Abstract: Disclosed herein is a method for manufacturing a dental model including a model base (2) on which dental-model bodies (1) for upper and lower jaws are disposed. The method includes: a scanning operation (100) of scanning teeth or a dental impression of a patient and obtaining dental information about the shape of target teeth; an image model creation operation (200) of conducting imagification based on the dental information obtained in the scanning operation and thus embodying an image model; and a CAM processing operation (300) of forming a dental model (3) through a milling process using CAM based on the image model. The image model and the dental model respectively obtained in the image model creation operation and the CAM processing operation are designed and formed such that a dental-model body of the target teeth and the model base are integrated with each other.

Abstract: Disclosed herein is a dental model articulator. The dental model articulator includes: a pair of base members (3) to which dental models (2) are fastened; and an upper fastening means (5) and a lower fastening means (6) to which the respective base members are removably fastened, and which are rotatably coupled to each other by a rotating shaft. A fastening hole (8) is formed through the end of each of the base members. An insert rod (9) is provided on each of the upper fastening means and the lower fastening means and is fitted into the fastening hole of the corresponding base member. Each of the upper fastening means and the lower fastening means includes an auxiliary fastening means (10) for pushing the corresponding base member so that pressure is applied to the base member toward the insert rod, thus increasing a base member fastening force.

Abstract: Provided is a carrier module for use in a handler for handling a packaged chip for a test, the carrier module including a body provided, a base plate where the packaged chips are placed, provided to the body, and at least one latch which holds the packaged chips in position in the base plate.

Abstract: A test handler, a packaged chip loading method, a test tray transferring method, and a packaged chip manufacturing method are provided. The test handler may include a loading unit, a chamber system, an unloading unit, at least one rotating unit and a transferring unit. The loading unit may include a loading buffer disposed to be movable along a moving path formed over a loading position and a loading picker to perform a loading process on the test tray located at the loading position. The chamber system having the packaged chips connected to a hi-fix board and tested. The unloading unit may include an unloading picker to perform an unloading process on the test tray located at an unloading position. The at least one rotating unit may be disposed between the loading unit and the unloading unit to rotate the test tray transferred from the loading unit from a horizontal posture to a vertical posture, and to rotate the test tray transferred from the chamber system from a vertical posture to a horizontal posture.

Abstract: The present invention relates to an apparatus for correcting position of a user tray including at least one first position member and at least one second position member that determine position of a user tray, a plate where the user tray is received, a first correcting unit that moves the user tray in a direction where the first position member is installed, a second correcting unit that moves the user tray in a direction where the second position member is installed, and an operating unit that operates the first correcting unit and the second correcting unit, which has a simple configuration, and moves a user tray to the accurate position, thereby reducing manufacturing costs and maintenance costs

Abstract: A test handler, a method for unloading packaged chips, a method for transferring test trays, and a method for manufacturing packaged chips are provided. The test handler may include: a loading unit having a loading picker to perform a loading process on a test tray located at a loading position, a chamber system in which the packaged chips contained in the test tray transferred from the loading unit are connected to a hi-fix board and tested, and an unloading unit having at least one unloading buffer to move along an unloading moving path formed over a test tray located at an unloading position and an unloading picker to perform an unloading process on the test tray located at the unloading position. The test handler may further include a passage site disposed between the loading unit and the unloading unit and connecting the loading unit and the unloading unit to the chamber system, and a transferring unit transferring the test trays.

Abstract: A test handler, a packaged chip loading method, a test tray transferring method, and a packaged chip manufacturing method are provided. The test handler may include a loading unit, a chamber system, an unloading unit, at least one rotating unit and a transferring unit. The loading unit may include a loading buffer disposed to be movable along a moving path formed over a loading position and a loading picker to perform a loading process on the test tray located at the loading position. The chamber system having the packaged chips connected to a hi-fix board and tested. The unloading unit may include an unloading picker to perform an unloading process on the test tray located at an unloading position. The at least one rotating unit may be disposed between the loading unit and the unloading unit to rotate the test tray transferred from the loading unit from a horizontal posture to a vertical posture, and to rotate the test tray transferred from the chamber system from a vertical posture to a horizontal posture.

Abstract: A hi-fix board, a test tray, a test handler, and a packaged chip manufacturing method are provided. The hi-fix board includes: test sockets to which packaged chips to be tested are connected; and a main frame in which the test sockets are disposed in at least one first area to form an a×b matrix (where a and b are integers greater than 0) and the test sockets are disposed in at least one second area to form a c×d matrix (where c is an integer greater than a and d is an integer greater than 0). By allowing the test tray to contain more packaged chips at a time and minimizing a difference in length between a horizontal direction and a vertical direction, it is possible to reduce the index time. By allowing all the packaged chips contained in a test tray to be subjected to a testing process at the same time, it is possible to reduce the time for the testing process and to enhance the stability.

Abstract: A carrier for carrying a packaged chip includes a housing having a space into which the packaged chip is placed and at least one guiding hole formed between outside and inside lateral surfaces thereof A moving block moves along the guiding hole and engages with a latch, which is also provided in the guiding hole. The latch rotates to hold and release a packaged chip placed into the space. Corresponding steps on the moving block and the latch prevent the latch from rotating when the moving block makes small movements caused by jolts or shocks.

Abstract: A carrier for carrying a packaged chip includes a housing having a holding space and at least one guiding hole. A guiding block ascends and descends along the guiding hole. A latch moves backwards and forwards as the guiding block ascends and descends to move into and out of the holding space.

Abstract: Provided is a sorting system for handling packaged chips for testing and sorting the packaged chips by grade, capable of performing loading and unloading operations, independently of a testing operation. The sorting system includes a loading unit including a loading picker, an unloading unit provided adjacent to the loading unit, a rack in which to store at least one test tray containing the packaged chips intended for the tests and at least one test tray containing the tested packaged chips, an exchanging site where the test tray containing the packaged chips intended for the tests and the test tray containing the tested packaged chips are exchanged with the rack, and a transferring unit transferring the test tray between the loading position, the exchanging site, and the unloading position.

Abstract: Provided is a method for transferring test trays in a handler including a second chamber having two test sites arranged in parallel, a first chamber having a plurality of passages along which a plurality of test trays are horizontally moved, provided over the second chamber, and a third chamber having a plurality of passages along which the plurality of test trays are horizontally moved, provided under the second chamber, the method including steps of (a) enabling two test trays to wait in parallel in a horizontal position at a waiting location provided to a forward section of the handler, (b) loading packaged chips onto the two test trays, (c) rotating the two test trays to be in the upright position, (d) moving upwards the two test trays into the first chamber, (e) heating or cooling the two test trays while moving horizontally the two test trays forward in the first chamber, (f) moving downward the two test trays from the first chamber into the second chamber, (g) moving horizontally the two test trays tow

Abstract: Provided is a carrier module for use in a handler for handling a packaged chip for a test, the carrier module including a body provided, a base plate where the packaged chips are placed, provided to the body, and at least one latch which holds the packaged chips in position in the base plate.