Patents by Inventor Hee Yoon

Hee Yoon has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20060291177
    Abstract: Disclosed herein is a printed circuit board having an RF module power stage circuit embedded therein. Specifically, this invention relates to a printed circuit board having an RF module power stage circuit embedded therein, in which a terminal pad for a resistor, a bead, or an inductor is defined or formed on a power supply plane of a multilayered wired board to connect the resistor, the bead, or the inductor to the power supply plane, and the resistor, the bead, or the inductor is connected in parallel with a decoupling capacitor by using a via hole or by embedding the resistor, the bead or the inductor perpendicular to the power supply plane, thus decreasing the size of the RF module and improving the performance thereof.
    Type: Application
    Filed: June 7, 2006
    Publication date: December 28, 2006
    Inventors: Don Choi, Jae Ju, Dong Lee, Sang Park, Hee Yoon
  • Publication number: 20060181370
    Abstract: Disclosed herein is a laminated filter with improved stop band attenuation, which is adopted in devices using a radio frequency, such as communication systems and/or broadcasting systems. The laminated filter forms cross capacitive coupling as feeding lines of input lead and/or output lead are coupled to a resonator pattern, and enhances an attenuation characteristic of stop band. Also, the laminated filter is minimized if feeding lines of the input lead and output lead are aligned in different layers, and the positions of the attenuation poles are easily controlled by adjusting the feeding line length.
    Type: Application
    Filed: May 11, 2005
    Publication date: August 17, 2006
    Inventors: Dong Lee, Sung Park, Ki Hong, Hee Yoon
  • Publication number: 20060139849
    Abstract: The present invention provides a multilayered chip capacitor (MLCC) comprising internal electrodes and external electrodes formed to be perpendicular to the internal electrodes, whereby parasitic capacitance is reduced, resulting in no parallel resonance frequency effects. In addition, the MLCC has a capacitor structure, which provides a first surface and a second surface formed in a stacking direction of the dielectric layers in the capacitor body as a top surface and a bottom surface. Hence, in the thin capacitors having the same size, the number of internal electrode layers is increased, thereby reducing the ESR and ESL. Further, the PCB having an embedded MLCC is easily manufactured.
    Type: Application
    Filed: November 29, 2005
    Publication date: June 29, 2006
    Applicant: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Hee Yoon, Chang Shim, Don Choi, Dong Lee