Abstract: Provided is a duct docking device for a ventilation seat of a vehicle. The duct docking device enables air to be easily blown to a seatback and a seat cushion with a passenger in a seat using only one blower by enabling a seatback duct mounted at the seatback and a seat cushion duct mounted at the seat cushion to be hermetically docked through a connector duct, etc. at an unfolded position of the seatback in which a passenger can sit, and by enabling the seatback duct mounted at the seatback and the seat cushion duct mounted at the seat cushion to be separated from each other at a folded position of the seatback in consideration of that there is no passenger in the seat.

Abstract: A portable communication device is provided, which includes a housing including a rear cover; a battery disposed in the housing; NFC circuitry; wireless charging circuitry; MST circuitry; an FPCB including a plurality of layers substantially parallel to each other, at least a portion of the FPCB being disposed between the battery and the rear cover; an NFC coil electrically connected with the NFC circuitry, the NFC coil including a first portion and a second portion formed at different layers of the FPCB; a wireless charging coil electrically connected with the wireless charging circuitry, the wireless charging coil including a third portion and a fourth portion formed at different layers of the FPCB; and an MST coil electrically connected with the MST circuitry, the MST coil including a fifth portion and a sixth portion at different layers of the FPCB.

Abstract: A portable communication device is provided, which includes a housing including a rear cover; a battery disposed in the housing; NFC circuitry; wireless charging circuitry; MST circuitry; an FPCB including a plurality of layers substantially parallel to each other, at least a portion of the FPCB being disposed between the battery and the rear cover; an NFC coil electrically connected with the NFC circuitry, the NFC coil including a first portion and a second portion formed at different layers of the FPCB; a wireless charging coil electrically connected with the wireless charging circuitry, the wireless charging coil including a third portion and a fourth portion formed at different layers of the FPCB; and an MST coil electrically connected with the MST circuitry, the MST coil including a fifth portion and a sixth portion at different layers of the FPCB.

Abstract: A polysilicon manufacturing apparatus according to an exemplary embodiment of the present invention includes: a reactor in which a reactive gas is introduced to perform a polysilicon manufacturing process by a chemical vapor deposition (CVD) method; and a slit-type nozzle installed at the reactor and spraying a gas inside the reactor to prevent absorption of silicon particles during a process.

Abstract: A portable communication device is provided. The portable communication device includes near field communication (NFC) circuitry; wireless charging circuitry; magnetic secure transmission (MST) circuitry; a flexible printed circuit board (FPCB) including a first substrate layer and a second substrate layer; an NFC coil electrically connected with the NFC circuitry, the NFC coil including a first portion formed on the first substrate layer and a second portion formed on the second substrate layer; a wireless charging coil electrically connected with the wireless charging circuitry the wireless charging coil including a third portion formed on the first substrate layer and a fourth portion formed on the second substrate layer; and an MST coil electrically connected with the MST circuitry, the MST coil including a fifth portion formed on the first substrate layer and a sixth portion formed on the second substrate layer.

Abstract: A portable communication device is provided. The portable communication device includes near field communication (NFC) circuitry; wireless charging circuitry; magnetic secure transmission (MST) circuitry; a flexible printed circuit board (FPCB) including a first substrate layer and a second substrate layer; an NFC coil electrically connected with the NFC circuitry, the NFC coil including a first portion formed on the first substrate layer and a second portion formed on the second substrate layer; a wireless charging coil electrically connected with the wireless charging circuitry, the wireless charging coil including a third portion formed on the first substrate layer and a fourth portion formed on the second substrate layer; and an MST coil electrically connected with the MST circuitry, the MST coil including a fifth portion formed on the first substrate layer and a sixth portion formed on the second substrate layer.

Abstract: An electronic device is provided. The electronic device includes a housing; a plurality of coils that are disposed on a first layer within the housing; a plurality of other coils disposed on a second layer substantially parallel to the first layer; a first conductor that connects an end point of a first coil of the plurality of coils and a start point of a second coil of the plurality of other coils and conducts a current from the end point of the first coil to the start point of the second coil; and a second conductor that connects a start point of a third coil adjacent to an outer side of the first coil of the plurality of coils and an end point of the second coil and conducts the current to be applied from the end point of the second coil to the start point of the third coil, wherein the first conductor and the second conductor induce a directional magnetic field when the current flows.

