Abstract: The present invention relates to a polyester nonwoven fabric with suppressed reduction in physical properties by a tufting process, a method for manufacturing same, and a backing fabric for a carpet, comprising same and, in particular, to: a polyester nonwoven fabric in which, by controlling the physical properties of fibers of a first component filament and a second filament, a reduction in physical properties is remarkably suppressed before/after a tufting process, thus enabling the manufacture of a carpet backing fabric with excellent mechanical properties; a method for manufacturing same; and a backing fabric for a carpet, manufactured thereby.

Abstract: The present disclosure provides: a compound of a specific chemical structure, having excellent activity with respect to BTK degradation; or a pharmaceutically acceptable salt thereof. The present disclosure also provides a composition comprising the compound or pharmaceutically acceptable salts thereof. The present disclosure also provides are pharmaceutical use for treating or preventing BTK-associated diseases (for example, autoimmune diseases or cancer) of the compound, the salt thereof, and the composition comprising same according to the present disclosure. The present disclosure also provides a method for treating or preventing BTK-associated diseases (for example, autoimmune diseases or cancer), comprising administering, to a subject requiring treatment, an effective amount of the compound, the salt thereof, or the composition comprising same according to the present disclosure.

Abstract: A camera device according to one embodiment of the present invention includes a printed circuit board, a heat radiation layer disposed on a first surface of the printed circuit board, and an image sensor disposed on the heat radiation layer, a plurality of through-holes passing through the printed circuit board from the first surface to a second surface which is a surface opposite to the first surface are formed in the printed circuit board, and the plurality of through-holes are in contact with the heat radiation layer.

Abstract: A printed circuit board according to an embodiment comprises: a substrate comprising at least two insulating layers; pads arranged on the substrate; heat dissipation vias arranged to pass through the substrate in a region of the substrate which vertically overlaps the pads; and through vias arranged to pass through the substrate in a region of the substrate which does not vertically overlap the pads, wherein each heat dissipation via includes a plurality of via parts which are spaced apart from each other in at least one of the at least two insulating layers, the upper surface of each of the plurality of via parts has a first horizontal width in a first direction that is smaller than a second horizontal width thereof in a second direction different from the first direction, and the plurality of via parts have a surface area corresponding to 10% or greater of the surface area of the pads.

Abstract: An apparatus for fabricating a display panel includes a loading plate on which a fabrication substrate is loaded, a plurality of optical microscopes that captures the fabrication substrate and alignment marks of the fabrication substrate, a gripper driver that aligns the fabrication substrate by adjusting a gap between gripper units and rotating the gripper units; and a substrate alignment controller that calculates an amount of rotation correction for the gripper units based on a deviated angle of the fabrication substrate to supply it to the gripper driver, calculates a gripper gap setting value for adjusting the gap between the gripper units using a residual of the aligned fabrication substrate, and provides the gripper gap setting value to the gripper driver.

Abstract: An inkjet printing apparatus includes a head pack including a plurality of heads, wherein each of the plurality of heads includes a plurality of nozzles, wherein each of the plurality of heads extends in a first direction and is disposed adjacent to each other in a second direction intersecting the first direction, and a volume of a droplet ejected from each of the plurality of nozzles is alternately set to a first volume larger than a reference volume and a second volume smaller than the reference volume for each of the plurality of heads along the second direction.

Abstract: A circuit board according to an embodiment includes an insulating layer including a first region and a second region; a circuit pattern disposed on an upper surface of the first region and an upper surface of the second region of the insulating layer; and a solder resist including a first portion disposed on the upper surface of the first region of the insulating layer and a second portion disposed the upper surface of the second region; wherein a height of the first portion of the solder resist is smaller than a height of the circuit pattern, wherein a height of the second portion of the solder resist is greater than the height of the circuit pattern, wherein at least one of the first region and the second region is divided into a plurality of partial regions, wherein at least one of the first portion and the second portion of the solder resist has a different height in the plurality of partial regions.

Abstract: A manufacturing method of a display device includes forming a first droplet on a first region of a substrate by nozzles, moving the nozzles onto a second region of the substrate spaced apart in a first direction from the first region, forming a second droplet on the second region, calculating a first distance between the first and second droplets, moving the nozzles onto a third region of the substrate spaced apart in a direction opposite to the first direction from the second region, forming a third droplet on the third region, moving the nozzles onto a fourth region of the substrate spaced apart in the first direction from the third region, forming a fourth droplet on the fourth region, calculating a second distance between the third and the fourth droplets, and calculating a jetting velocity of each of the nozzles based on the first distance and the second distance.

Abstract: Provided are a wireless charging and communication board, and a wireless charging and communication device, the wireless charging and communication board including: a soft magnetic layer; a polymeric material layer arranged on one surface and the other surface of the soft magnetic layer and extending longer than an exposed portion of the soft magnetic layer; and a coil pattern arranged on the polymeric material layer.

