Patents by Inventor HEE MING HWANG

HEE MING HWANG has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Post Chemical Mechanical Planarization (CMP) Cleaning
    Publication number: 20240026246
    Abstract: The present invention provides a cleaning composition comprises water; one or more organic acid; at least two surfactants wherein the first type surfactant is a diphenyl disulfonic surfactant, the second type surfactant has a surface tension of less than 50 dynes/cm at 0.01 wt % concentration in water, and the second type surfactant is not the first type surfactant; and optionally fluoride compounds, polymers, corrosion inhibitors, biological preservatives, pH adjusting agents.
    Type: Application
    Filed: August 26, 2021
    Publication date: January 25, 2024
    Inventors: Dnyanesh Tamboli, HEE MING HWANG, JEONG YUN YU