Patents by Inventor Hee Seok Choi
Hee Seok Choi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
-
Patent number: 11976396Abstract: The present disclosure relates to a method for producing a nonwoven fabric that improves filtration performance when applied as a filter material. By adjusting the modification ratio of the Y-shaped cross-section of polyester filaments constituting the nonwoven fabric, when applied to a filter by increasing a specific surface area of the nonwoven fabric, it increases the collection amount of the materials to be filtered and maintains a low differential pressure, thus enabling long-term use.Type: GrantFiled: June 11, 2019Date of Patent: May 7, 2024Assignee: KOLON INDUSTRIES, INC.Inventors: Woo-seok Choi, Min-ho Lee, Hee-jung Cho, Young-shin Park, Jung-soon Jang
-
Patent number: 11970674Abstract: The present disclosure relates to a method for preparing a non-woven fabric which improves impregnation and release properties of a fabric softener in the non-woven fabric in order to apply the non-woven fabric to a dryer sheet (sheet-type fabric softener). When increasing porosity and specific surface area in a non-woven fabric made of two-component blended polyester long fibers, impregnation and release rate of a fabric softener are improved even when the non-woven fabric is lightened, making it possible to apply the non-woven fabric to a dryer sheet.Type: GrantFiled: December 19, 2019Date of Patent: April 30, 2024Assignee: KOLON INDUSTRIES, INC.Inventors: Young-shin Park, Min-ho Lee, Jung-soon Jang, Hee-jung Cho, Woo-seok Choi
-
Patent number: 11956980Abstract: Discussed is an organic light emitting device in which a light emitting layer includes a host and different kinds of dopants, the fluorescent dopant is formed of a material having energy level properties facilitating thermally activated delayed fluorescence (TADF), and thus energy is concentratedly transferred to the fluorescent dopant so as to increase luminous efficacy of a single color.Type: GrantFiled: December 24, 2020Date of Patent: April 9, 2024Assignee: LG DISPLAY CO., LTD.Inventors: Gyeong-Woo Kim, Hong-Seok Choi, Seung-Ryong Joung, Jun-Ho Lee, Yoon-Deok Han, Hee-Su Byeon
-
Patent number: 10636944Abstract: A semiconductor light-emitting device is provided. The semiconductor light-emitting device may include a light-emitting structure, an electrode, an ohmic layer, an electrode layer, an adhesion layer, and a channel layer. The light-emitting structure may include a compound semiconductor layer. The electrode may be disposed on the light-emitting structure. The ohmic layer may be disposed under the light-emitting structure. The electrode layer may include a reflective metal under the ohmic layer. The adhesion layer may be disposed under the electrode layer. The channel layer may be disposed along a bottom edge of the light-emitting structure.Type: GrantFiled: March 6, 2018Date of Patent: April 28, 2020Assignee: LG INNOTEK CO., LTD.Inventors: Hwan Hee Jeong, Sang Youl Lee, June O Song, Tchang Hun Oh, Hee Seok Choi, Kwang Ki Choi
-
Publication number: 20180198030Abstract: A semiconductor light-emitting device is provided. The semiconductor light-emitting device may include a light-emitting structure, an electrode, an ohmic layer, an electrode layer, an adhesion layer, and a channel layer. The light-emitting structure may include a compound semiconductor layer. The electrode may be disposed on the light-emitting structure. The ohmic layer may be disposed under the light-emitting structure. The electrode layer may include a reflective metal under the ohmic layer. The adhesion layer may be disposed under the electrode layer. The channel layer may be disposed along a bottom edge of the light-emitting structure.Type: ApplicationFiled: March 6, 2018Publication date: July 12, 2018Inventors: Hwan Hee JEONG, Sang Youl Lee, June O Song, Tchang Hun Oh, Hee Seok Choi, Kwang Ki Choi
-
Patent number: 9935245Abstract: A semiconductor light-emitting device is provided. The semiconductor light-emitting device may include a light-emitting structure, an electrode, an ohmic layer, an electrode layer, an adhesion layer, and a channel layer. The light-emitting structure include a compound semiconductor layer. The electrode may be disposed on the light-emitting structure. The ohmic layer may be disposed under the light-emitting structure. The electrode layer may include a reflective metal under the ohmic layer. The adhesion layer may be disposed under the electrode layer. The channel layer may be disposed along a bottom edge of the light-emitting structure.Type: GrantFiled: February 15, 2017Date of Patent: April 3, 2018Assignee: LG INNOTEK CO., LTD.Inventors: Hwan Hee Jeong, Sang Youl Lee, June O Song, Tchang Hun Oh, Hee Seok Choi, Kwang Ki Choi
