Patents by Inventor Heeman Choe

Heeman Choe has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20100326739
    Abstract: Earth-boring tools for drilling subterranean formations include a particle-matrix composite material comprising a plurality of silicon carbide particles dispersed throughout a matrix material, such as, for example, an aluminum or aluminum-based alloy. In some embodiments, the silicon carbide particles comprise an ABC—SiC material. Methods of manufacturing such tools include providing a plurality of silicon carbide particles within a matrix material. Optionally, the silicon carbide particles may comprise ABC—SiC material, and the ABC—SiC material may be toughened to increase a fracture toughness exhibited by the ABC—SiC material. In some methods, at least one of an infiltration process and a powder compaction and consolidation process may be employed.
    Type: Application
    Filed: September 3, 2010
    Publication date: December 30, 2010
    Applicant: BAKER HUGHES INCORPORATED
    Inventors: Heeman Choe, John H. Stevens, James C. Westhoff, Jimmy W. Eason, James L. Overstreet
  • Patent number: 7807099
    Abstract: Earth-boring tools for drilling subterranean formations include a particle-matrix composite material comprising a plurality of silicon carbide particles dispersed throughout a matrix material, such as, for example, an aluminum or aluminum-based alloy. In some embodiments, the silicon carbide particles comprise an ABC—SiC material. Methods of manufacturing such tools include providing a plurality of silicon carbide particles within a matrix material. Optionally, the silicon carbide particles may comprise ABC—SiC material, and the ABC—SiC material may be toughened to increase a fracture toughness exhibited by the ABC—SiC material. In some methods, at least one of an infiltration process and a powder compaction and consolidation process may be employed.
    Type: Grant
    Filed: December 27, 2007
    Date of Patent: October 5, 2010
    Assignee: Baker Hughes Incorporated
    Inventors: Heeman Choe, John H. Stevens, James C. Westhoff, Jimmy W. Eason, James L. Overstreet
  • Patent number: 7784567
    Abstract: Earth-boring rotary drill bits include bit bodies comprising a composite material including a plurality of hard phase regions or particles dispersed throughout a titanium or titanium-based alloy matrix material. The bits further include a cutting structure disposed on a face of the bit body. In some embodiments, the bit bodies may include a plurality of regions having differing material compositions. For example, the bit bodies may include a first region comprising a plurality of hard phase regions or particles dispersed throughout a titanium or titanium-based alloy matrix material, and a second region comprising a titanium or a titanium-based alloy material. Methods for forming such drill bits include at least partially sintering a plurality of hard particles and a plurality of particles comprising titanium or a titanium-based alloy material to form a bit body comprising a particle-matrix composite material. A shank may be attached directly to the bit body.
    Type: Grant
    Filed: November 6, 2006
    Date of Patent: August 31, 2010
    Assignee: Baker Hughes Incorporated
    Inventors: Heeman Choe, John H. Stevens, James L. Overstreet, James C. Westhoff, Jimmy W. Eason
  • Publication number: 20100187018
    Abstract: An earth-boring rotary drill bit includes a bit body configured to carry one or more cutters for engaging a subterranean earth formation, the bit body comprising a particle-matrix composite material having a plurality of hard particles dispersed throughout a matrix material, the matrix material comprising a shape memory alloy. The matrix material comprises a metal alloy configured to undergo a reversible phase transformation between an austenitic phase and a martensitic phase. The matrix material may include an Ni-based alloy, Cu-based alloy, Co-based alloy, Fe-based alloy or Ti-based alloy.
    Type: Application
    Filed: January 29, 2009
    Publication date: July 29, 2010
    Applicant: BAKER HUGHES INCORPORATED
    Inventors: Heeman Choe, John Stevens, Eric Sullivan
  • Patent number: 7745013
    Abstract: A foamed solder or a nano-porous solder is formed on a substrate of an integrated circuit package. The foamed solder exhibits a low modulus that resists cracking during shock and dynamic loading. The foamed solder is used as a solder bump for communication between an integrated circuit device and external structures.
    Type: Grant
    Filed: December 30, 2005
    Date of Patent: June 29, 2010
    Assignee: Intel Corporation
    Inventors: Heeman Choe, Daewoong Suh
  • Publication number: 20100155148
    Abstract: An earth-boring rotary drill bit includes a bit body configured to carry one or more cutters for engaging a subterranean earth formation. The bit body includes a particle-matrix composite material having a plurality of hard particles dispersed throughout a matrix material, the particle-matrix composite material having a first coefficient of thermal expansion. The bit body also includes insert disposed in the bit body. The insert has a second coefficient of thermal expansion that is greater than the first coefficient of thermal expansion of the matrix.
