Patents by Inventor Hee-Won Kang
Hee-Won Kang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20250126086Abstract: Proposed is a method for displaying summary information about a chat message by a user terminal. The method may include receiving information about a chat room comprising at least one chat message from a server, and requesting the server to summarize a summary target message, which is at least a part of the at least one chat message. The method may also include receiving and displaying summary information about the summary target message from the server.Type: ApplicationFiled: September 25, 2024Publication date: April 17, 2025Inventors: Sun Joo OH, Hui Su KIM, Heon Seob SEOK, Min Seok CHAE, Hee June KIM, Dae Seon KIM, Seung Hyun LEE, Bong Gyun KANG, Soo Young BYUN, Yun Gu KANG, Ji Won CHOI
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Patent number: 12252180Abstract: A lower cross member for a vehicle is disposed on a floor of a vehicle. The lower cross member includes a core member and a reinforcing layer. The core member is made of a composite material containing 70 wt. % or more of unidirectional carbon fibers, and the reinforcing layer is made of a composite material containing 70 wt. % or more of fiberglass.Type: GrantFiled: November 17, 2021Date of Patent: March 18, 2025Assignees: Hyundai Motor Company, Kia Corporation, Kolon Spaceworks Co., Ltd.Inventors: Sang Yoon Park, Seung Chan Lee, Yong Beom Lee, Pil Won Kang, Hyun Sik Kim, Sang Sun Park, Hee Seouk Chung, Seung Uk Kang, Chi Hoon Choi, Seong Jong Kim, Dong Won Kim
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Publication number: 20250056932Abstract: Disclosed are a display device and a method of manufacturing the display device. The display device includes a display panel on which a plurality of sub-pixels and lines connected to the sub-pixels and a driving circuit configured to drive the sub-pixels. The display panel further includes a plurality of protruded bank patterns disposed in the sub-pixels, and a light emitting element disposed in each of the bank patterns. The light emitting element includes a first electrode, a second electrode, a light emitting layer disposed between the first electrode and the second electrode, and a reflector that covers side surfaces of the light emitting layer and at least a portion of side surfaces of the first electrode. The reflector includes a first insulating layer, a second insulating layer, and a metal layer disposed between the first insulating layer and the second insulating layer.Type: ApplicationFiled: August 8, 2024Publication date: February 13, 2025Inventors: Hyun Chyol Shin, Seong Soo Cho, Hee Won Lee, Han Saem Kang, Sang Hak Shin, Hyoung Sun Park, Hyun Seok Na, Jin Hwa Shin, Joon Kwon Moon
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Patent number: 12225809Abstract: The present disclosure is directed to a coating composition including a graphene oxide and a solvent. At least one of a carboxyl group and an epoxide group of the graphene oxide is functionalized by an amine. The amine has an activation energy to an epoxide group of the graphene oxide of about ?3 kcal/mol to about 8 kcal/mol. A method of forming a stacked structure using the coating composition is provided. A method of manufacturing a display device using the coating composition is provided.Type: GrantFiled: September 23, 2020Date of Patent: February 11, 2025Assignees: SAMSUNG DISPLAY CO., LTD., DONGJIN SEMICHEM CO., LTD.Inventors: Hee Kyun Shin, Dong Kyun Seo, Jun Ho Sim, Woo Jin Cho, Byung Hoon Kang, Seung Jun Moon, Sun Chan Park, Hee Won Seo, Ji Eun Cho, Kyu Soon Shin
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Patent number: 11744056Abstract: Disclosed are a housing for receiving an electronic device and an electronic system having the same. The electronic system includes a case having lower and upper cases detachably combined with the lower case, a circuit board arranged in an inner space of the case and secured to the lower case such that at least a grounding line and at least a connection line are provided with the circuit board, a plurality of devices arranged on the circuit board such that each device is separated from one another by the grounding line and is connected with one another by the connection line, and at least an electromagnetic shielding member embedded onto the upper case such that the electromagnetic shielding member is in contact with the grounding line around the device to provide a shielding space receiving the device. The device is protected from unexpected electromagnetic waves by the electromagnetic shielding member.Type: GrantFiled: May 14, 2021Date of Patent: August 29, 2023Assignee: SAMSUNG ELECTRONICS CO., LTD.Inventors: Hee-Won Kang, Nam-Su Kim, In-Hyuk Ko, Eun-Ji Moon