-
Patent number: 9893235Abstract: A light emitting device is provided a transmissive substrate; a first pattern portion including a protrusions; a second pattern portion including a concaves having a width smaller than a width of each protrusion; a light emitting structure including a first conductive semiconductor layer, a second conductive semiconductor layer and an active layer, under the transmissive substrate; a first electrode under the first conductive semiconductor layer; a reflective electrode layer under the second conductive semiconductor layer; a second electrode under the reflective electrode layer; a first connection electrode under the first electrode; a second connection electrode under the second electrode; and an insulating support member around the first electrode and the first connection electrode and around the second electrode and the second connection electrode. A transmissive resin layer is on the transmissive substrate and an insulating layer is between the insulating support member and the reflective electrode layer.Type: GrantFiled: February 10, 2015Date of Patent: February 13, 2018Assignee: LG INNOTEK CO., LTDInventors: Pil Geun Kang, Hee Seok Choi, Seok Beom Choi, Ju Won Lee, Deok Ki Hwang, Young Ju Han
-
Publication number: 20170162753Abstract: A semiconductor light-emitting device is provided. The semiconductor light-emitting device may include a light-emitting structure, an electrode, an ohmic layer, an electrode layer, an adhesion layer, and a channel layer. The light-emitting structure include a compound semiconductor layer. The electrode may be disposed on the light-emitting structure. The ohmic layer may be disposed under the light-emitting structure. The electrode layer may include a reflective metal under the ohmic layer. The adhesion layer may be disposed under the electrode layer. The channel layer may be disposed along a bottom edge of the light-emitting structure.Type: ApplicationFiled: February 15, 2017Publication date: June 8, 2017Inventors: Hwan Hee JEONG, Sang Youl LEE, June O SONG, Tchang Hun OH, Hee Seok CHOI, Kwang Ki CHOI
-
Patent number: 9673366Abstract: A light emitting device may be provided that includes a substrate, a light emitting structure, a first electrode on a part of the first semiconductor layer, an electrode layer on the second conductive semiconductor layer, an insulating layer on the electrode layer, a second electrode on the electrode layer, a support member on the insulating layer, a first connection electrode connected to the first electrode, and a second connection electrode connected to the second electrode. The insulating layer is disposed on a side surface of the light emitting structure and the part of the first semiconductor layer. The insulating layer includes a first layer and a second layer having a different material from the first layer. The first layer of the insulating layer has a refractive index different from the second layer of the insulating layer.Type: GrantFiled: October 28, 2015Date of Patent: June 6, 2017Assignee: LG Innotek Co., Ltd.Inventors: Deok Ki Hwang, Young Ju Han, Hee Seok Choi, Ju Won Lee, Pil Geun Kang, Seok Beom Choi
-
Patent number: 9666775Abstract: A light emitting device package including a package body including a recess which is provided with a bottom face and a plurality of inner walls surrounding the bottom face, the plurality of inner walls including a first inner wall and a second inner wall, which are opposing walls; a lead frame including a first portion disposed on the bottom face of the package body and at least one second portion extending from the first portion, the first portion including a planar upper surface exposed at the bottom face and a planar lowermost surface positioned opposite to the planar upper surface; a light emitting element provided on the planar upper surface of the first portion; and a transparent material provided in the recess of the package body to cover the light emitting element.Type: GrantFiled: December 16, 2016Date of Patent: May 30, 2017Assignee: LG INNOTEK CO., LTD.Inventors: Sung Min Kong, Choong Youl Kim, Hee Seok Choi
-
