Patents by Inventor Hee Jung Lee
Hee Jung Lee has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20250135792Abstract: An ink-jet printing apparatus includes: a stage on which a substrate including first and second alignment marks is mounted; an ink-jet head part discharging ink; a mark measuring part measuring a first coordinate of each of the first and second alignment marks during a first compensation period, the mark measuring part measuring a second coordinate of the first alignment mark during a second compensation period; and a substrate fixing part holding the substrate. The substrate fixing part performs a first operation to move the substrate such that the first coordinates of the first and second alignment marks in a first direction align with each other during the first compensation period, and performs a second operation to move the substrate according to a result obtained by comparing the second coordinate of the first alignment mark with a reference coordinate of the first alignment mark during the second compensation period.Type: ApplicationFiled: August 12, 2024Publication date: May 1, 2025Applicant: Samsung Display Co., LTD.Inventors: Hee Jung LEE, Hong Gi MIN, Jong Sung KIM, Sang Jin LEE, Myung Soo HUH
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Patent number: 12160946Abstract: A camera device according to one embodiment of the present invention includes a printed circuit board, a heat radiation layer disposed on a first surface of the printed circuit board, and an image sensor disposed on the heat radiation layer, a plurality of through-holes passing through the printed circuit board from the first surface to a second surface which is a surface opposite to the first surface are formed in the printed circuit board, and the plurality of through-holes are in contact with the heat radiation layer.Type: GrantFiled: May 6, 2021Date of Patent: December 3, 2024Assignee: LG INNOTEK CO., LTD.Inventors: Seong Su Eom, Sol Ip Lee, Hee Jung Lee
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Patent number: 12144103Abstract: A printed circuit board according to an embodiment comprises: a substrate comprising at least two insulating layers; pads arranged on the substrate; heat dissipation vias arranged to pass through the substrate in a region of the substrate which vertically overlaps the pads; and through vias arranged to pass through the substrate in a region of the substrate which does not vertically overlap the pads, wherein each heat dissipation via includes a plurality of via parts which are spaced apart from each other in at least one of the at least two insulating layers, the upper surface of each of the plurality of via parts has a first horizontal width in a first direction that is smaller than a second horizontal width thereof in a second direction different from the first direction, and the plurality of via parts have a surface area corresponding to 10% or greater of the surface area of the pads.Type: GrantFiled: June 14, 2019Date of Patent: November 12, 2024Assignee: LG INNOTEK CO., LTD.Inventors: Do Hyuk Yoo, Hee Jung Lee, Young Ju Han, Young Il Lee
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Publication number: 20240339364Abstract: An apparatus for fabricating a display panel includes a loading plate on which a fabrication substrate is loaded, a plurality of optical microscopes that captures the fabrication substrate and alignment marks of the fabrication substrate, a gripper driver that aligns the fabrication substrate by adjusting a gap between gripper units and rotating the gripper units; and a substrate alignment controller that calculates an amount of rotation correction for the gripper units based on a deviated angle of the fabrication substrate to supply it to the gripper driver, calculates a gripper gap setting value for adjusting the gap between the gripper units using a residual of the aligned fabrication substrate, and provides the gripper gap setting value to the gripper driver.Type: ApplicationFiled: November 22, 2023Publication date: October 10, 2024Applicant: Samsung Display Co., LTD.Inventors: Hee Jung LEE, Hong Gi MIN, Jong Sung KIM, Sang Jin LEE, Myung Soo HUH
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Publication number: 20240326419Abstract: An inkjet printing apparatus includes a head pack including a plurality of heads, wherein each of the plurality of heads includes a plurality of nozzles, wherein each of the plurality of heads extends in a first direction and is disposed adjacent to each other in a second direction intersecting the first direction, and a volume of a droplet ejected from each of the plurality of nozzles is alternately set to a first volume larger than a reference volume and a second volume smaller than the reference volume for each of the plurality of heads along the second direction.Type: ApplicationFiled: November 15, 2023Publication date: October 3, 2024Inventors: HONGGI MIN, JONGSUNG KIM, SANGJIN LEE, HEE JUNG LEE, MYUNGSOO HUH