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Publication number: 20210274691Abstract: Disclosed are a housing for receiving an electronic device and an electronic system having the same. The electronic system includes a case having lower and upper cases detachably combined with the lower case, a circuit board arranged in an inner space of the case and secured to the lower case such that at least a grounding line and at least a connection line are provided with the circuit board, a plurality of devices arranged on the circuit board such that each device is separated from one another by the grounding line and is connected with one another by the connection line, and at least an electromagnetic shielding member embedded onto the upper case such that the electromagnetic shielding member is in contact with the grounding line around the device to provide a shielding space receiving the device. The device is protected from unexpected electromagnetic waves by the electromagnetic shielding member.Type: ApplicationFiled: May 14, 2021Publication date: September 2, 2021Applicant: Samsung Electronics Co., Ltd.Inventors: Hee-Won KANG, Nam-Su KIM, In-Hyuk KO, Eun-Ji MOON
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Patent number: 11028629Abstract: A door glass assembly is configured to reduce an impact noise generated when a door glass is moved upward/downward and may include a carrier plate coupled to a glass holder to which a door glass of a vehicle is secured. The carrier plate is installed inside a door of the vehicle so as to be movable upward/downward. A module plate, on which the carrier plate is installed so as to be movable upward/downward, is installed inside the door of the vehicle. A driving motor is provided to move the carrier plate upward/downward. The module plate and the carrier plate are provided with an impact noise preventing means for gradually decelerating and stopping the carrier plate when the door glass is being maximally moved upward or downward.Type: GrantFiled: October 23, 2019Date of Patent: June 8, 2021Assignees: HYUNDAI MOTOR COMPANY, KIA MOTORS CORPORATIONInventors: Seok-Hyun Hong, Kwan-Hui Kang, Kuk-Hoon Lee, Soo-Bok Kim, Hee-Won Kang, Hoon-Ju Jo, Jun-Hee An, Ki-Su Kim, Nam-Hee Yun
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Patent number: 11026355Abstract: Disclosed are a housing for receiving an electronic device and an electronic system having the same. The electronic system includes a case having lower and upper cases detachably combined with the lower case, a circuit board arranged in an inner space of the case and secured to the lower case such that at least a grounding line and at least a connection line are provided with the circuit board, a plurality of devices arranged on the circuit board such that each device is separated from one another by the grounding line and is connected with one another by the connection line, and at least an electromagnetic shielding member embedded onto the upper case such that the electromagnetic shielding member is in contact with the grounding line around the device to provide a shielding space receiving the device. The device is protected from unexpected electromagnetic waves by the electromagnetic shielding member.Type: GrantFiled: June 18, 2019Date of Patent: June 1, 2021Assignee: Samsung Electronics Co., Ltd.Inventors: Hee-Won Kang, Nam-Su Kim, In-Hyuk Ko, Eun-Ji Moon
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Patent number: 10971486Abstract: A semiconductor package includes a package substrate having an upper surface and a lower surface and including a plurality of substrate pads formed on the upper surface, a capacitor structure arranged on the upper surface of the package substrate and including a semiconductor substrate and at least one decoupling capacitor formed in the upper surface of the semiconductor substrate, a plurality of first semiconductor chips mounted on the package and supported by the capacitor structure, first conductive connection members electrically connecting chip pads of the first semiconductor chips to the substrate pads, and second conductive connection members electrically connecting capacitor pads of the decoupling capacitor to the substrate pad.Type: GrantFiled: July 9, 2019Date of Patent: April 6, 2021Assignee: SAMSUNG ELECTRONICS CO., LTD.Inventors: Hee-Won Kang, Jong-Joo Lee
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Patent number: 10747246Abstract: A power supply circuit includes a first comparator, a second comparator, a first voltage regulator, an output terminal, a first path and a second path. The first comparator compares a first input voltage with a first reference voltage to generate a first control signal. The second comparator compares a second input voltage with the first reference voltage to generate a second control signal. A voltage level of the second input voltage is different from a voltage level of the first input voltage. The first voltage regulator is selectively enabled based on the first control signal and the second control signal, and generates a first voltage based on the first input voltage. A voltage level of the first voltage is substantially the same as the voltage level of the second input voltage. The output terminal is configured to output one of the second input voltage and the first voltage as a power supply voltage. The first path directly provides the first input voltage to the first voltage regulator.Type: GrantFiled: August 26, 2019Date of Patent: August 18, 2020Assignee: Samsung Electronics Co., Ltd.Inventors: Hee-Won Kang, In-Hyuk Go, Nam-Su Kim, Eun-Ji Moon, Jae-Sang Yun