Abstract: An electronic device is provided. The electronic device includes a housing; a plurality of coils that are disposed on a first layer within the housing; a plurality of other coils disposed on a second layer substantially parallel to the first layer; a first conductor that connects an end point of a first coil of the plurality of coils and a start point of a second coil of the plurality of other coils and conducts a current from the end point of the first coil to the start point of the second coil; and a second conductor that connects a start point of a third coil adjacent to an outer side of the first coil of the plurality of coils and an end point of the second coil and conducts the current to be applied from the end point of the second coil to the start point of the third coil, wherein the first conductor and the second conductor induce a directional magnetic field when the current flows.

Abstract: An electronic device is provided. The electronic device includes a housing; a plurality of coils that are disposed on a first layer within the housing; a plurality of other coils disposed on a second layer substantially parallel to the first layer; a first conductor that connects an end point of a first coil of the plurality of coils and a start point of a second coil of the plurality of other coils and conducts a current from the end point of the first coil to the start point of the second coil; and a second conductor that connects a start point of a third coil adjacent to an outer side of the first coil of the plurality of coils and an end point of the second coil and conducts the current to be applied from the end point of the second coil to the start point of the third coil, wherein the first conductor and the second conductor induce a directional magnetic field when the current flows.

Abstract: A polysilicon manufacturing apparatus according to an exemplary embodiment of the present invention includes: a reactor in which a reactive gas is introduced to perform a polysilicon manufacturing process by a chemical vapor deposition (CVD) method; and a slit-type nozzle installed at the reactor and spraying a gas inside the reactor to prevent absorption of silicon particles during a process.

Abstract: Provided is a polysilicon manufacturing apparatus including a reactor disposed on a base plate to form a reaction chamber, a pair of electrical feedthroughs installed on the base plate to be extended to the inside of the reaction chamber, rod filaments installed on the electrical feedthroughs in the reaction chamber and connected to each other by a rod bridge at the upper end to form a silicon rod by chemical vapor deposition of source gas introduced to a gas inlet, and a cooling jacket inserted to a through-hole provided at the upper side of the reactor to be supported to the base plate, connected to a gas outlet formed on the base plate by forming a gas passage discharging the gas after reaction, and introducing and circulating a low-temperature coolant to a coolant passage from the outside of the reactor by forming the coolant passage at the outside of the gas passage to discharge a high-temperature coolant to the outside of the reactor.

Abstract: An electronic device and a method of operating the electronic device are provided. The electronic device includes a communication circuit; a battery; a first conductive pattern electrically connected to the battery and configured to wirelessly receive power; a second conductive pattern electrically connected to the communication circuit; a processor; and a memory that stores instructions, which when executed, instruct the processor to receive power from an external device through the first conductive pattern, to detect a voltage or a current of a signal output from the second conductive pattern while receiving the power, and to provide an output that is at least partially based on the detected voltage or current of the signal output from the second conductive pattern.

Abstract: Provided is a polysilicon manufacturing apparatus including a reactor disposed on a base plate to form a reaction chamber, a pair of electrical feedthroughs installed on the base plate to be extended to the inside of the reaction chamber, rod filaments installed on the electrical feedthroughs in the reaction chamber and connected to each other by a rod bridge at the upper end to form a silicon rod by chemical vapor deposition of source gas introduced to a gas inlet, and a cooling jacket inserted to a through-hole provided at the upper side of the reactor to be supported to the base plate, connected to a gas outlet formed on the base plate by forming a gas passage discharging the gas after reaction, and introducing and circulating a low-temperature coolant to a coolant passage from the outside of the reactor by forming the coolant passage at the outside of the gas passage to discharge a high-temperature coolant to the outside of the reactor.

