Patents by Inventor Hee Suck Kim

Hee Suck Kim has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Corrosion-resistant lead frame
    Patent number: 5838062
    Abstract: A lead frame for a semiconductor chip package, including a die pad onto which a semiconductor chip will be attached; leads which will be electrically connected to the chip; and side rails supporting the leads and the die pad; a second metal being contact with the rails, this second metal having a higher standard electrode potential than that of the copper metal or alloy of which the remainder of the lead frame is made.
    Type: Grant
    Filed: March 26, 1996
    Date of Patent: November 17, 1998
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Ki Youn Hwang, Hee Suck Kim, Jae Won Lee