Patents by Inventor Hee-Mo Koo

Hee-Mo Koo has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Semiconductor chip molding apparatus and method of detecting when a lead frame has been improperly positioned in the same
    Publication number: 20040222567
    Abstract: A semiconductor chip molding apparatus includes an upper platen including an upper mold, a lower platen including a lower mold having a molding block configured to receive a lead frame, a controller, and an electrical detector for forming an electrical circuit between the controller and the lead frame when the lead frame is oriented improperly on the lower mold. A low-level test voltage is imparted to at least the lower mold. As a result, an electrical signal will flow from the detecting block when the lead frame rests on the detecting block. When such a signal is detected, therefore, the lead frame is determined as having been improperly set on the molding block. The signal generated is detected by a controller and used thereby to interrupt the operation of the molding apparatus.
    Type: Application
    Filed: June 15, 2004
    Publication date: November 11, 2004
    Inventors: Kyung-Soo Park, Sung-Soo Lee, Hee-Mo Koo
  • Semiconductor chip molding apparatus and method of detecting when a lead frame has been improperly positioned in the same
    Patent number: 6776598
    Abstract: A semiconductor chip molding apparatus includes an upper platen including an upper mold, a lower platen including a lower mold having a molding block configured to receive a lead frame, a controller, and an electrical detector for forming an electrical circuit between the controller and the lead frame when the lead frame is oriented improperly on the lower mold. A low-level test voltage is imparted to at least the lower mold. As a result, an electrical signal will flow from the detecting block when the lead frame rests on the detecting block. When such a signal is detected, therefore, the lead frame is determined as having been improperly set on the molding block. The signal generated is detected by a controller and used thereby to interrupt the operation of the molding apparatus.
    Type: Grant
    Filed: April 19, 2002
    Date of Patent: August 17, 2004
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Kyung-Soo Park, Sung-Soo Lee, Hee-Mo Koo
  • Semiconductor chip molding apparatus and method of detecting when a lead frame has been improperly positioned in the same
    Publication number: 20030030187
    Abstract: A semiconductor chip molding apparatus includes an upper platen including an upper mold, a lower platen including a lower mold having a molding block configured to receive a lead frame, a controller, and an electrical detector for forming an electrical circuit between the controller and the lead frame when the lead frame is oriented improperly on the lower mold. A low-level test voltage is imparted to at least the lower mold. As a result, an electrical signal will flow from the detecting block when the lead frame rests on the detecting block. When such a signal is detected, therefore, the lead frame is determined as having been improperly set on the molding block. The signal generated is detected by a controller and used thereby to interrupt the operation of the molding apparatus.
    Type: Application
    Filed: April 19, 2002
    Publication date: February 13, 2003
    Inventors: Kyung-Soo Park, Sung-Soo Lee, Hee-Mo Koo