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Publication number: 20240314937Abstract: A circuit board according to an embodiment includes an insulating layer including a first region and a second region; a circuit pattern disposed on an upper surface of the first region and an upper surface of the second region of the insulating layer; and a solder resist including a first portion disposed on the upper surface of the first region of the insulating layer and a second portion disposed the upper surface of the second region; wherein a height of the first portion of the solder resist is smaller than a height of the circuit pattern, wherein a height of the second portion of the solder resist is greater than the height of the circuit pattern, wherein at least one of the first region and the second region is divided into a plurality of partial regions, wherein at least one of the first portion and the second portion of the solder resist has a different height in the plurality of partial regions.Type: ApplicationFiled: April 26, 2021Publication date: September 19, 2024Inventors: Hee Jung LEE, Jin Seok LEE, Yong Han JEON
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Publication number: 20240286165Abstract: A manufacturing method of a display device includes forming a first droplet on a first region of a substrate by nozzles, moving the nozzles onto a second region of the substrate spaced apart in a first direction from the first region, forming a second droplet on the second region, calculating a first distance between the first and second droplets, moving the nozzles onto a third region of the substrate spaced apart in a direction opposite to the first direction from the second region, forming a third droplet on the third region, moving the nozzles onto a fourth region of the substrate spaced apart in the first direction from the third region, forming a fourth droplet on the fourth region, calculating a second distance between the third and the fourth droplets, and calculating a jetting velocity of each of the nozzles based on the first distance and the second distance.Type: ApplicationFiled: January 8, 2024Publication date: August 29, 2024Inventors: JONGSUNG KIM, HONGGI MIN, SANGJIN LEE, HEE JUNG LEE, MYUNGSOO HUH
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Patent number: 11784502Abstract: Provided are a wireless charging and communication board, and a wireless charging and communication device, the wireless charging and communication board including: a soft magnetic layer; a polymeric material layer arranged on one surface and the other surface of the soft magnetic layer and extending longer than an exposed portion of the soft magnetic layer; and a coil pattern arranged on the polymeric material layer.Type: GrantFiled: November 19, 2020Date of Patent: October 10, 2023Assignee: SCRAMOGE TECHNOLOGY LIMITEDInventors: Jai Hoon Yeom, Sang Won Lee, Seok Bae, So Yeon Kim, Jin Mi Noh, Ji Yeon Song, Hee Jung Lee
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Patent number: 11759500Abstract: The present invention provides a PEGylated IFN-? variant and a composition for preventing or treating hyperproliferative diseases, inflammatory diseases, autoimmune diseases or viral infectious diseases, the composition comprising the PEGylated IFN-? variant as an effective ingredient. The PEGylated IFN-? variant of the present invention has an excellent anti-viral efficacy, immune regulatory function and anti-cell growth efficacy by virtue of better pharmacokinetic properties compared to native IFN-? and non-PEGylated IFN-? variants, and therefore can be used usefully against various diseases. The present invention provides good patient convenience in terms of administration due to exhibition of an excellent pharmacological activity effect upon administration and a significant increase of half-life in blood over existing interferon formulations.Type: GrantFiled: July 24, 2015Date of Patent: September 19, 2023Assignee: Abion Inc.Inventors: Young-Kee Shin, Young-Deug Kim, Kyoung Song, Dong Hee Na, Seong Hoon Jeong, Dae Duk Kim, In Soo Yoon, Hee Jung Lee, Sae Hyung Lee
