Abstract: A thermoelectric device according to one embodiment of the present invention comprises: a first substrate; a plurality of P-type thermoelectric legs and a plurality of N-type thermoelectric legs alternately disposed on the first substrate; a second substrate disposed on the plurality of P-type thermoelectric legs and the plurality of N-type thermoelectric legs; a plurality of first electrodes disposed between the first substrate and the plurality of P-type thermoelectric legs and the plurality of N-type thermoelectric legs, and respectively having a P-type thermoelectric leg and N-type thermoelectric leg pair disposed therein; and a plurality of second electrodes disposed between the second substrate and the plurality of P-type thermoelectric legs and the plurality of N-type thermoelectric legs, and respectively having a P-type thermoelectric leg and N-type thermoelectric leg pair disposed therein, wherein a P-type solder layer and N-type solder layer pair and a barrier layer disposed between the P-type solde