Patents by Inventor Hee Sun OH

Hee Sun OH has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11775099
    Abstract: A touch sensing module includes a sensing coil, a metal portion disposed to be spaced apart from the sensing coil, and a first bracket having one surface, on which the metal portion is disposed, and an other surface, opposing the one surface, on which a pad having a capacitance, configured to vary as a touch is applied, is disposed.
    Type: Grant
    Filed: July 29, 2021
    Date of Patent: October 3, 2023
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Hee Sun Oh, Gye Won Lee, Hong Seok Lee, Chang Ju Lee, Jong Yun Kim
  • Patent number: 11703545
    Abstract: An apparatus that detects a rotor input is provided. The apparatus includes a rotor comprising at least a portion which is configured to rotate around an axis of rotation; a reactance element disposed in the rotor, a sensing medium member disposed in the rotor, and a motion conversion member configured to move in the rotor based on a rotation of the portion of the rotor, and configured to move together with the sensing medium member to change a reactance of the reactance element according to the rotation of the portion of the rotor.
    Type: Grant
    Filed: September 29, 2021
    Date of Patent: July 18, 2023
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Gye Won Lee, Hong Seok Lee, Hee Sun Oh, Chang Ju Lee, Mun Sun Jung, Jong Yun Kim
  • Patent number: 11686600
    Abstract: An apparatus with rotor input detection includes: a first reactance element disposed at a rotor configured such that at least a part of the rotor rotates around a rotation axis, and disposed at the rotor such that reactance of the first reactance element varies depending on relative rotation between a first portion of the rotor and a second portion of the rotor; and a second reactance element disposed at the rotor such that reactance of the second reactance element varies depending on a contact or a force applied to a side surface of the rotor. The first and second reactance elements are configured to detect inputs of different areas of the rotor.
    Type: Grant
    Filed: September 29, 2021
    Date of Patent: June 27, 2023
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Gye Won Lee, Hong Seok Lee, Hee Sun Oh, Chang Ju Lee, Mun Sun Jung, Jong Yun Kim, Si Young Kwon, Yong Wook Kim
  • Patent number: 11609651
    Abstract: A device with touch sensing. The device includes a first sensor configured to detect a touch and to provide a first sensing signal, a second sensor configured to detect another touch and to provide a second sensing signal, a threshold generator configured to set a first threshold by a reflecting of an amount of change of the second sensing signal to an initial threshold, and a sensor circuit configured to generate a first differential signal based on the first sensing signal, and to determine a first touch based on a consideration of the first threshold with respect to a first signal generated based on the first differential signal and the first sensing signal.
    Type: Grant
    Filed: October 15, 2021
    Date of Patent: March 21, 2023
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Gye Won Lee, Jong Yun Kim, Mun Sun Jung, Hong Seok Lee, Chang Ju Lee, Hee Sun Oh
  • Publication number: 20230003799
    Abstract: An apparatus that detects a rotor input is provided. The apparatus includes a rotor comprising at least a portion which is configured to rotate around an axis of rotation; a reactance element disposed in the rotor, a sensing medium member disposed in the rotor, and a motion conversion member configured to move in the rotor based on a rotation of the portion of the rotor, and configured to move together with the sensing medium member to change a reactance of the reactance element according to the rotation of the portion of the rotor.
    Type: Application
    Filed: September 29, 2021
    Publication date: January 5, 2023
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Gye Won LEE, Hong Seok LEE, Hee Sun OH, Chang Ju LEE, Mun Sun JUNG, Jong Yun KIM
  • Publication number: 20230003553
    Abstract: An apparatus with rotor input detection includes: a first reactance element disposed at a rotor configured such that at least a part of the rotor rotates around a rotation axis, and disposed at the rotor such that reactance of the first reactance element varies depending on relative rotation between a first portion of the rotor and a second portion of the rotor; and a second reactance element disposed at the rotor such that reactance of the second reactance element varies depending on a contact or a force applied to a side surface of the rotor. The first and second reactance elements are configured to detect inputs of different areas of the rotor.
    Type: Application
    Filed: September 29, 2021
    Publication date: January 5, 2023
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Gye Won LEE, Hong Seok LEE, Hee Sun OH, Chang Ju LEE, Mun Sun JUNG, Jong Yun KIM, Si Young KWON, Yong Wook KIM
  • Patent number: 11543906
    Abstract: A touch sensing device employed in an electronic device having a housing including a plurality of touch members, includes a touch sensing unit disposed in the housing and including a plurality of touch sensors configured to perform touch sensing based on a touch applied to any one or any two or more of the plurality of touch members; an oscillation circuit unit configured to generate a plurality of touch sensing signals based on the touch sensing; and a signal processor configured to perform a slide mode, when any one of the plurality of touch sensing signals is a slide mode start touch, to determine whether a slide touch pattern input based on the plurality of touch sensing signals is a preset slide touch pattern.
