Abstract: A display device includes: a substrate; a display element layer disposed on the substrate, where the display element layer includes a light emitting element which emits light; a polarizing film disposed on the display element layer, where the polarizing film includes a first polarizer having a first absorption axis extending to a first direction and a first transmission axis extending to a second direction orthogonal to the first direction; and a first layer disposed on one surface of the polarizing film, where the first layer has a first phase difference. Light emitted from the display element layer has a polarizing axis, and an angle between the polarizing axis and one of the first absorption axis and the first transmission axis is in a range of about 25 degrees to about 65 degrees.

Abstract: A semiconductor package molding device is provided. The semiconductor package molding device includes a chamber lower part which comprises a lower mold configured to receive a molding target, a chamber upper part configured to engage with the chamber lower part to isolate the inside of a chamber from the outside of the chamber, the chamber upper part including an upper mold configured to form a cavity with the lower mold, a first vent hole located between the chamber upper part and the chamber lower part, the first vent hole configured to discharge gas from the inside of the cavity after the chamber upper part and the chamber lower part engage with each other, a pot which is formed in the lower mold in the chamber lower part, a plunger configured to push up a molding material in the pot, a second vent hole which is formed in a side surface of the pot in the chamber lower part and a cavity vacuum pump configured to discharge gas through the first vent hole and the second vent hole.

Abstract: A semiconductor package molding device is provided. The semiconductor package molding device includes a chamber lower part which comprises a lower mold configured to receive a molding target, a chamber upper part configured to engage with the chamber lower part to isolate the inside of a chamber from the outside of the chamber, the chamber upper part including an upper mold configured to form a cavity with the lower mold, a first vent hole located between the chamber upper part and the chamber lower part, the first vent hole configured to discharge gas from the inside of the cavity after the chamber upper part and the chamber lower part engage with each other, a pot which is formed in the lower mold in the chamber lower part, a plunger configured to push up a molding material in the pot, a second vent hole which is formed in a side surface of the pot in the chamber lower part and a cavity vacuum pump configured to discharge gas through the first vent hole and the second vent hole.

Abstract: A molding resin tablet feeding apparatus may have a tablet weighing unit for weighing a molding resin tablet to sort out a faulty molding resin tablet. The weighing unit may be elastically deformed according to the weight of the molding resin tablet, and may further include a strain gauge for outputting an electric change caused by the elastic deformation. A controller may compare the electric change to tablet weight information to determine the validity of the molding resin tablet.

Abstract: A molding resin tablet feeding apparatus may have a tablet weighing unit for weighing a molding resin tablet to sort out a faulty molding resin tablet. The weighing unit may be elastically deformed according to the weight of the molding resin tablet, and may further include a strain gauge for outputting an electric change caused by the elastic deformation. A controller may compare the electric change to tablet weight information to determine the validity of the molding resin tablet.