Abstract: A display device includes a base layer including a display area including a light emitting element, and a non-display area which is adjacent to the display area and includes a pad, and a signal line connecting the light emitting element to the pad. In the non-display area, the pad includes a lower conductive pattern on the base layer, a first pattern on the lower conductive pattern and including a first photosensitive material, an upper conductive pattern on the lower conductive pattern and overlapping the first pattern, and a second pattern on the first pattern and comprising a second photosensitive material different from the first photosensitive material.

Abstract: A display device includes: a display panel having a display region in which a pixel is disposed and a non-display region in which a pad electrode is disposed; a driving part disposed on the display panel and having a bump electrode disposed to correspond to the pad electrode; and an adhesive layer in contact with the pad electrode and the bump electrode. The pad electrode includes: a first connection pattern containing a conductive material; an auxiliary pattern disposed on the first connection pattern, protruding toward the bump electrode, and containing an insulating material; and a second connection pattern, which contains a conductive material, of which a portion is disposed on the auxiliary pattern, and in which an opening that exposes a portion of the auxiliary pattern is defined, and the auxiliary pattern includes a tip portion more protruding toward the opening than the first connection pattern.

Abstract: A display device includes: a base layer including a display area and a non-display area adjacent to the display area, insulating layers arranged on the base layer, pixels arranged in the display area, pads connected to the pixels, arranged in a first direction, and arranged in the non-display area, and a driving chip connected to the pads. Each of side pads arranged at opposite ends in the first direction among the pads includes: a first conductive pattern; a first insulating pattern including protruding patterns, which protrude in a direction toward the driving chip; and a second insulating pattern disposed on the first insulating pattern.

Abstract: A display device includes a pixel, a signal line electrically connected to the pixel, and a signal pad connected to the signal line. The signal pad includes a first conductive pattern disposed on the pad part, a second conductive pattern disposed on the first conductive pattern, and an insulating pattern, which, in a cross-section, is disposed between the pad part of the signal line and the second conductive pattern, and in a plan view, overlaps the second conductive pattern. The insulating pattern passes through the first conductive pattern via an upper reinforcement hole defined in the first conductive pattern.

Abstract: A display device includes a display panel including a display region in which a light emitting element and a signal line are disposed, and a non-display region which is adjacent to the display region and in which a pad connected to the signal line is disposed. The pad includes a first conductive pattern at which the pad is connected to the signal line, an insulating pattern which is on the first conductive pattern and defines protrusions adjacent to each other in a direction along the first conductive pattern, a second conductive pattern on the insulating pattern and electrically connected to the first conductive pattern, and a conductive member between the protrusions and at least partially in the second conductive pattern.

Abstract: A display device includes a substrate including a display area and a pad area, a plurality of pad electrodes disposed in the pad area on the substrate, a circuit board disposed to overlap at least a portion of the pad area on the substrate, and an anisotropic conductive layer disposed in the pad area between the substrate and the circuit board. The circuit board includes a base substrate and a plurality of bump electrodes disposed on a lower surface of the base substrate. The anisotropic conductive layer includes an adhesive layer and a plurality of conductive particles arranged in the adhesive layer. Each of the conductive particles includes a core, a first conductive film disposed on the core in a way such that at least a portion of the core is exposed, and a second conductive film entirely covering the core and the first conductive film.

Abstract: The invention relates to display device and method of manufacturing the same. The display device includes: a substrate; a driving pad disposed on the substrate; an insulating layer exposing the driving pad and disposed on the substrate; a circuit board including a circuit pad overlapping the driving pad; and a connector disposed between the circuit board and the insulating layer and including a plurality of conductive particles electrically connecting the driving pad and the circuit pad, the driving pad including: a first pad disposed on the substrate; and a second pad disposed on the first pad and having an opening exposing the first pad.

Abstract: The invention relates to display device and method of manufacturing the same. The display device includes: a substrate; a driving pad disposed on the substrate; an insulating layer exposing the driving pad and disposed on the substrate; a circuit board including a circuit pad overlapping the driving pad; and a connector disposed between the circuit board and the insulating layer and including a plurality of conductive particles electrically connecting the driving pad and the circuit pad, the driving pad including: a first pad disposed on the substrate; and a second pad disposed on the first pad and having an opening exposing the first pad.