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Publication number: 20230171874Abstract: A camera device according to one embodiment of the present invention includes a printed circuit board, a heat radiation layer disposed on a first surface of the printed circuit board, and an image sensor disposed on the heat radiation layer, a plurality of through-holes passing through the printed circuit board from the first surface to a second surface which is a surface opposite to the first surface are formed in the printed circuit board, and the plurality of through-holes are in contact with the heat radiation layer.Type: ApplicationFiled: May 6, 2021Publication date: June 1, 2023Inventors: Seong Su EOM, Sol Ip LEE, Hee Jung LEE
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Patent number: 11542372Abstract: Provided are thermoplastic polymer particles having an aspect ratio of 1.00 or more and less than 1.05, and a roundness of 0.95 to 1.00. The thermoplastic polymer particles are formed from a thermoplastic polymer resin in a continuous matrix phase. The thermoplastic polymer particles show a peak cold crystallization temperature (Tcc) at a temperature between a glass transition temperature (Tg) and the melting point (Tm) in a differential scanning calorimetry (DSC) curve which is derived from temperature rise analysis at 10° C./min by differential scanning calorimetry.Type: GrantFiled: March 25, 2021Date of Patent: January 3, 2023Inventors: Jae Ho Lim, Sung Yong Kang, Kyoung Min Kang, Hee-Jung Lee, Min Gyung Kim, Chang-Young Park, Jun Ho Choi, Jae Han Song, Yu Jin Go
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Patent number: 11524924Abstract: The present invention relates to a SiC composite and a method for manufacturing the same. More particularly, the present invention relates to a slurry composition for ceramic matrix composites which can not only reduce the number of precursor impregnation pyrolysis (PIP) cycles but also be useful in the PIP process to increase hardness, thermal stability, and relative density.Type: GrantFiled: January 22, 2020Date of Patent: December 13, 2022Assignee: KOREA INSTITUTE OF MACHINERY & MATERIALSInventors: Sea-Hoon Lee, Ji-An Gu, Hee-Jung Lee
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Publication number: 20220380493Abstract: The present invention relates to polypropylene particles and a method for preparing same, the polypropylene particles being formed from a polypropylene resin, and having a melting index (M.I.) of 1000 g/10 min or more when the particles are re-melted under a temperature condition of 150° C. to 250° C. and a condition of atmospheric pressure to a pressure of 15 MPa.Type: ApplicationFiled: October 7, 2020Publication date: December 1, 2022Applicant: LX Hausys, Ltd.Inventors: Jae Han Song, Sung Yong Kang, Hee-Jung Lee, Min Gyung Kim, Jae Ho Lim, Jun Ho Choi, Yu Jin Go, Hyo Jae Kong
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Patent number: 11453262Abstract: A void bush for a vehicle suspension includes: inside bumps formed in an inside stopper and outside bumps formed in an outside stopper. In particular, the inside bumps and the outside bumps are configured to cross perpendicularly to each other to allow the inside bumps and the outside bumps to be brought into point-contact with each other during behavior of the suspension. The inside bumps are not arranged in parallel to each other and the outside bumps are not arranged in parallel to each other. Accordingly, contact area between the inside bumps and the outside bumps is greatly reduced and contact abrasion positions therebetween are diversified so that durability and lifespan of the void bush are improved.Type: GrantFiled: November 4, 2020Date of Patent: September 27, 2022Assignees: HYUNDAI MOTOR COMPANY, KIA MOTORS CORPORATIONInventors: Dae Un Sung, Kyung Jung Hwang, Yong Hyun Ryu, Hee Jung Lee, Tae Hee Lee, Se Young Kim, Jin Wook Park, Seong Jun Heo
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Patent number: 11235493Abstract: A prepreg preparation device and a prepreg preparation method using the same are disclosed. According to an embodiment of the present invention, the prepreg preparation device comprises: a flow path-type impregnation part for impregnating, with a resin, a reinforced fiber transferred along a flow path; and a box-type impregnation part for impregnating, with the resin, the reinforced fiber transferred through a box-type space by passing through the flow path-type impregnation part.Type: GrantFiled: December 27, 2016Date of Patent: February 1, 2022Assignee: LG HAUSYS, LTD.Inventors: Young-E Moon, Jong-Sung Park, Kang-Hyun Song, Hee-Jung Lee, Hee-June Kim
