Patents by Inventor Hee Woo Woo

Hee Woo Woo has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20080045632
    Abstract: A method for preparing an epoxy molding compound powder includes preparing an epoxy molding compound chips, feeding dry ice into a dry ice consecutive feeder to form dry ice chips, grinding simultaneously the epoxy molding compound chips and the dry ice chips in a grinder to form a powder mixture, and separating the powder mixture to form epoxy molding compound powder.
    Type: Application
    Filed: December 27, 2006
    Publication date: February 21, 2008
    Inventors: Jeong Yong Jo, Kyung Dae Kim, Hee Woo Woo