Abstract: The presently disclosed programmable fabric die includes a direct fabric die-to-fabric die interconnect interface column disposed in a sector of programmable logic fabric. Each row of the interconnect interface column includes at least one interconnect interface that is electrically coupled to a microbump. The microbump is configured to be electrically coupled to another microbump of another interconnect interface of another fabric die through an interposer. The fabric die may include multiple interconnect interface columns that each extend deep into the sector, enabling low latency connections between the fabric dies and reducing routing congestion. In some embodiments, the fabric die may include interconnect interfaces that are instead distributed throughout logic blocks of the sector.

Abstract: The presently disclosed programmable fabric die includes a direct fabric die-to-fabric die interconnect interface column disposed in a sector of programmable logic fabric. Each row of the interconnect interface column includes at least one interconnect interface that is electrically coupled to a microbump. The microbump is configured to be electrically coupled to another microbump of another interconnect interface of another fabric die through an interposer. The fabric die may include multiple interconnect interface columns that each extend deep into the sector, enabling low latency connections between the fabric dies and reducing routing congestion. In some embodiments, the fabric die may include interconnect interfaces that are instead distributed throughout logic blocks of the sector.

Abstract: The presently disclosed programmable fabric die includes a direct fabric die-to-fabric die interconnect interface column disposed in a sector of programmable logic fabric. Each row of the interconnect interface column includes at least one interconnect interface that is electrically coupled to a microbump. The microbump is configured to be electrically coupled to another microbump of another interconnect interface of another fabric die through an interposer. The fabric die may include multiple interconnect interface columns that each extend deep into the sector, enabling low latency connections between the fabric dies and reducing routing congestion. In some embodiments, the fabric die may include interconnect interfaces that are instead distributed throughout logic blocks of the sector.

Abstract: The presently disclosed programmable fabric die includes a direct fabric die-to-fabric die interconnect interface column disposed in a sector of programmable logic fabric. Each row of the interconnect interface column includes at least one interconnect interface that is electrically coupled to a microbump. The microbump is configured to be electrically coupled to another microbump of another interconnect interface of another fabric die through an interposer. The fabric die may include multiple interconnect interface columns that each extend deep into the sector, enabling low latency connections between the fabric dies and reducing routing congestion. In some embodiments, the fabric die may include interconnect interfaces that are instead distributed throughout logic blocks of the sector.

Abstract: The presently disclosed programmable fabric die includes a direct fabric die-to-fabric die interconnect interface column disposed in a sector of programmable logic fabric. Each row of the interconnect interface column includes at least one interconnect interface that is electrically coupled to a microbump. The microbump is configured to be electrically coupled to another microbump of another interconnect interface of another fabric die through an interposer. The fabric die may include multiple interconnect interface columns that each extend deep into the sector, enabling low latency connections between the fabric dies and reducing routing congestion. In some embodiments, the fabric die may include interconnect interfaces that are instead distributed throughout logic blocks of the sector.

Abstract: The presently disclosed programmable fabric die includes a direct fabric die-to-fabric die interconnect interface column disposed in a sector of programmable logic fabric. Each row of the interconnect interface column includes at least one interconnect interface that is electrically coupled to a microbump. The microbump is configured to be electrically coupled to another microbump of another interconnect interface of another fabric die through an interposer. The fabric die may include multiple interconnect interface columns that each extend deep into the sector, enabling low latency connections between the fabric dies and reducing routing congestion. In some embodiments, the fabric die may include interconnect interfaces that are instead distributed throughout logic blocks of the sector.

Abstract: A programmable integrated circuit with lookup table circuitry is provided. The lookup table (LUT) circuitry may be formed using multiplexers. A multiplexer in the lookup table circuitry may be implemented using only tristate inverting circuits. Each tristate inverting circuit may include a first set of n-channel and p-channel transistors that receive a static control bit from a memory element and a second set of n-channel and p-channel transistors that receive true and complementary versions of a user signal. The first and second sets of transistors may be coupled in series between a positive power supply terminal and a ground power supply terminal. A LUT multiplexer implemented in this way need not include separate transmission gates at the output of each tristate inverting circuit and may exhibit minimal subthreshold leakage.

Abstract: The presently disclosed programmable fabric die includes a direct fabric die-to-fabric die interconnect interface column disposed in a sector of programmable logic fabric. Each row of the interconnect interface column includes at least one interconnect interface that is electrically coupled to a microbump. The microbump is configured to be electrically coupled to another microbump of another interconnect interface of another fabric die through an interposer. The fabric die may include multiple interconnect interface columns that each extend deep into the sector, enabling low latency connections between the fabric dies and reducing routing congestion. In some embodiments, the fabric die may include interconnect interfaces that are instead distributed throughout logic blocks of the sector.

Abstract: A programmable integrated circuit with lookup table circuitry is provided. The lookup table (LUT) circuitry may be formed using multiplexers. A multiplexer in the lookup table circuitry may be implemented using only tristate inverting circuits. Each tristate inverting circuit may include a first set of n-channel and p-channel transistors that receive a static control bit from a memory element and a second set of n-channel and p-channel transistors that receive true and complementary versions of a user signal. The first and second sets of transistors may be coupled in series between a positive power supply terminal and a ground power supply terminal. A LUT multiplexer implemented in this way need not include separate transmission gates at the output of each tristate inverting circuit and may exhibit minimal subthreshold leakage.

Abstract: A programmable integrated circuit with lookup table circuitry is provided. The lookup table (LUT) circuitry may be formed using multiplexers. A multiplexer in the lookup table circuitry may be implemented using only tristate inverting circuits. Each tristate inverting circuit may include a first set of n-channel and p-channel transistors that receive a static control bit from a memory element and a second set of n-channel and p-channel transistors that receive true and complementary versions of a user signal. The first and second sets of transistors may be coupled in series between a positive power supply terminal and a ground power supply terminal. A LUT multiplexer implemented in this way need not include separate transmission gates at the output of each tristate inverting circuit and may exhibit minimal subthreshold leakage.