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Publication number: 20200196495Abstract: Disclosed are a housing for receiving an electronic device and an electronic system having the same. The electronic system includes a case having lower and upper cases detachably combined with the lower case, a circuit board arranged in an inner space of the case and secured to the lower case such that at least a grounding line and at least a connection line are provided with the circuit board, a plurality of devices arranged on the circuit board such that each device is separated from one another by the grounding line and is connected with one another by the connection line, and at least an electromagnetic shielding member embedded onto the upper case such that the electromagnetic shielding member is in contact with the grounding line around the device to provide a shielding space receiving the device. The device is protected from unexpected electromagnetic waves by the electromagnetic shielding member.Type: ApplicationFiled: June 18, 2019Publication date: June 18, 2020Applicant: Samsung Electronics Co., Ltd.Inventors: Hee-Won KANG, Nam-Su KIM, ln-Hyuk KO, Eun-Ji MOON
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Publication number: 20200181965Abstract: A door glass assembly is configured to reduce an impact noise generated when a door glass is moved upward/downward and may include a carrier plate coupled to a glass holder to which a door glass of a vehicle is secured. The carrier plate is installed inside a door of the vehicle so as to be movable upward/downward. A module plate, on which the carrier plate is installed so as to be movable upward/downward, is installed inside the door of the vehicle. A driving motor is provided to move the carrier plate upward/downward. The module plate and the carrier plate are provided with an impact noise preventing means for gradually decelerating and stopping the carrier plate when the door glass is being maximally moved upward or downward.Type: ApplicationFiled: October 23, 2019Publication date: June 11, 2020Applicants: HYUNDAI MOTOR COMPANY, KIA MOTORS CORPORATIONInventors: Seok-Hyun Hong, Kwan-Hui Kang, Kuk-Hoon Lee, Soo-Bok Kim, Hee-Won Kang, Hoon-Ju Jo, Jun-Hee An, Ki-Su Kim, Nam-Hee Yun
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Patent number: 10530469Abstract: A method for communicating with a network by a terminal in a wireless communication system, wherein the terminal receives, from the network, signaling information representing a transmission period and a time offset for uplink transmission of a feedback information, and determines a time to transmit the feedback information based on the transmission period and the time offset. The terminal transmits the feedback information to the network based on the determined time.Type: GrantFiled: August 5, 2011Date of Patent: January 7, 2020Assignee: Samsung Electronics Co., LtdInventors: Yu-Suk Yun, Soon-Young Yoon, Hee-Won Kang, Jae-Heung Yeom, Sang-Hyun Yang, Hoon Huh, Youn-Sun Kim, Ho-Kyu Choi, Jae-Sung Jang
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Publication number: 20190377375Abstract: A power supply circuit includes a first comparator, a second comparator, a first voltage regulator, an output terminal, a first path and a second path. The first comparator compares a first input voltage with a first reference voltage to generate a first control signal. The second comparator compares a second input voltage with the first reference voltage to generate a second control signal. A voltage level of the second input voltage is different from a voltage level of the first input voltage. The first voltage regulator is selectively enabled based on the first control signal and the second control signal, and generates a first voltage based on the first input voltage. A voltage level of the first voltage is substantially the same as the voltage level of the second input voltage. The output terminal is configured to output one of the second input voltage and the first voltage as a power supply voltage. The first path directly provides the first input voltage to the first voltage regulator.Type: ApplicationFiled: August 26, 2019Publication date: December 12, 2019Inventors: Hee-Won Kang, In-Hyuk Go, Nam-Su Kim, Eun-Ji Moon, Jae-Sang YUN
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Publication number: 20190333908Abstract: A semiconductor package includes a package substrate having an upper surface and a lower surface and including a plurality of substrate pads formed on the upper surface, a capacitor structure arranged on the upper surface of the package substrate and including a semiconductor substrate and at least one decoupling capacitor formed in the upper surface of the semiconductor substrate, a plurality of first semiconductor chips mounted on the package and supported by the capacitor structure, first conductive connection members electrically connecting chip pads of the first semiconductor chips to the substrate pads, and second conductive connection members electrically connecting capacitor pads of the decoupling capacitor to the substrate pad.Type: ApplicationFiled: July 9, 2019Publication date: October 31, 2019Inventors: Hee-Won KANG, Jong-Joo LEE
