Abstract: The inventive concept provides a substrate transfer robot.

Abstract: The present invention provides an apparatus of processing a substrate. The apparatus of processing a substrate includes: a gripping unit gripping a plurality of substrates on both sides; a body supporting the gripping unit; an actuating unit moving and rotating the gripping unit with respect to the body; and a control unit controlling the actuating unit, wherein the actuating unit includes: a horizontal actuating unit horizontally moving the gripping unit in a first direction with respect to the body; a rotation actuating unit rotating the gripping unit with respect to the body.

Abstract: The present invention provides an apparatus for treating a substrate. The apparatus for treating a substrate includes: a first treatment bath having a first accommodation space in which first treatment liquid is accommodated, and performing liquid treatment on a plurality of sheets of substrates; a second treatment bath having a second accommodation space in which second treatment liquid is accommodated, and performing liquid treatment on the plurality of sheets of substrates; a supporting unit fixedly installed in the second accommodation space; and a lifter unit transferring substrates between the first treatment bath and the second treatment bath, wherein the plurality of sheets of substrates is liquid-treated in a state in which the substrates are supported on the lifter unit in the first treatment bath, and the plurality of sheets of substrates is liquid-treated in a state in which the substrates are supported on the supporting unit in the second treatment bath.

Abstract: The inventive concept provides a substrate transfer robot.

Abstract: Proposed is a substrate transferring apparatus, and a liquid processing apparatus and substrate processing equipment including the same, which prevent a pattern leaning phenomenon during a substrate processing process. The substrate transferring apparatus that transfers substrates between cleaning tanks in the batch-type liquid processing apparatus includes a rail extended on a ceiling of a first cleaning tank in which a first processing liquid is stored and a second cleaning tank in which a second processing liquid is stored, a crane moving along the rail, and a vessel configured to be moved vertically by the crane. The vessel may include a first sub vessel and a second sub vessel that combine with each other to form a space for accommodating a substrate immersed in the first processing liquid.

Abstract: There are provided a substrate treating apparatus and method for etch rate deviation improvement. The substrate treating apparatus includes: a treating bath providing space for receiving a substrate treating solution for treating substrates; a treating solution source providing the substrate treating solution into the treating bath such that the substrates are immersed and treated in the substrate treating solution; and a bubble generation module connected to the treating bath and generating bubbles in the substrate treating solution by injecting gas.

Abstract: Provided is a high pressure fuel pump including: a body formed in a side surface thereof with a discharge hole; a pressurizing device for generating a suction force for sucking fuel supplied from a fuel tank and a pressurizing force for pressurizing the fuel at a high pressure; a seal carrier coupled to a lower portion of the body and coupled with the pressurizing device; a flow control valve coupled to one side of the body, for controlling a supply flow rate and a discharge pressure of the fuel; and a pressure relief valve for relieving an abnormal high pressure by transferring a part of discharged fuel to a low pressure space formed in the lower portion of the body when the abnormal high pressure exceeding a preset pressure limit is generated in a fuel supply system for supplying the fuel discharged through the discharge hole to an injector.