Abstract: A programmable integrated circuit with lookup table circuitry is provided. The lookup table (LUT) circuitry may be formed using multiplexers. A multiplexer in the lookup table circuitry may be implemented using only tristate inverting circuits. Each tristate inverting circuit may include a first set of n-channel and p-channel transistors that receive a static control bit from a memory element and a second set of n-channel and p-channel transistors that receive true and complementary versions of a user signal. The first and second sets of transistors may be coupled in series between a positive power supply terminal and a ground power supply terminal. A LUT multiplexer implemented in this way need not include separate transmission gates at the output of each tristate inverting circuit and may exhibit minimal subthreshold leakage.

Abstract: An integrated circuit includes a delay circuit, a buffer circuit, and a storage circuit. The delay circuit delays a first timing signal to generate a second timing signal. The buffer circuit generates a third timing signal for transmission to an external device. The third timing signal is generated based on the first timing signal. The external device provides data to the integrated circuit based on the third timing signal. The storage circuit captures the data transmitted from the external device in response to the second timing signal.

Abstract: Providing ASIC equivalents of FPGAs is facilitated and made more efficient and economical by using an ASIC architecture including a plurality of so-called hybrid logic elements (“HLEs”), each of which can provide a portion of the full functionality of an FPGA logic element (“LE”). The functionality of each FPGA LE implementing a user's logic design can be mapped to one or more HLEs without re-synthesis of the user's logic. Only as many HLEs as are necessary are used to perform the functions of each LE. The one-for-one equivalence between each LE and either (1) one HLE or (2) a group of HLEs facilitates mapping (without re-synthesis) in either direction between FPGA and ASIC designs.

Abstract: Providing ASIC equivalents of FPGAs is facilitated and made more efficient and economical by using an ASIC architecture including a plurality of so-called hybrid logic elements (“HLEs”), each of which can provide a portion of the full functionality of an FPGA logic element (“LE”). The functionality of each FPGA LE implementing a user's logic design can be mapped to one or more HLEs without re-synthesis of the user's logic. Only as many HLEs as are necessary are used to perform the functions of each LE. The one-for-one equivalence between each LE and either (1) one HLE or (2) a group of HLEs facilitates mapping (without re-synthesis) in either direction between FPGA and ASIC designs.

Abstract: Providing ASIC equivalents of FPGAs is facilitated and made more efficient and economical by using an ASIC architecture including a plurality of so-called hybrid logic elements (“HLEs”), each of which can provide a portion of the full functionality of an FPGA logic element (“LE”). The functionality of each FPGA LE implementing a user's logic design can be mapped to one or more HLEs without re-synthesis of the user's logic. Only as many HLEs as are necessary are used to perform the functions of each LE. The one-for-one equivalence between each LE and either (1) one HLE or (2) a group of HLEs facilitates mapping (without re-synthesis) in either direction between FPGA and ASIC designs.

Abstract: Providing ASIC equivalents of FPGAs is facilitated and made more efficient and economical by using an ASIC architecture including a plurality of so-called hybrid logic elements (“HLEs”), each of which can provide a portion of the full functionality of an FPGA logic element (“LE”). The functionality of each FPGA LE implementing a user's logic design can be mapped to one or more HLEs without re-synthesis of the user's logic. Only as many HLEs as are necessary are used to perform the functions of each LE. The one-for-one equivalence between each LE and either (1) one HLE or (2) a group of HLEs facilitates mapping (without re-synthesis) in either direction between FPGA and ASIC designs.

Abstract: Providing ASIC equivalents of FPGAs is facilitated and made more efficient and economical by using an ASIC architecture including a plurality of so-called hybrid logic elements (“HLEs”), each of which can provide a portion of the full functionality of an FPGA logic element (“LE”). The functionality of each FPGA LE implementing a user's logic design can be mapped to one or more HLEs without re-synthesis of the user's logic. Only as many HLEs as are necessary are used to perform the functions of each LE. The one-for-one equivalence between each LE and either (1) one HLE or (2) a group of HLEs facilitates mapping (without re-synthesis) in either direction between FPGA and ASIC designs.

Abstract: Providing ASIC equivalents of FPGAs is facilitated and made more efficient and economical by using an ASIC architecture including a plurality of so-called hybrid logic elements (“HLEs”), each of which can provide a portion of the full functionality of an FPGA logic element (“LE”). The functionality of each FPGA LE implementing a user's logic design can be mapped to one or more HLEs without re-synthesis of the user's logic. Only as many HLEs as are necessary are used to perform the functions of each LE. The one-for-one equivalence between each LE and either (1) one HLE or (2) a group of HLEs facilitates mapping (without re-synthesis) in either direction between FPGA and ASIC designs.

Abstract: Providing ASIC equivalents of FPGAs is facilitated and made more efficient and economical by using an ASIC architecture including a plurality of so-called hybrid logic elements (“HLEs”), each of which can provide a portion of the full functionality of an FPGA logic element (“LE”). The functionality of each FPGA LE implementing a user's logic design can be mapped to one or more HLEs without re-synthesis of the user's logic. Only as many HLEs as are necessary are used to perform the functions of each LE. The one-for-one equivalence between each LE and either (1) one HLE or (2) a group of HLEs facilitates mapping (without re-synthesis) in either direction between FPGA and ASIC designs.

Abstract: Methods and apparatus for programmably powering down a structured application-specific integrated circuit are provided. At least one of the programmable layers of the structured ASIC that frequently provides some programmability as between or among a small number of alternative functions is used to provide this programmability.