Patents by Inventor Hee Soo Song

Hee Soo Song has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240370619
    Abstract: An integrated circuit layout includes: a first chip area; and a second chip area, wherein the first chip area includes: a first main area including a first main pattern; a first mark area adjacent to the first main area, wherein a first mark pattern is formed in the first mark area; and a first dummy area including a first dummy pattern, wherein the second chip area includes: a second main area including a second main pattern; a second mark area adjacent to the second main area, wherein a second mark pattern is formed in the second mark area; and a second dummy area including a second dummy pattern, wherein the first and second mark patterns are used to check alignment states of the first chip area and the second chip area, respectively, and wherein each of the first and second mark patterns has a standard cell structure.
    Type: Application
    Filed: December 29, 2023
    Publication date: November 7, 2024
    Inventors: Hyung Keun PARK, Myung Soo NOH, Da Woon CHOI, Bong Keun KIM, Yun Kyoung SONG, Hee JEONG
  • Publication number: 20160044767
    Abstract: Disclosed is a transparent electrode implementing high transmissivity while preventing static electricity. The transparent electrode includes a transparent film arranged on a transparent substrate, a static electricity prevention film arranged on the transparent film, and an electrode layer arranged on the static electricity prevention film. Here, the transparent film has a thickness of 180 ? to 220 ?, the static electricity prevention film has a thickness of 550 ? to 750 ?, and the electrode layer has a thickness of 180 ? to 220 ?.
    Type: Application
    Filed: April 24, 2015
    Publication date: February 11, 2016
    Inventors: Young Ho DO, Hee Soo SONG, Maeng Hyun KIM
  • Patent number: 8289314
    Abstract: A method of modulating and demodulating a signal includes modulating data information included in an input data signal provided from an external source and clock information included in an input clock signal provided from the external source into a transmission signal, using (n+1) delay clock signals generated based on the input clock signal, where n is a natural number. The transmission signal is demodulated into an output clock signal including restored clock information and an output data signal including restored data information, using (m+1) delay clock signals generated based on the clock information, where m is a natural number less than n.
    Type: Grant
    Filed: September 29, 2009
    Date of Patent: October 16, 2012
    Assignees: Samsung Electronics Co., Ltd., Seoul National University R&DB Foundation
    Inventors: Weon-Jun Choe, Ah-Reum Kim, Kyo-Jin Choo, Deog-Kyoon Jeong, Do-Hwan Oh, Hee-Soo Song
  • Publication number: 20100238157
    Abstract: A method of modulating and demodulating a signal includes modulating data information included in an input data signal provided from an external source and clock information included in an input clock signal provided from the external source into a transmission signal, using (n+1) delay clock signals generated based on the input clock signal, where n is a natural number. The transmission signal is demodulated into an output clock signal including restored clock information and an output data signal including restored data information, using (m+1) delay clock signals generated based on the clock information, where m is a natural number less than n.
    Type: Application
    Filed: September 29, 2009
    Publication date: September 23, 2010
    Applicants: SAMSUNG ELECTRONICS CO., LTD., SEOUL NATIONAL UNIVERSITY R&DB FOUNDATION
    Inventors: Weon-Jun CHOE, Ah-Reum KIM, Kyo-Jin CHOO, Deog-Kyoon JEONG, Do-Hwan OH, Hee-Soo SONG
  • Publication number: 20070273285
    Abstract: There is provided a surface light source comprising a plurality of discharge channels, in which each end of the outermost discharge channel is expanded towards a sealing part. At least one of the plurality of discharge channels may include a curved surface part and a flat surface part on a top surface thereof. Both ends of the discharge channel may be formed to be higher than a middle portion thereof, and the discharge channels may be formed to be different in height. Accordingly, the discharge characteristic is improved and bad luminance uniformity is solved by variously changing the shape of the discharge channel forming the discharge space in a surface light source. Furthermore, the present invention solves the problems, such as failure in lighting at low temperature, channeling between adjacent channels, and maintains the quality of molded products.
    Type: Application
    Filed: May 29, 2007
    Publication date: November 29, 2007
    Applicant: SAMSUNG CORNING CO.,LTD.
    Inventors: Jae Seon HONG, Keon Yong Kim, Tae Soo Lee, Hee Soo Song, Dae Sung Kim, Keun Yung Kim
  • Patent number: 6893544
    Abstract: An in-line sputtering system for depositing a thin film on a substrate includes a buffer heating module, an entry transfer module adjacent to the buffer heating module and having an expedited conveyor device for moving the substrate therein and a first sputtering module for depositing the thin film on the substrate, which is adjacent to the entry transfer module. The entry transfer module serves as a buffer zone which mitigates fluctuations in temperature and pressure in the first sputtering module when the substrate is unloaded from the buffer heating module. The substrate in the entry transfer module is moved by the expedited conveyor device at a speed greater than that in the first sputtering module.
    Type: Grant
    Filed: August 14, 2002
    Date of Patent: May 17, 2005
    Assignee: Samsung Corning Co., Ltd.
    Inventors: Hee Soo Song, Sung Wan Park
  • Publication number: 20030033983
    Abstract: An in-line sputtering system for depositing a thin film on a substrate includes a buffer heating module, an entry transfer module adjacent to the buffer heating module and having an expedited conveyor device for moving the substrate therein and a first sputtering module for depositing the thin film on the substrate, which is adjacent to the entry transfer module. The entry transfer module serves as a buffer zone which mitigates fluctuations in temperature and pressure in the first sputtering module when the substrate is unloaded from the buffer heating module. The substrate in the entry transfer module is moved by the expedited conveyor device at a speed greater than that in the first sputtering module.
    Type: Application
    Filed: August 14, 2002
    Publication date: February 20, 2003
    Inventors: Hee Soo Song, Sung Wan Park