Patents by Inventor Hee-Sam Kim

Hee-Sam Kim has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Electrostatic chuck and apparatus for processing a substrate including the same
    Patent number: 9583371
    Abstract: An ESC may include a dielectric layer, an electrode, a pedestal, a heater, an adhesive and a protecting ring. The dielectric layer may be configured to support a substrate. The electrode may be disposed in the dielectric layer and is configured to form plasma over the substrate. The pedestal may be disposed under the dielectric layer. The heater may be disposed between the pedestal and the dielectric layer and is configured to heat the substrate. The adhesive may be disposed between the pedestal and the heater, and between the heater and the dielectric layer. The protecting ring may be configured to surround the adhesive. The protecting ring may include a plasma-resistant material.
    Type: Grant
    Filed: December 17, 2013
    Date of Patent: February 28, 2017
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Jea-Eun Jess Shim, Jin-Man Kim, Hee-Sam Kim, Jong-Bum Park, Kwang-Bo Sim, Sang-Young Lee
  • ELECTROSTATIC CHUCK AND APPARATUS FOR PROCESSING A SUBSTRATE INCLUDING THE SAME
    Publication number: 20150170951
    Abstract: An ESC may include a dielectric layer, an electrode, a pedestal, a heater, an adhesive and a protecting ring. The dielectric layer may be configured to support a substrate. The electrode may be disposed in the dielectric layer and is configured to form plasma over the substrate. The pedestal may be disposed under the dielectric layer. The heater may be disposed between the pedestal and the dielectric layer and is configured to heat the substrate. The adhesive may be disposed between the pedestal and the heater, and between the heater and the dielectric layer. The protecting ring may be configured to surround the adhesive. The protecting ring may include a plasma-resistant material.
    Type: Application
    Filed: December 17, 2013
    Publication date: June 18, 2015
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Jea-Eun Jess Shim, Jin-Man Kim, Hee-Sam Kim, Jong-Bum Park, Kwang-Bo Sim, Sang-Young Lee