Abstract: A semiconductor device may include a plurality of active patterns disposed on a substrate, a gate structure extending in a first direction, a bit line structure extending in a second direction, and a plurality of capacitors electrically connected to the plurality of active patterns, respectively, the plurality of active patterns having a shape extending in a third direction oblique to the first and second directions, the gate structure passing through centers of the plurality of active patterns, the bit line structure connected to first end portions of the plurality of active patterns, the plurality of capacitors connected to second end portions of the plurality of active patterns, respectively, the first end portion and the second end portion positioned at opposite sides with respect to the gate structure, and the first end portion and the second end portion having point-symmetrical shapes with respect to a center of the active pattern.

Abstract: The semiconductor includes a substrate including first active patterns, the substrate defining trenches between the first active patterns; an upper silicon pattern on an upper sidewall of at least a portion of each of the first active patterns; and a first contact plug contacting an edge portion in a longitudinal direction of each of the first active patterns, a sidewall of the first contact plug contacting at least a portion of the upper silicon pattern, and the first contact plug having a bottom lower than a bottom of the upper silicon pattern.

Abstract: Disclosed is a semiconductor device comprising an active pattern including first and second edge parts spaced apart from each other in a first direction, a word line extending along a second direction between the first and second edge parts, a bit line extending along a third direction on the first edge part, a storage node contact on the second edge part, a first active pad between the bit line and the first edge part, and a second active pad between the storage node contact and the second edge part. The first active pad extends in the third direction more than the first edge part. The second active pad extends in a direction opposite to the third direction more than the second edge part.

Abstract: A semiconductor device according to some example embodiments includes: a substrate that includes an active region between element isolation layers; a word line that overlaps the active region and extends in a first direction; a bit line that overlaps the active region and extends in a second direction crossing the first direction; a buried contact connected to the active region; a first pad between and connecting the active region and the bit line; a second pad between and connecting the active region and the buried contact; and a landing pad connected to the buried contact. Each of the element isolation layers includes a first element isolation layer and a second element isolation layer inside the first element isolation layer, and each of the first pad and the second pad are between the element isolation layers.

Abstract: A method of manufacturing a semiconductor device includes forming an etch target layer in a surface of a cell region comprising a cell center region and a cell edge region surrounding the cell center region, forming an edge mask pattern on the surface of the cell edge region through a quadruple patterning process on the etch target layer, and forming a plurality of center mask patterns spaced apart from each other on the cell center region, and forming a first etch pattern on the cell edge region by etching the etch target layer by using the edge mask pattern and the plurality of center mask patterns as etch masks and forming a plurality of second etch patterns spaced apart from each other on the cell center region.

Abstract: A semiconductor device includes a substrate including a word line trench extending in a first horizontal direction; a gate dielectric layer in the word line trench; a word line extending in the first horizontal direction and in a lower portion of the word line trench on the gate dielectric layer; an insulation capping layer extending in an upper portion of the word line trench on the word line; and a plurality of gate electrodes on the substrate, wherein the word line comprises: a word line lower region extending in the first horizontal direction and including a first gate electrode of the plurality of gate electrodes on the gate dielectric layer; and a word line upper region extending in the first horizontal direction on the word line lower region and including a plurality of second gate electrodes of the plurality of gate electrodes and the first gate electrode.

Abstract: An Integrated Circuit (IC) semiconductor device includes: field insulating layers buried in field trenches disposed apart from each other inside a substrate; active regions defined by the field insulating layers; and active fins disposed on the active regions and protruding from surfaces of the field insulating layers. The field insulating layers include a first subfield insulating layer and a second subfield insulating layer, and a surface of the first subfield insulating layer is disposed at a level lower than a level of a surface of the second subfield insulating layer.

Abstract: An integrated circuit (IC) device includes a gate trench formed inside a substrate, the gate trench including a bottom portion and a sidewall portion, a gate electrode structure disposed apart from the bottom portion and the sidewall portion of the gate trench, the gate electrode structure including a gate electrode including a first sub-gate electrode formed in a lower portion of the gate trench and a second sub-gate electrode formed on the first sub-gate electrode and a gate capping layer formed on the second sub-gate electrode, and a gate insulating layer formed between the gate trench and the gate electrode structure, the gate insulating layer including a base insulating layer formed between the bottom portion and the sidewall portion of the gate trench and the gate electrode structure and a reinforcing insulating layer formed on a sidewall portion of the second sub-gate electrode.

Abstract: A semiconductor device includes a first trench on the device region, a first device isolation layer in the first trench and defining an active pattern of the device region, a second trench on the interface region, and a second device isolation layer in the second trench. The second isolation layer includes a buried dielectric pattern, a dielectric liner pattern on the buried dielectric pattern, and a first gap-fill dielectric pattern on the dielectric liner pattern. The buried dielectric pattern includes a floor segment on a floor of the second trench, and a sidewall segment on a sidewall of the second trench. The sidewall segment has a thickness different from a thickness of the floor segment.

Abstract: A semiconductor device includes a first trench on the device region, a first device isolation layer in the first trench and defining an active pattern of the device region, a second trench on the interface region, and a second device isolation layer in the second trench. The second isolation layer includes a buried dielectric pattern, a dielectric liner pattern on the buried dielectric pattern, and a first gap-fill dielectric pattern on the dielectric liner pattern. The buried dielectric pattern includes a floor segment on a floor of the second trench, and a sidewall segment on a sidewall of the second trench. The sidewall segment has a thickness different from a thickness of the floor segment.