Abstract: A display device includes a first conductive pattern layer connected to a signal line, a second conductive pattern layer connected to the first conductive pattern layer, and an insulation pattern layer disposed between the signal line and the second conductive pattern layer and overlapping the second conductive pattern layer. The second conductive pattern layer exposes a portion of an upper surface and a side surface of the insulation pattern layer. The second conductive pattern layer includes first and second edge portions disposed on the upper surface of the insulation pattern layer and facing each other in a second direction intersecting a first direction. A distance between the first and second edge portions decreases as moving along the first direction in a first region of the upper surface of the insulation pattern layer, and increases as moving along the first direction in a second region of the upper surface.

Abstract: A display device includes a base layer, a pixel disposed on the base layer, a signal line electrically connected to the pixel, a signal pad connected to the signal line, and a plurality of insulating layers disposed on the base layer. The signal pad includes a first conductive pattern connected to an end portion of the signal line, a second conductive pattern connected to the first conductive pattern, and at least one insulating pattern disposed between the end portion of the signal line and the second conductive pattern in a cross-sectional view and overlapping the second conductive pattern in a plan view.

Abstract: A method of manufacturing a display apparatus in which the occurrence of a short circuit may be reduced includes forming a pad in a peripheral area of a substrate having a display area and the peripheral area outside the display area, disposing a first conductive particle on a surface of the pad, disposing a second conductive particle on a surface of a bump included in an electronic chip package, the surface of the bump facing the surface of the pad, and electrically connecting the pad to the bump by bringing the first conductive particle into contact with the second conductive particle.

Abstract: A display device includes a base layer, a pixel disposed on the base layer, a signal line electrically connected to the pixel, a signal pad connected to the signal line, and a plurality of insulating layers disposed on the base layer. The signal pad includes a first conductive pattern connected to an end portion of the signal line, a second conductive pattern connected to the first conductive pattern, and at least one insulating pattern disposed between the end portion of the signal line and the second conductive pattern in a cross-sectional view and overlapping the second conductive pattern in a plan view.

Abstract: A method for manufacturing a display device includes providing an electronic component between a plurality of bumps, providing a display panel, aligning the electronic component and the display panel, and applying ultrasonic waves to bond the plurality of bumps to signal pads. In providing first adhesive members, at least a portion of a top surface of each of the plurality of bumps is exposed between the first adhesive members.

Abstract: A display device includes a substrate including a display area and a pad area, a plurality of pad electrodes disposed in the pad area on the substrate, a circuit board disposed to overlap at least a portion of the pad area on the substrate, and an anisotropic conductive layer disposed in the pad area between the substrate and the circuit board. The circuit board includes a base substrate and a plurality of bump electrodes disposed on a lower surface of the base substrate. The anisotropic conductive layer includes an adhesive layer and a plurality of conductive particles arranged in the adhesive layer. Each of the conductive particles includes a core, a first conductive film disposed on the core in a way such that at least a portion of the core is exposed, and a second conductive film entirely covering the core and the first conductive film.

Abstract: The invention relates to display device and method of manufacturing the same. The display device includes: a substrate; a driving pad disposed on the substrate; an insulating layer exposing the driving pad and disposed on the substrate; a circuit board including a circuit pad overlapping the driving pad; and a connector disposed between the circuit board and the insulating layer and including a plurality of conductive particles electrically connecting the driving pad and the circuit pad, the driving pad including: a first pad disposed on the substrate; and a second pad disposed on the first pad and having an opening exposing the first pad.

Abstract: An ultrasonic bonding apparatus includes a stage on which a display panel is seated, a first ultrasonic generation unit which is connected to the stage and vibrates in a first direction and provide a first polarization, and a second ultrasonic generation unit in which an electronic component is seated and which vibrates in a second direction that is crossed with the first direction, and provides a second polarization, where a third polarization is provided on a plane on which the display panel contacts the electronic component.

Abstract: A method for manufacturing a display device includes providing an electronic component between a plurality of bumps, providing a display panel, aligning the electronic component and the display panel, and applying ultrasonic waves to bond the plurality of bumps to signal pads. In providing first adhesive members, at least a portion of a top surface of each of the plurality of bumps is exposed between the first adhesive members.

Abstract: An ultrasonic bonding apparatus includes a stage on which a display panel is seated, a first ultrasonic generation unit which is connected to the stage and vibrates in a first direction and provide a first polarization, and a second ultrasonic generation unit in which an electronic component is seated and which vibrates in a second direction that is crossed with the first direction, and provides a second polarization, where a third polarization is provided on a plane on which the display panel contacts the electronic component.