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Patent number: 11149120Abstract: Provided is a method for manufacturing thermoplastic polymer particles, the method comprising the steps of: supplying a thermoplastic polymer resin to an extruder and extruding the same; supplying the extruded thermoplastic polymer resin and air to a nozzle, bringing the thermoplastic polymer resin into contact with the air to granulate the thermoplastic polymer resin, and then discharging the granulated thermoplastic polymer resin; and supplying discharged thermoplastic polymer particles to a cooling unit to cool the thermoplastic polymer particles, and then collecting the cooled thermoplastic polymer particles.Type: GrantFiled: March 9, 2018Date of Patent: October 19, 2021Inventors: Hee-Jung Lee, Sung Yong Kang, Kyoung Min Kang, Min Gyung Kim, Chang-Young Park, Jae Ho Lim, Jun Ho Choi, Jae Han Song, Yu Jin Go
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Patent number: 11118019Abstract: The present invention provides thermoplastic polyurethane particles, which are formed in a continuous matrix phase from a thermoplastic polyurethane resin and have a particle diameter of 200-500 ?m. In a differential scanning calorimetry (DSC) curve of the thermoplastic polyurethane particles, derived from the analysis of a temperature rise of 10° C./min by DSC, a peak of the cold crystallization temperature (Tcc) is shown at a temperature between the glass transition temperature (Tg) and the melting point (Tm). The thermoplastic polyurethane particles have a compression degree of 10-20%.Type: GrantFiled: March 9, 2018Date of Patent: September 14, 2021Inventors: Min Gyung Kim, Sung Yong Kang, Kyoung Min Kang, Hee-Jung Lee, Chang-Young Park, Jae Ho Lim, Jun Ho Choi, Jae Han Song, Yu Jin Go
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Publication number: 20210267043Abstract: A printed circuit board according to an embodiment comprises: a substrate comprising at least two insulating layers; pads arranged on the substrate; heat dissipation vias arranged to pass through the substrate in a region of the substrate which vertically overlaps the pads; and through vias arranged to pass through the substrate in a region of the substrate which does not vertically overlap the pads, wherein each heat dissipation via includes a plurality of via parts which are spaced apart from each other in at least one of the at least two insulating layers, the upper surface of each of the plurality of via parts has a first horizontal width in a first direction that is smaller than a second horizontal width thereof in a second direction different from the first direction, and the plurality of via parts have a surface area corresponding to 10% or greater of the surface area of the pads.Type: ApplicationFiled: June 14, 2019Publication date: August 26, 2021Inventors: Do Hyuk YOO, Hee Jung LEE, Young Ju HAN, Young Il LEE
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Publication number: 20210253802Abstract: Provided are thermoplastic polymer particles having an aspect ratio of 1.00 or more and less than 1.05, and a roundness of 0.95 to 1.00. The thermoplastic polymer particles are formed from a thermoplastic polymer resin in a continuous matrix phase. The thermoplastic polymer particles show a peak cold crystallization temperature (Tcc) at a temperature between a glass transition temperature (Tg) and the melting point (Tm) in a differential scanning calorimetry (DSC) curve which is derived from temperature rise analysis at 10° C./min by differential scanning calorimetry.Type: ApplicationFiled: March 25, 2021Publication date: August 19, 2021Applicant: LG Hausys, Ltd.Inventors: Jae Ho Lim, Sung Yong Kang, Kyoung Min Kang, Hee-Jung Lee, Min Gyung Kim, Chang-Young Park, Jun Ho Choi, Jae Han Song, Yu Jin Go
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Patent number: 11066527Abstract: The present invention provides polylactic acid particles, which are formed in a continuous matrix phase from a polylactic acid resin and have a particle diameter of 1 to 100 ?m. In a differential scanning calorimetry (DSC) curve of the polylactic acid particles, derived from the analysis by DSC using a temperature rise of 10° C./min, a peak of the cold crystallization temperature (Tcc) is shown at a temperature between the glass transition temperature (Tg) and the melting point (Tm). The polylactic acid particles have an aspect ratio of more than or equal to 1.00 and less than 1.05 and a roundness of 0.95 to 1.00. The polylactic acid particles have a flow time of 20 to 30 seconds.Type: GrantFiled: March 9, 2018Date of Patent: July 20, 2021Inventors: Kyoung Min Kang, Sung Yong Kang, Hee-Jung Lee, Min Gyung Kim, Chang-Young Park, Jae Ho Lim, Jun Ho Choi, Jae Han Song, Yu Jin Go