    Type: Grant
    Filed: July 22, 2021
    Date of Patent: January 3, 2023
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Gye Won Lee, Hee Sun Oh, Chang Ju Lee, Jong Yun Kim, Hong Seok Lee
  • Patent number: 11526236
    Abstract: A device with touch sensing includes a bracket, a pad disposed above one side of the bracket, the pad having a capacitance that varies as a touch is applied proximate to the device, and a sensing coil disposed below another side of the bracket that opposes the one side, with at least a portion of the sensing coil overlapping the pad.
    Type: Grant
    Filed: May 17, 2021
    Date of Patent: December 13, 2022
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Sol Ji Chang, Gye Won Lee, Mun Sun Jung, Hong Seok Lee, Jong Yun Kim, Chang Ju Lee, Hee Sun Oh
  • Publication number: 20220382404
    Abstract: A device with touch sensing. The device includes a first sensor configured to detect a touch and to provide a first sensing signal, a second sensor configured to detect another touch and to provide a second sensing signal, a threshold generator configured to set a first threshold by a reflecting of an amount of change of the second sensing signal to an initial threshold, and a sensor circuit configured to generate a first differential signal based on the first sensing signal, and to determine a first touch based on a consideration of the first threshold with respect to a first signal generated based on the first differential signal and the first sensing signal.
    Type: Application
    Filed: October 15, 2021
    Publication date: December 1, 2022
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Gye Won Lee, Jong Yun Kim, Mun Sun Jung, Hong Seok Lee, Chang Ju Lee, Hee Sun Oh
  • Publication number: 20220300133
    Abstract: A touch sensing device employed in an electronic device having a housing including a plurality of touch members, includes a touch sensing unit disposed in the housing and including a plurality of touch sensors configured to perform touch sensing based on a touch applied to any one or any two or more of the plurality of touch members; an oscillation circuit unit configured to generate a plurality of touch sensing signals based on the touch sensing; and a signal processor configured to perform a slide mode, when any one of the plurality of touch sensing signals is a slide mode start touch, to determine whether a slide touch pattern input based on the plurality of touch sensing signals is a preset slide touch pattern.
    Type: Application
    Filed: July 22, 2021
    Publication date: September 22, 2022
    Applicant: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Gye Won LEE, Hee Sun OH, Chang Ju LEE, Jong Yun KIM, Hong Seok LEE
  • Patent number: 11378470
    Abstract: An electronic device includes a force-sensing apparatus. The force-sensing apparatus includes a planar-shaped frame, a force sensor, and a displacement portion. The force sensor is disposed on one surface of the frame. The displacement portion has a planar profile and one side coupled at an acute angle to the frame and another side freely disposed above a sensing surface of the force sensor.
    Type: Grant
    Filed: August 21, 2020
    Date of Patent: July 5, 2022
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Chang Ju Lee, Nam Gyun Yim, Sol Ji Chang, Hong Seok Lee, Hee Sun Oh, Gye Won Lee, Seung Pil Jung, Jong Yun Kim
  • Publication number: 20220121340
    Abstract: A touch sensing module includes a sensing coil, a metal portion disposed to be spaced apart from the sensing coil, and a first bracket having one surface, on which the metal portion is disposed, and an other surface, opposing the one surface, on which a pad having a capacitance, configured to vary as a touch is applied, is disposed.
    Type: Application
    Filed: July 29, 2021
    Publication date: April 21, 2022
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Hee Sun OH, Gye Won LEE, Hong Seok LEE, Chang Ju LEE, Jong Yun KIM
  • Patent number: 11276646
    Abstract: An electronic component module includes a first substrate mounted on an upper surface of a second substrate such that at least a portion of a lower surface of the first substrate is exposed externally of the second substrate and electronic devices mounted on the first substrate and the second substrate, including at least one electronic device mounted on the upper surface of the second substrate.
    Type: Grant
    Filed: May 28, 2019
    Date of Patent: March 15, 2022
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Jong Yun Kim, Chang Ju Lee, Gye Won Lee, Hee Sun Oh, Hong Seok Lee
  • Publication number: 20220075500
    Abstract: A device with touch sensing includes a bracket, a pad disposed above one side of the bracket, the pad having a capacitance that varies as a touch is applied proximate to the device, and a sensing coil disposed below another side of the bracket that opposes the one side, with at least a portion of the sensing coil overlapping the pad.