Abstract: The present invention provides a PEGylated IFN-? variant and a composition for preventing or treating hyperproliferative diseases, inflammatory diseases, autoimmune diseases or viral infectious diseases, the composition comprising the PEGylated IFN-? variant as an effective ingredient. The PEGylated IFN-? variant of the present invention has an excellent anti-viral efficacy, immune regulatory function and anti-cell growth efficacy by virtue of better pharmacokinetic properties compared to native IFN-? and non-PEGylated IFN-? variants, and therefore can be used usefully against various diseases. The present invention provides good patient convenience in terms of administration due to exhibition of an excellent pharmacological activity effect upon administration and a significant increase of half-life in blood over existing interferon formulations.

Abstract: A camera device according to one embodiment of the present invention includes a printed circuit board, a heat radiation layer disposed on a first surface of the printed circuit board, and an image sensor disposed on the heat radiation layer, a plurality of through-holes passing through the printed circuit board from the first surface to a second surface which is a surface opposite to the first surface are formed in the printed circuit board, and the plurality of through-holes are in contact with the heat radiation layer.

Abstract: Provided are thermoplastic polymer particles having an aspect ratio of 1.00 or more and less than 1.05, and a roundness of 0.95 to 1.00. The thermoplastic polymer particles are formed from a thermoplastic polymer resin in a continuous matrix phase. The thermoplastic polymer particles show a peak cold crystallization temperature (Tcc) at a temperature between a glass transition temperature (Tg) and the melting point (Tm) in a differential scanning calorimetry (DSC) curve which is derived from temperature rise analysis at 10° C./min by differential scanning calorimetry.

Abstract: The present invention relates to a SiC composite and a method for manufacturing the same. More particularly, the present invention relates to a slurry composition for ceramic matrix composites which can not only reduce the number of precursor impregnation pyrolysis (PIP) cycles but also be useful in the PIP process to increase hardness, thermal stability, and relative density.

Abstract: The present invention relates to polypropylene particles and a method for preparing same, the polypropylene particles being formed from a polypropylene resin, and having a melting index (M.I.) of 1000 g/10 min or more when the particles are re-melted under a temperature condition of 150° C. to 250° C. and a condition of atmospheric pressure to a pressure of 15 MPa.

Abstract: A void bush for a vehicle suspension includes: inside bumps formed in an inside stopper and outside bumps formed in an outside stopper. In particular, the inside bumps and the outside bumps are configured to cross perpendicularly to each other to allow the inside bumps and the outside bumps to be brought into point-contact with each other during behavior of the suspension. The inside bumps are not arranged in parallel to each other and the outside bumps are not arranged in parallel to each other. Accordingly, contact area between the inside bumps and the outside bumps is greatly reduced and contact abrasion positions therebetween are diversified so that durability and lifespan of the void bush are improved.

Abstract: A prepreg preparation device and a prepreg preparation method using the same are disclosed. According to an embodiment of the present invention, the prepreg preparation device comprises: a flow path-type impregnation part for impregnating, with a resin, a reinforced fiber transferred along a flow path; and a box-type impregnation part for impregnating, with the resin, the reinforced fiber transferred through a box-type space by passing through the flow path-type impregnation part.

Abstract: Provided is a method for manufacturing thermoplastic polymer particles, the method comprising the steps of: supplying a thermoplastic polymer resin to an extruder and extruding the same; supplying the extruded thermoplastic polymer resin and air to a nozzle, bringing the thermoplastic polymer resin into contact with the air to granulate the thermoplastic polymer resin, and then discharging the granulated thermoplastic polymer resin; and supplying discharged thermoplastic polymer particles to a cooling unit to cool the thermoplastic polymer particles, and then collecting the cooled thermoplastic polymer particles.

Abstract: The present invention provides thermoplastic polyurethane particles, which are formed in a continuous matrix phase from a thermoplastic polyurethane resin and have a particle diameter of 200-500 ?m. In a differential scanning calorimetry (DSC) curve of the thermoplastic polyurethane particles, derived from the analysis of a temperature rise of 10° C./min by DSC, a peak of the cold crystallization temperature (Tcc) is shown at a temperature between the glass transition temperature (Tg) and the melting point (Tm). The thermoplastic polyurethane particles have a compression degree of 10-20%.

Abstract: A printed circuit board according to an embodiment comprises: a substrate comprising at least two insulating layers; pads arranged on the substrate; heat dissipation vias arranged to pass through the substrate in a region of the substrate which vertically overlaps the pads; and through vias arranged to pass through the substrate in a region of the substrate which does not vertically overlap the pads, wherein each heat dissipation via includes a plurality of via parts which are spaced apart from each other in at least one of the at least two insulating layers, the upper surface of each of the plurality of via parts has a first horizontal width in a first direction that is smaller than a second horizontal width thereof in a second direction different from the first direction, and the plurality of via parts have a surface area corresponding to 10% or greater of the surface area of the pads.

Abstract: Provided are thermoplastic polymer particles having an aspect ratio of 1.00 or more and less than 1.05, and a roundness of 0.95 to 1.00. The thermoplastic polymer particles are formed from a thermoplastic polymer resin in a continuous matrix phase. The thermoplastic polymer particles show a peak cold crystallization temperature (Tcc) at a temperature between a glass transition temperature (Tg) and the melting point (Tm) in a differential scanning calorimetry (DSC) curve which is derived from temperature rise analysis at 10° C./min by differential scanning calorimetry.