Abstract: The present invention relates to a multi-functional support pole assembly. In particular, the present invention provides the advantage of improving operational reliability as well as preventing deterioration of urban area appearance, by comprising: a pole body provided in a hollow form and having a plurality of antenna mounting grooves formed through cutting so as to be spaced apart at a predetermined angle in a circumferential direction such that a plurality of antenna devices can be installed in the circumferential direction; and ventilation panels which are attached to remaining portions of the antenna mounting grooves not occupied by the plurality of antenna devices, and have a plurality of ventilation holes for introducing external air into the interior of the pole body.

Abstract: The present invention relates to a mounting apparatus for an antenna device and, specifically, comprises: a horizontal mounting panel coupled to the bottom surface of an antenna device; and an antenna installation unit on which the horizontal mounting panel is coupled and in which a hollow cable installation space is provided, wherein the antenna device enable left-right steering adjustment and up-down tilting adjustment by means of the horizontal mounting panel, and thus installation convenience and regulatory standards can be satisfied.

Abstract: The present invention relates to a mounting apparatus for an antenna device and, specifically, comprises: a horizontal mounting panel coupled to the bottom surface of an antenna device; and an antenna installation unit on which the horizontal mounting panel is coupled and in which a hollow cable installation space is provided, wherein the antenna device enable left-right steering adjustment and up-down tilting adjustment by means of the horizontal mounting panel, and thus installation convenience and regulatory standards can be satisfied.

Abstract: The present invention relates to a mounting apparatus for an antenna device on a rooftop corner. In particular, the mounting apparatus is installed on a railing on a corner side of a rooftop, and includes: a floor support part which is disposed on the inner bottom surface of the railing of the roof top and has a part that extends upward in parallel to the railing; a pair of railing support parts extending horizontally from the upper portion of the floor support part toward the railing; and a mounting part which is coupled to the upper portion of the floor support part and has a top end on which an antenna device is mounted. Therefore, the present invention provides installation convenience and enables legal regulations to be met.

Abstract: A wireless communication device support assembly is disclosed, including a support pole comprising a hollow interior, a first frame having a polygonal shape disposed on top of the support pole, a plurality of wireless communication devices disposed inside the first frame, at least one or more rotational advertising apparatuses controllably elevated in a direction parallel to a longitudinal direction of the support pole, a drive unit configured to elevate or lower the rotational advertising apparatus, and a plurality of lift ropes having first ends connected with tops of the rotational advertising apparatuses and second ends connected with the drive unit.

Abstract: The present invention relates to a support pole assembly for mounting an antenna and, particularly, to a support pole assembly for mounting an antenna, comprising: a support pole which is formed in a hollow structure and has an antenna device mounting hole formed at the circumferential surface thereof; an antenna device which is mounted to the support pole while passing through and covering the antenna device mounting hole and the rear portion of which is placed in the inner space of the support pole. Accordingly, the present invention provides an advantage in that the protrusion amount of the antenna device with respect to the support pole is reduced and thus the space required for mounting the antenna device can be reduced.

Abstract: Disclosed is a positive electrode material for a lithium secondary battery. The positive electrode material includes a positive electrode active material formed of Li—[Mn—Ti]-M-O-based material including a transition metal (M) to enable reversible intercalation and deintercalation of lithium and molybdenum oxide. The positive electrode active material is coated with the molybdenum oxide to form a coating layer on a surface thereof.

Abstract: A camera module is provided. The camera module includes a lens module including one or more lenses; an image sensor configured to convert light passing through the lens module into an electrical signal; and a filter configured to perform a polarization function, wherein the filter is configured to be movable in a space formed between the lens module and the image sensor.

Abstract: A multilayer electronic component includes a body including a plurality of dielectric layers, side margin portions disposed on the body, and external electrodes disposed on the body. The reliability of the multilayer electronic component is improved by controlling the contents of Si for each position of the dielectric layer and the side margin portion.

Abstract: An exemplary semiconductor device can comprise a die, a redistribution structure (RDS), an interconnect, a conductive strap, an encapsulant, and an EMI shield. The redistribution structure can comprise an RDS top surface coupled to the die bottom side. The interconnect can be coupled to the RDS bottom surface. The conductive strap can be coupled to the RDS, and can comprise a strap inner end coupled to the RDS bottom surface, and a strap outer end located lower than the RDS bottom surface. The encapsulant can encapsulate the conductive strap and the RDS bottom surface. The EMI shield can cover and contact the encapsulant sidewall and the strap outer end. Other examples and related methods are also disclosed herein.

