Patents by Inventor Hee Soo Yeo

Hee Soo Yeo has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Textured silicon substrate and method
    Patent number: 9673342
    Abstract: A method of texturizing a silicon substrate comprising a) contacting the substrate with an etching solution comprising glycolic acid, b) etching a surface of the substrate thereby forming disruptions in said surface of the substrate, and c) removing the etching solution to yield a texturized substrate, said texturized substrate having a plurality of disruptions in at least one surface with a surface density of disruptions of a minimum of 60 disruptions in a 400 micron square area.
    Type: Grant
    Filed: January 19, 2015
    Date of Patent: June 6, 2017
    Assignee: THE CHEMOURS COMPANY FC, LLC
    Inventors: Seung Jin Lee, Hee Soo Yeo
  • TEXTURED SILICON SUBSTRATE AND METHOD
    Publication number: 20160315207
    Abstract: A method of texturizing a silicon substrate comprising a) contacting the substrate with an etching solution comprising glycolic acid, b) etching a surface of the substrate thereby forming disruptions in said surface of the substrate, and c) removing the etching solution to yield a texturized substrate, said texturized substrate having a plurality of disruptions in at least one surface with a surface density of disruptions of a minimum of 60 disruptions in a 400 micron square area.
    Type: Application
    Filed: January 19, 2015
    Publication date: October 27, 2016
    Inventors: SEUNG JIN LEE, HEE SOO YEO
  • Textured silicon substrate and method
    Patent number: 8940178
    Abstract: A method of texturizing a silicon substrate comprising a) contacting the substrate with an etching solution comprising glycolic acid, b) etching a surface of the substrate thereby forming disruptions in said surface of the substrate, and c) removing the etching solution to yield a texturized substrate, said texturized substrate having a plurality of disruptions in at least one surface with a surface density of disruptions of a minimum of 60 disruptions in a 400 micron square area.
    Type: Grant
    Filed: March 18, 2009
    Date of Patent: January 27, 2015
    Assignee: E I du Pont de Nemours and Company
    Inventors: Seung Jin Lee, Hee Soo Yeo
  • TEXTURED SILICON SUBSTRATE AND METHOD
    Publication number: 20100239818
    Abstract: A method of texturizing a silicon substrate comprising a) contacting the substrate with an etching solution comprising glycolic acid, b) etching a surface of the substrate thereby forming disruptions in said surface of the substrate, and c) removing the etching solution to yield a texturized substrate, said texturized substrate having a plurality of disruptions in at least one surface with a surface density of disruptions of a minimum of 60 disruptions in a 400 micron square area.
    Type: Application
    Filed: March 18, 2009
    Publication date: September 23, 2010
    Inventors: Seung Jin Lee, Hee Soo Yeo