Patents by Inventor Hee-Jun Yoon
Hee-Jun Yoon has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20220032105Abstract: The present invention provides a portable exercise device conveniently carried and usable to train a body such as pelvis, thigh, and chest.Type: ApplicationFiled: August 2, 2019Publication date: February 3, 2022Inventor: Hee jun YOON
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Patent number: 11152134Abstract: The present invention relates to a flexible flat cable including a plurality of conductive wires disposed between an upper film and a lower film, in which the conductive wires are fixed by a first thermal bonding resin of the upper film and a second thermal bonding resin of the lower film, an air gap is formed between the conductive wires, and a side end of the upper film and a side end of the lower film are bonded by the first thermal bonding resin and the second thermal bonding resin, and an impedance matching sheet is attached to a lower surface of the lower film, an upper portion of the upper film, or both the upper portion of the upper film and the lower surface of the lower film.Type: GrantFiled: May 17, 2019Date of Patent: October 19, 2021Inventor: Hee Jun Yoon
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Publication number: 20190279789Abstract: The present invention relates to a flexible flat cable including a plurality of conductive wires disposed between an upper film and a lower film, in which the conductive wires are fixed by a first thermal bonding resin of the upper film and a second thermal bonding resin of the lower film, an air gap is formed between the conductive wires, and a side end of the upper film and a side end of the lower film are bonded by the first thermal bonding resin and the second thermal bonding resin.Type: ApplicationFiled: May 17, 2019Publication date: September 12, 2019Inventor: HEE JUN YOON
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Publication number: 20190279788Abstract: The present invention relates to a flexible flat cable including a plurality of conductive wires disposed between an upper film and a lower film, in which the conductive wires are fixed by a first thermal bonding resin of the upper film and a second thermal bonding resin of the lower film, an air gap is formed between the conductive wires, and a side end of the upper film and a side end of the lower film are bonded by the first thermal bonding resin and the second thermal bonding resin, and an impedance matching sheet is attached to a lower surface of the lower film, an upper portion of the upper film, or both the upper portion of the upper film and the lower surface of the lower film.Type: ApplicationFiled: May 17, 2019Publication date: September 12, 2019Inventor: HEE JUN YOON
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Patent number: 10347394Abstract: The present invention relates to a flexible flat cable including a plurality of conductive wires disposed between an upper film and a lower film, in which an air gap is formed between the conductive wires. The flexible flat cable includes a plurality of conductive wires disposed between an upper film and a lower film, wherein the conductive wires are fixed by a first thermal bonding resin of the upper film and a second thermal bonding resin of the lower film, an air gap is formed between the conductive wires, and a side end of the upper film and a side end of the lower film are bonded by the first thermal bonding resin and the second thermal bonding resin.Type: GrantFiled: May 2, 2018Date of Patent: July 9, 2019Inventor: Hee jun Yoon
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Publication number: 20180254121Abstract: The present invention relates to a flexible flat cable including a plurality of conductive wires disposed between an upper film and a lower film, in which an air gap is formed between the conductive wires. The flexible flat cable includes a plurality of conductive wires disposed between an upper film and a lower film, wherein the conductive wires are fixed by a first thermal bonding resin of the upper film and a second thermal bonding resin of the lower film, an air gap is formed between the conductive wires, and a side end of the upper film and a side end of the lower film are bonded by the first thermal bonding resin and the second thermal bonding resin.Type: ApplicationFiled: May 2, 2018Publication date: September 6, 2018Inventor: Hee jun Yoon
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Patent number: 10008304Abstract: The present invention relates to a flexible flat cable including a plurality of conductive wires disposed between an upper film and a lower film, wherein an air gap is formed between the conductive wires. The flexible flat cable according to the present invention includes a plurality of conductive wires (15) disposed between an upper film (11) and a lower film (13), wherein the conductive wires (15) are fixed by a first thermal bonding resin (12) of the upper film (11) and a second thermal bonding resin (14) of the lower film (13), an air gap (16) is formed between the conductive wires (15), and a side end of the upper film (11) and a side end of the lower film (13) are bonded by the first thermal bonding resin (12) and the second thermal bonding resin (14).Type: GrantFiled: February 17, 2017Date of Patent: June 26, 2018Inventor: Hee jun Yoon