Abstract: A storage device includes a first nonvolatile memory device, a second nonvolatile memory device, and a data line. The second nonvolatile memory device is of a different type from the first nonvolatile memory device. The data line is shared by the first nonvolatile memory device and the second nonvolatile memory device. First data is simultaneously provided to the first nonvolatile memory device and the second nonvolatile memory device through the data line, the first data is written to the second nonvolatile memory device, and the first data is reprogrammed into the first nonvolatile memory device by reading the first data from the second nonvolatile memory device and providing the read first data to the first nonvolatile memory device.

Abstract: A storage device includes a first nonvolatile memory device, a second nonvolatile memory device, and a data line. The second nonvolatile memory device is of a different type from the first nonvolatile memory device. The data line is shared by the first nonvolatile memory device and the second nonvolatile memory device. First data is simultaneously provided to the first nonvolatile memory device and the second nonvolatile memory device through the data line, the first data is written to the second nonvolatile memory device, and the first data is reprogrammed into the first nonvolatile memory device by reading the first data from the second nonvolatile memory device and providing the read first data to the first nonvolatile memory device.

Abstract: An exemplary semiconductor device can comprise a die, a redistribution structure (RDS), an interconnect, a conductive strap, an encapsulant, and an EMI shield. The redistribution structure can comprise an RDS top surface coupled to the die bottom side. The interconnect can be coupled to the RDS bottom surface. The conductive strap can be coupled to the RDS, and can comprise a strap inner end coupled to the RDS bottom surface, and a strap outer end located lower than the RDS bottom surface. The encapsulant can encapsulate the conductive strap and the RDS bottom surface. The EMI shield can cover and contact the encapsulant sidewall and the strap outer end. Other examples and related methods are also disclosed herein.

Abstract: An exemplary semiconductor device can comprise a die, a redistribution structure (RDS), an interconnect, a conductive strap, an encapsulant, and an EMI shield. The redistribution structure can comprise an RDS top surface coupled to the die bottom side. The interconnect can be coupled to the RDS bottom surface. The conductive strap can be coupled to the RDS, and can comprise a strap inner end coupled to the RDS bottom surface, and a strap outer end located lower than the RDS bottom surface. The encapsulant can encapsulate the conductive strap and the RDS bottom surface. The EMI shield can cover and contact the encapsulant sidewall and the strap outer end. Other examples and related methods are also disclosed herein.

Abstract: An exemplary semiconductor device can comprise a die, a redistribution structure (RDS), an interconnect, a conductive strap, an encapsulant, and an EMI shield. The redistribution structure can comprise an RDS top surface coupled to the die bottom side. The interconnect can be coupled to the RDS bottom surface. The conductive strap can be coupled to the RDS, and can comprise a strap inner end coupled to the RDS bottom surface, and a strap outer end located lower than the RDS bottom surface. The encapsulant can encapsulate the conductive strap and the RDS bottom surface. The EMI shield can cover and contact the encapsulant sidewall and the strap outer end. Other examples and related methods are also disclosed herein.

Abstract: A method of operating a haptic-enabled electronic device includes detecting an input interaction between the haptic-enabled electronic device and a touchscreen-enabled electronic device selecting a vibration command in associated with the input, and vibrating the haptic-enabled electronic device in response to the vibration command.

Abstract: An exemplary semiconductor device can comprise a die, a redistribution structure (RDS), an interconnect, a conductive strap, an encapsulant, and an EMI shield. The redistribution structure can comprise an RDS top surface coupled to the die bottom side. The interconnect can be coupled to the RDS bottom surface. The conductive strap can be coupled to the RDS, and can comprise a strap inner end coupled to the RDS bottom surface, and a strap outer end located lower than the RDS bottom surface. The encapsulant can encapsulate the conductive strap and the RDS bottom surface. The EMI shield can cover and contact the encapsulant sidewall and the strap outer end. Other examples and related methods are also disclosed herein.

Abstract: A semiconductor package that includes EMI shielding and a fabricating method thereof are disclosed. In one embodiment, the fabricating method of a semiconductor package includes forming a substrate, attaching semiconductor devices to a top portion of the substrate, encapsulating the semiconductor devices using an encapsulant, forming a trench in the encapsulant, and forming a shielding layer on a surface of the encapsulant.

Abstract: A cover device having an input unit and a portable terminal having the cover device are provided. The cover device includes a cover unit divided into a plurality of areas, each area having an electrode. A connection surface is provided in the cover unit and configured to be detachably engaged with a terminal to which the cover unit is mounted. The input unit including an electrode line is configured to transmit a touch input signal to a touch panel of the terminal through an electrode of a touched area among the plurality of areas.

Abstract: A cover device having an input unit and a portable terminal having the cover device are provided. The cover device includes a cover unit divided into a plurality of areas, each area having an electrode. A connection surface is provided in the cover unit and configured to be detachably engaged with a terminal to which the cover unit is mounted. The input unit including an electrode line is configured to transmit a touch input signal to a touch panel of the terminal through an electrode of a touched area among the plurality of areas.