Publication number: 20170104142Abstract: A light emitting device package including a package body including a recess which is provided with a bottom face and a plurality of inner walls surrounding the bottom face, the plurality of inner walls including a first inner wall and a second inner wall, which are opposing walls; a lead frame including a first portion disposed on the bottom face of the package body and at least one second portion extending from the first portion, the first portion including a planar upper surface exposed at the bottom face and a planar lowermost surface positioned opposite to the planar upper surface; a light emitting element provided on the planar upper surface of the first portion; and a transparent material provided in the recess of the package body to cover the light emitting element.Type: ApplicationFiled: December 16, 2016Publication date: April 13, 2017Applicant: LG INNOTEK CO., LTD.Inventors: Sung Min KONG, Choong Youl KIM, Hee Seok CHOI
-
Patent number: 9608169Abstract: A semiconductor light-emitting device is provided. The semiconductor light-emitting device may include a light-emitting structure, an electrode, an ohmic layer, an electrode layer, an adhesion layer, and a channel layer. The light-emitting structure may include a compound semiconductor layer. The electrode may be disposed on the light-emitting structure. The ohmic layer may be disposed under the light-emitting structure. The electrode layer may include a reflective metal under the ohmic layer. The adhesion layer may be disposed under the electrode layer. The channel layer may be disposed along a bottom edge of the light-emitting structure.Type: GrantFiled: July 13, 2015Date of Patent: March 28, 2017Assignee: LG INNOTEK CO., LTD.Inventors: Hwan Hee Jeong, Sang Youl Lee, June O Song, Tchang Hun Oh, Hee Seok Choi, Kwang Ki Choi
-
Patent number: 9595640Abstract: Disclosed are a light emitting device, a light emitting device package and a light emitting module. The light emitting device includes a light emitting structure including a first conductive semiconductor layer, a second conductive semiconductor layer and an active layer between the first and second conductive semiconductor layers; a support member under the light emitting structure; a reflective electrode layer between the second conductive semiconductor layer and the support member; and first to third connection electrodes spaced apart from each other in the support member. The second connection electrode is disposed between the first and third connection electrodes, the first and third connection electrodes are electrically connected with each other, and the support member is disposed at a peripheral portion of the first to third connection electrodes.Type: GrantFiled: January 2, 2013Date of Patent: March 14, 2017Assignee: LG Innotek Co., Ltd.Inventors: Seok Hun Bae, Seok Beom Choi, Pil Geun Kang, Deok Ki Hwang, Young Ju Han, Hee Seok Choi, Young Rok Park, Tae Don Lee, Hyun Sung Oh, Jee Hue Joo, Dong Woo Kang, Sung Sig Kim
-
Patent number: 9559275Abstract: Disclosed is a light emitting device package. The light emitting device is a package body including a first recess which is provided with a bottom face and a plurality of inner walls surrounding the bottom face the plurality of inner walls including a first inner wall and a second inner wall, which are opposing walls; a lead frame exposed at the bottom face of the package body, the lead frame including a bottom frame and a reflector exposed along one of the first inner wall and the second inner wall; a light emitting element provided on the lead frame; and a transparent material provided in the package body to cover the light emitting element. A material of the reflector is a same as a material of the bottom frame of the lead frame.Type: GrantFiled: December 29, 2015Date of Patent: January 31, 2017Assignee: LG INNOTEK CO., LTD.Inventors: Sung Min Kong, Choong Youl Kim, Hee Seok Choi
-
Patent number: 9397261Abstract: A light emitting device is provided a transmissive substrate; a first pattern portion including a protrusions; a second pattern portion including a concaves having a width smaller than a width of each protrusion; a light emitting structure under the transmissive substrate and including a first conductive semiconductor layer, a second conductive semiconductor layer and an active layer; a first electrode under the first conductive semiconductor layer; a reflective electrode layer under the second conductive semiconductor layer; a second electrode under the reflective electrode layer; a first connection electrode under the first electrode; a second connection electrode under the second electrode; and an insulating support member around the first electrode and the first connection electrode and around the second electrode and the second connection electrode and including a ceramic-based thermal diffusion agent.Type: GrantFiled: November 15, 2012Date of Patent: July 19, 2016Assignee: LG Innotek Co., Ltd.Inventors: Pil Geun Kang, Hee Seok Choi, Seok Beom Choi, Ju Won Lee, Deok Ki Hwang, Young Ju Han