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Publication number: 20180025806Abstract: The present invention relates to a flexible flat cable including a plurality of conductive wires disposed between an upper film and a lower film, wherein an air gap is formed between the conductive wires. The flexible flat cable according to the present invention includes a plurality of conductive wires (15) disposed between an upper film (11) and a lower film (13), wherein the conductive wires (15) are fixed by a first thermal bonding resin (12) of the upper film (11) and a second thermal bonding resin (14) of the lower film (13), an air gap (16) is formed between the conductive wires (15), and a side end of the upper film (11) and a side end of the lower film (13) are bonded by the first thermal bonding resin (12) and the second thermal bonding resin (14).Type: ApplicationFiled: February 17, 2017Publication date: January 25, 2018Inventor: Hee jun YOON
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Patent number: 9580361Abstract: The present invention relates to a preparation method of a tungsten carbide sintered body for a friction stir welding tool used in a friction stir welding tool of a high melting point material such as steel, titanium and the like or a dissimilar material such as aluminum, magnesium-steel, titanium and the like. The preparation method comprises the following steps: filling a tungsten carbide (WC) powder in a mold made of a graphite material; mounting the mold filled with tungsten carbide powder in a chamber of a discharge plasma sintering apparatus; making a vacuum inside of the chamber; molding the tungsten carbide powder while maintaining a constant pressure inside the mold and increasing the temperature according to a set heat increase pattern until the temperature reaches a final target temperature; and cooling the inside of the chamber while maintaining the pressure pressurized in the mold after the molding step.Type: GrantFiled: December 9, 2011Date of Patent: February 28, 2017Assignee: KOREA INSTITUTE OF INDUSTRIAL TECHNOLOGYInventors: Hyun Kuk Park, Ik Hyun Oh, Hee Jun Yoon, Hyeon Taek Son, Kwang Jin Lee, Hee Seon Bang, Han Sur Bang
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Publication number: 20140191443Abstract: The present invention relates to a preparation method of a tungsten carbide sintered body for a friction stir welding tool used in a friction stir welding tool of a high melting point material such as steel, titanium and the like or a dissimilar material such as aluminum, magnesium-steel, titanium and the like using pulsed current activation through a discharge plasma sintering apparatus. The preparation method comprises the following steps: filling a tungsten carbide (WC) powder in a mold made of a graphite material; mounting the mold filled with tungsten carbide powder in a chamber of a discharge plasma sintering apparatus; making a vacuum inside of the chamber; molding the tungsten carbide powder while maintaining a constant pressure inside the mold and increasing the temperature according to a set heat increase pattern until the temperature reaches a final target temperature; and cooling the inside of the chamber while maintaining the pressure pressurized in the mold after the molding step.Type: ApplicationFiled: December 9, 2011Publication date: July 10, 2014Applicant: KOREA INSTITUTE OF INDUSTRIAL TECHNOLOGYInventors: Hyun Kuk Park, Ik Hyun Oh, Hee Jun Yoon, Hyeon Taek Son, Kwang Jin Lee, Hee Seon Bang, Han Sur Bang
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Patent number: 7743187Abstract: An audio system sets a signal line path between the medium of an audio device and an external device and uploads a digital audio file from the external device to the audio device according to a user's manipulation of the audio. In addition, a communication system selectively uses USB and UART communications by commonly using a single USB connector and connects a connector of an external device and an audio/USB/UART common connector through a single cable, so that audio/USB or audio/UART signals are selectively outputted through a common audio signal line. Accordingly, the audio system can interface with various kinds of external devices without external modification or additional installation of a dedicated interface in the audio device with a USB connector. In addition, the USB/UART common communication system can commonly use the USB connector without regard to USB and UART connection signals and can selectively output the audio/USB or audio/UART signals through the single cable in the audio device.Type: GrantFiled: January 4, 2007Date of Patent: June 22, 2010Assignee: Telechips, Inc.Inventors: Jae-Soon Choi, Hee-Jun Yoon
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Publication number: 20070180170Abstract: An audio system sets a signal line path between the medium of an audio device and an external device and uploads a digital audio file from the external device to the audio device according to a user's manipulation of the audio. In addition, a communication system selectively uses USB and UART communications by commonly using a single USB connector and connects a connector of an external device and an audio/USB/UART common connector through a single cable, so that audio/USB or audio/UART signals are selectively outputted through a common audio signal line. Accordingly, the audio system can interface with various kinds of external devices without external modification or additional installation of a dedicated interface in the audio device with a USB connector. In addition, the USB/UART common communication system can commonly use the USB connector without regard to USB and UART connection signals and can selectively output the audio/USB or audio/UART signals through the single cable in the audio device.Type: ApplicationFiled: January 4, 2007Publication date: August 2, 2007Applicant: TELECHIPS, INC.Inventors: Jae-Soon CHOI, Hee-Jun YOON