Abstract: The present invention provides a polysilicon manufacturing apparatus that can prevent generation of popcorns in the entire CVD reaction process by cooling an upper portion of a silicon rod where a rod bridge is disposed. A polysilicon manufacturing apparatus according to an exemplary embodiment of the present invention includes: a reactor provided on a base and forming a reaction chamber; a pair of feedthroughs provided in the base and extending into the reaction chamber; rod filaments provided in the feedthroughs in the reaction chamber, connected with each other at upper ends thereof through a rod bridge, and where a silicon rod of polysilicon is formed from a raw material gas through a chemical vapor deposition (CVD) process; and cooling spray nozzles spraying a cooling gas to the silicon rod formed as silicon deposited around the rod bridge and the rod filaments.

Abstract: Disclosed is an electronic device that includes a housing, a display, and a conductive line extending from a first end part to a second end part to include a plurality of turns that surround a space between a first surface and a second surface of the housing, and generating a magnetic field in the first direction or second direction or of a direction perpendicular to the first or second direction. As such, the electronic device may receive wireless power from a wireless charging device even if the electronic device is mounted on the wireless charging device in various directions.

Abstract: An electronic device is provided. The electronic device includes a housing; a plurality of coils that are disposed on a first layer within the housing; a plurality of other coils disposed on a second layer substantially parallel to the first layer; a first conductor that connects an end point of a first coil of the plurality of coils and a start point of a second coil of the plurality of other coils and conducts a current from the end point of the first coil to the start point of the second coil; and a second conductor that connects a start point of a third coil adjacent to an outer side of the first coil of the plurality of coils and an end point of the second coil and conducts the current to be applied from the end point of the second coil to the start point of the third coil, wherein the first conductor and the second conductor induce a directional magnetic field when the current flows.

Abstract: An electronic device and a method of operating the electronic device are provided. The electronic device includes a communication circuit; a battery; a first conductive pattern electrically connected to the battery and configured to wirelessly receive power; a second conductive pattern electrically connected to the communication circuit; a processor; and a memory that stores instructions, which when executed, instruct the processor to receive power from an external device through the first conductive pattern, to detect a voltage or a current of a signal output from the second conductive pattern while receiving the power, and to provide an output that is at least partially based on the detected voltage or current of the signal output from the second conductive pattern.

Abstract: Disclosed is an EMI shielding method of semiconductor packages, including a tape attaching step of attaching an edge of a tape to a lower side of a frame to dispose the tape inside an inner circumferential side of the frame, a tape cutting step of forming holes through the tape at regular intervals, a semiconductor package fastening step of disposing edges of lower sides of the semiconductor packages on an upper side of the tape so that bumps, formed on the lower sides of the semiconductor packages, are inserted into the holes in the tape to thus fasten the semiconductor packages at regular intervals to the upper side of the tape, and a coating step of performing a coating operation over the tape to form a coat on the semiconductor packages and the upper side of the tape.

Abstract: Disclosed is an EMI shielding method of semiconductor packages, including a tape attaching step of attaching an edge of a tape to a lower side of a frame to dispose the tape inside an inner circumferential side of the frame, a tape cutting step of forming holes through the tape at regular intervals, a semiconductor package fastening step of disposing edges of lower sides of the semiconductor packages on an upper side of the tape so that bumps, formed on the lower sides of the semiconductor packages, are inserted into the holes in the tape to thus fasten the semiconductor packages at regular intervals to the upper side of the tape, and a coating step of performing a coating operation over the tape to form a coat on the semiconductor packages and the upper side of the tape.

Abstract: An apparatus for manufacturing polysilicon using a chemical vapor deposition (CVD) reactor is provided. The apparatus for manufacturing polysilicon includes: a reaction chamber including a substrate and a reactor cover; at least a pair of electrodes installed through the substrate by an insulating member and connected with a power supply; at least a pair of filaments which are coupled with the pair of electrodes by an electrode chuck and of which upper ends are connected to each other; and a cover assembly including an electrode cover surrounding an upper surface and a side of each of the pair of electrodes on the substrate and a cover shield covering the upper surface of the electrode cover.