    Type: Application
    Filed: May 17, 2021
    Publication date: March 10, 2022
    Applicant: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Sol Ji CHANG, Gye Won LEE, Mun Sun JUNG, Hong Seok LEE, Jong Yun KIM, Chang Ju LEE, Hee Sun OH
  • Patent number: 11191150
    Abstract: An electronic component module includes a first board comprising a component insertion portion, at least one heat-generating component mounted on a first surface of the first board and in which at least a portion of an active surface is exposed through the component insertion portion, a radiating component inserted into the component insertion portion and mounted on the active surface of the heat-generating component, a second board mounted on a second surface of the first board and configured to electrically connect the first board to an external source, and a connection conductor disposed on an inactive surface of the radiating component and configured to allow contact between the inactive surface of the radiating component and a main board.
    Type: Grant
    Filed: December 30, 2019
    Date of Patent: November 30, 2021
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Hong Seok Lee, Gye Won Lee, Hee Sun Oh, Jong Yun Kim, Seung Pil Jung, Chang Ju Lee
  • Publication number: 20210262870
    Abstract: An electronic device includes a force-sensing apparatus. The force-sensing apparatus includes a planar-shaped frame, a force sensor, and a displacement portion. The force sensor is disposed on one surface of the frame. The displacement portion has a planar profile and one side coupled at an acute angle to the frame and another side freely disposed above a sensing surface of the force sensor.
    Type: Application
    Filed: August 21, 2020
    Publication date: August 26, 2021
    Applicant: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Chang Ju LEE, Nam Gyun YIM, Sol Ji CHANG, Hong Seok LEE, Hee Sun OH, Gye Won LEE, Seung Pil JUNG, Jong Yun KIM
  • Patent number: 10999957
    Abstract: A module substrate includes a module substrate including a plurality of external connection electrodes disposed on a second surface thereof; communication elements mounted on the module substrate, the communication elements including one or more first communication elements mounted on a first surface of the module substrate and one or more second communication elements mounted on the second surface of the module substrate; a first heat radiation frame mounted on the first surface of the module substrate and configured to accommodate at least one of the one or more first communication elements; and a second heat radiation frame mounted on the second surface of the module substrate and configured to accommodate at least one of the one or more second communication elements. One or more of the external connection electrodes are disposed around the second heat radiation frame.
    Type: Grant
    Filed: November 13, 2018
    Date of Patent: May 4, 2021
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Gye Won Lee, Nam Gyun Yim, Eun Bae Park, Hong Seok Lee, Jong Yun Kim, Woo Sung Jung, Mi Jung Kim, Chang Ju Lee, Hee Sun Oh
  • Publication number: 20210045225
    Abstract: An electronic component module includes a first board comprising a component insertion portion, at least one heat-generating component mounted on a first surface of the first board and in which at least a portion of an active surface is exposed through the component insertion portion, a radiating component inserted into the component insertion portion and mounted on the active surface of the heat-generating component, a second board mounted on a second surface of the first board and configured to electrically connect the first board to an external source, and a connection conductor disposed on an inactive surface of the radiating component and configured to allow contact between the inactive surface of the radiating component and a main board.
    Type: Application
    Filed: December 30, 2019
    Publication date: February 11, 2021
    Applicant: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Hong Seok LEE, Gye Won LEE, Hee Sun OH, Jong Yun KIM, Seung Pil JUNG, Chang Ju LEE
  • Publication number: 20200258841
    Abstract: An electronic component module includes a first substrate mounted on an upper surface of a second substrate such that at least a portion of a lower surface of the first substrate is exposed externally of the second substrate and electronic devices mounted on the first substrate and the second substrate, including at least one electronic device mounted on the upper surface of the second substrate.
    Type: Application
    Filed: May 28, 2019
    Publication date: August 13, 2020
    Applicant: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Jong Yun KIM, Chang Ju LEE, Gye Won LEE, Hee Sun OH, Hong Seok LEE
  • Publication number: 20190252756
    Abstract: A module substrate includes a module substrate including a plurality of external connection electrodes disposed on a second surface thereof; communication elements mounted on the module substrate, the communication elements including one or more first communication elements mounted on a first surface of the module substrate and one or more second communication elements mounted on the second surface of the module substrate; a first heat radiation frame mounted on the first surface of the module substrate and configured to accommodate at least one of the one or more first communication elements; and a second heat radiation frame mounted on the second surface of the module substrate and configured to accommodate at least one of the one or more second communication elements. One or more of the external connection electrodes are disposed around the second heat radiation frame.
    Type: Application
    Filed: November 13, 2018
    Publication date: August 15, 2019
    Applicant: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Gye Won LEE, Nam Gyun YIM, Eun Bae PARK, Hong Seok LEE, Jong Yun KIM, Woo Sung JUNG, Mi Jung KIM, Chang Ju LEE, Hee Sun OH