pattern is greater than a shortest distance between the head portion and the first ground pattern.
    Type: Application
    Filed: January 9, 2024
    Publication date: August 8, 2024
    Inventors: KI HUN SUNG, DAE KYU KIM, HEE JUN PARK, SUNG JOON HONG