-
Publication number: 20160149102Abstract: Disclosed is a light emitting device package. The light emitting device is a package body including a first recess which is provided with a bottom face and a plurality of inner walls surrounding the bottom face the plurality of inner walls including a first inner wall and a second inner wall, which are opposing walls; a lead frame exposed at the bottom face of the package body, the lead frame including a bottom frame and a reflector exposed along one of the first inner wall and the second inner wall; a light emitting element provided on the lead frame; and a transparent material provided in the package body to cover the light emitting element. A material of the reflector is a same as a material of the bottom frame of the lead frame.Type: ApplicationFiled: December 29, 2015Publication date: May 26, 2016Applicant: LG INNOTEK CO., LTD.Inventors: Sung Min KONG, Choong Youl KIM, Hee Seok CHOI
-
Patent number: 9269878Abstract: A light emitting device may be provided that includes a substrate, a light emitting structure, a first electrode under the first semiconductor layer, a reflective electrode layer under the second conductive semiconductor layer, a second electrode under the reflective electrode layer, and a support member under the first semiconductor layer and the reflective electrode layer around the first and second electrodes. A first connection electrode may be provided under the first electrode. At least a part of the first connection electrode is provided in the support member. A second connection electrode may be provided under the second electrode At least a part of the second connection electrode may be provided in the support member.Type: GrantFiled: November 10, 2011Date of Patent: February 23, 2016Assignee: LG INNOTEK CO., LTD.Inventors: Deok Ki Hwang, Young Ju Han, Hee Seok Choi, Ju Won Lee, Pil Geun Kang, Seok Beom Choi
-
Publication number: 20160049546Abstract: A light emitting device may be provided that includes a substrate, a light emitting structure, a first electrode on a part of the first semiconductor layer, an electrode layer on the second conductive semiconductor layer, an insulating layer on the electrode layer, a second electrode on the electrode layer, a support member on the insulating layer, a first connection electrode connected to the first electrode, and a second connection electrode connected to the second electrode. The insulating layer is disposed on a side surface of the light emitting structure and the part of the first semiconductor layer. The insulating layer includes a first layer and a second layer having a different material from the first layer. The first layer of the insulating layer has a refractive index different from the second layer of the insulating layer.Type: ApplicationFiled: October 28, 2015Publication date: February 18, 2016Inventors: Deok Ki HWANG, Young Ju HAN, Hee Seok CHOI, Ju Won LEE, Pil Geun KANG, Seok Beom CHOI
-
Patent number: 9257613Abstract: Disclosed is a semiconductor light emitting device. The light emitting device includes a first conductive type semiconductor layer; an active layer on the first conductive type semiconductor layer; and a first electrode pad including a plurality of reflective layers on the first conductive type semiconductor layer.Type: GrantFiled: February 5, 2013Date of Patent: February 9, 2016Assignee: LG INNOTEK CO., LTD.Inventors: Geun Ho Kim, Sung Kyoon Kim, Hee Seok Choi
-
Patent number: 9252347Abstract: Disclosed is a light emitting device package. The light emitting device package includes a package body having a first cavity and a second cavity; a plurality of reflective frames comprising a first reflective frame and a second reflective frame on the first cavity and the second cavity, respectively, and each of the first reflective frame and the second reflective frame comprises a bottom frame and at least two side wall frames extending from the bottom frame; and a light emitting device on the first reflective frame, wherein the first reflective frame and the second reflective frame are electrically separated from each other.Type: GrantFiled: March 4, 2015Date of Patent: February 2, 2016Assignee: LG INNOTEK CO., LTD.Inventors: Sung Min Kong, Choong Youl Kim, Hee Seok Choi