    Type: Application
    Filed: December 22, 2008
    Publication date: June 24, 2010
    Applicant: BAKER HUGHES INCORPORATED
    Inventors: Heeman Choe, Andreas Mortensen
  • Publication number: 20080128176
    Abstract: Earth-boring tools for drilling subterranean formations include a particle-matrix composite material comprising a plurality of silicon carbide particles dispersed throughout a matrix material, such as, for example, an aluminum or aluminum-based alloy. In some embodiments, the silicon carbide particles comprise an ABC—SiC material. Methods of manufacturing such tools include providing a plurality of silicon carbide particles within a matrix material. Optionally, the silicon carbide particles may comprise ABC—SiC material, and the ABC—SiC material may be toughened to increase a fracture toughness exhibited by the ABC—SiC material. In some methods, at least one of an infiltration process and a powder compaction and consolidation process may be employed.
    Type: Application
    Filed: December 27, 2007
    Publication date: June 5, 2008
    Inventors: Heeman Choe, John H. Stevens, James C. Westhoff, Jimmy W. Eason, James L. Overstreet
  • Publication number: 20070152016
    Abstract: A foamed solder or a nano-porous solder is formed on a substrate of an integrated circuit package. The foamed solder exhibits a low modulus that resists cracking during shock and dynamic loading. The foamed solder is used as a solder bump for communication between an integrated circuit device and external structures.
    Type: Application
    Filed: December 30, 2005
    Publication date: July 5, 2007
    Inventors: Heeman Choe, Daewoong Suh
  • Publication number: 20070102200
    Abstract: Rotary drill bits for drilling subterranean formations include a bit body and at least one cutting structure disposed on a face thereof. The bit body includes a crown region comprising a particle-matrix composite material that includes a plurality of boron carbide particles dispersed throughout an aluminum or aluminum-based alloy matrix material. In some embodiments, the matrix material may include a continuous solid solution phase and a discontinuous precipitate phase. Methods of manufacturing rotary drill bits for drilling subterranean formations include infiltrating a plurality of boron carbide particles with a molten aluminum or aluminum-based material. In additional methods, a green powder component is provided that includes a plurality of particles each comprising boron carbide and a plurality of particles each comprising aluminum or an aluminum-based alloy material. The green powder component is at least partially sintered to provide a bit body, and a shank is attached to the bit body.
    Type: Application
    Filed: September 29, 2006
    Publication date: May 10, 2007
    Inventors: Heeman Choe, John Stevens, James Westhoff, Jimmy Eason, James Overstreet
  • Publication number: 20070102202
    Abstract: Earth-boring rotary drill bits include bit bodies comprising a composite material including a plurality of hard phase regions or particles dispersed throughout a titanium or titanium-based alloy matrix material. The bits further include a cutting structure disposed on a face of the bit body. In some embodiments, the bit bodies may include a plurality of regions having differing material compositions. For example, the bit bodies may include a first region comprising a plurality of hard phase regions or particles dispersed throughout a titanium or titanium-based alloy matrix material, and a second region comprising a titanium or a titanium-based alloy material. Methods for forming such drill bits include at least partially sintering a plurality of hard particles and a plurality of particles comprising titanium or a titanium-based alloy material to form a bit body comprising a particle-matrix composite material. A shank may be attached directly to the bit body.
    Type: Application
    Filed: November 6, 2006
    Publication date: May 10, 2007
    Inventors: Heeman Choe, John Stevens, James Overstreet, James Westhoff, Jimmy Eason
  • Publication number: 20070075430
    Abstract: A method including forming a intermetallic compound including (1) an interfacial reaction product between a solder and a contact point and (2) a reaction species. A method including doping a solder material with a species; and forming a intermetallic compound including an interfacial reaction product between the solder material and a contact point. A system including a computing device including a microprocessor, the microprocessor coupled to a printed circuit board through a substrate, the substrate including a first set of contact points and a second set of contact points, wherein the microprocessor is coupled to the substrate through the first set of contact points, and the substrate is coupled to the printed circuit board through the second set of contact points, wherein at least one of the first set of contact points and the second set of contact points. Also a substrate.
    Type: Application
    Filed: September 30, 2005
    Publication date: April 5, 2007
    Inventors: Daewoong Suh, Heeman Choe