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Patent number: 10437272Abstract: A power supply circuit includes a first comparator, a second comparator, a first voltage regulator, an output terminal, a first path and a second path. The first comparator compares a first input voltage with a first reference voltage to generate a first control signal. The second comparator compares a second input voltage with the first reference voltage to generate a second control signal. A voltage level of the second input voltage is different from a voltage level of the first input voltage. The first voltage regulator is selectively enabled based on the first control signal and the second control signal, and generates a first voltage based on the first input voltage. A voltage level of the first voltage is substantially the same as the voltage level of the second input voltage. The output terminal is configured to output one of the second input voltage and the first voltage as a power supply voltage. The first path directly provides the first input voltage to the first voltage regulator.Type: GrantFiled: March 26, 2018Date of Patent: October 8, 2019Assignee: Samsung Electronics Co., Ltd.Inventors: Hee-Won Kang, In-Hyuk Go, Nam-Su Kim, Eun-Ji Moon, Jae-Sang Yun
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Patent number: 10381334Abstract: A semiconductor package includes a package substrate having an upper surface and a lower surface and including a plurality of substrate pads formed on the upper surface, a capacitor structure arranged on the upper surface of the package substrate and including a semiconductor substrate and at least one decoupling capacitor formed in the upper surface of the semiconductor substrate, a plurality of first semiconductor chips mounted on the package and supported by the capacitor structure, first conductive connection members electrically connecting chip pads of the first semiconductor chips to the substrate pads, and second conductive connection members electrically connecting capacitor pads of the decoupling capacitor to the substrate pad.Type: GrantFiled: October 18, 2017Date of Patent: August 13, 2019Assignee: SAMSUNG ELECTRONICS CO., LTD.Inventors: Hee-Won Kang, Jong-Joo Lee
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Patent number: 10334472Abstract: Quality of Service (QoS) switching method and apparatus in a mobile communication system are provided. The method includes determining, based on a total resource usage for providing a plurality of QoSs, the QoS switching relating to level adjustment of the plurality of QoSs corresponding to one of downgrade, upgrade, and grade maintenance, and adjusting levels of the plurality of QoSs according to the determined QoS switching.Type: GrantFiled: December 29, 2014Date of Patent: June 25, 2019Assignee: Samsung Electronics Co., LtdInventors: Dae-Kwon Jung, Hee-Won Kang, Eun-Jung Kim, Myung-Kwang Byun, Jeong-Ho Lee, Eun-Ho Choi
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Publication number: 20190074251Abstract: Semiconductor packages are provided. A semiconductor package includes a package base substrate that includes a base layer. A plurality of connection terminals are on the base layer. Moreover, a plurality of electromagnetic shielding terminals are on the base layer around the plurality of connection terminals. The semiconductor package includes a package body that includes at least one semiconductor chip. The semiconductor package includes an electromagnetic shielding layer on the package base substrate and on the package body.Type: ApplicationFiled: April 26, 2018Publication date: March 7, 2019Inventors: Hee-won Kang, Jong-joo Lee, Byeong-uk Jeon
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Publication number: 20190072991Abstract: A power supply circuit includes a first comparator, a second comparator, a first voltage regulator, an output terminal, a first path and a second path. The first comparator compares a first input voltage with a first reference voltage to generate a first control signal. The second comparator compares a second input voltage with the first reference voltage to generate a second control signal. A voltage level of the second input voltage is different from a voltage level of the first input voltage. The first voltage regulator is selectively enabled based on the first control signal and the second control signal, and generates a first voltage based on the first input voltage. A voltage level of the first voltage is substantially the same as the voltage level of the second input voltage. The output terminal is configured to output one of the second input voltage and the first voltage as a power supply voltage. The first path directly provides the first input voltage to the first voltage regulator.Type: ApplicationFiled: March 26, 2018Publication date: March 7, 2019Inventors: Hee-Won Kang, In-Hyuk Go, Nam-Su Kim, Eun-Ji Moon, Jae-Sang Yun