Patents by Inventor Heeral J. Sheth

Heeral J. Sheth has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Depositing bulk or micro-scale electrodes
    Patent number: 10342128
    Abstract: Thicker electrodes are provided on microelectronic device using thermo-compression bonding. A thin-film electrical conducting layer forms electrical conduits and bulk depositing provides an electrode layer on the thin-film electrical conducting layer. An insulating polymer layer encapsulates the electrically thin-film electrical conducting layer and the electrode layer. Some of the insulating layer is removed to expose the electrode layer.
    Type: Grant
    Filed: September 23, 2016
    Date of Patent: July 2, 2019
    Assignee: Lawrence Livermore National Security, LLC
    Inventors: Kedar G. Shah, Satinderpall S. Pannu, Vanessa Tolosa, Angela C. Tooker, Heeral J. Sheth, Sarah H. Felix, Terri L. Delima
  • DEPOSITING BULK OR MICRO-SCALE ELECTRODES
    Publication number: 20170013713
    Abstract: Thicker electrodes are provided on microelectronic device using thermo-compression bonding. A thin-film electrical conducting layer forms electrical conduits and bulk depositing provides an electrode layer on the thin-film electrical conducting layer. An insulating polymer layer encapsulates the electrically thin-film electrical conducting layer and the electrode layer. Some of the insulating layer is removed to expose the electrode layer.
    Type: Application
    Filed: September 23, 2016
    Publication date: January 12, 2017
    Inventors: Kedar G. Shah, Satinderpall S. Pannu, Vanessa Tolosa, Angela C. Tooker, Heeral J. Sheth, Sarah H. Felix, Terri L. Delima
  • Depositing bulk or micro-scale electrodes
    Patent number: 9485873
    Abstract: Thicker electrodes are provided on microelectronic device using thermo-compression bonding. A thin-film electrical conducting layer forms electrical conduits and bulk depositing provides an electrode layer on the thin-film electrical conducting layer. An insulating polymer layer encapsulates the electrically thin-film electrical conducting layer and the electrode layer. Some of the insulating layer is removed to expose the electrode layer.
    Type: Grant
    Filed: March 13, 2014
    Date of Patent: November 1, 2016
    Assignee: Lawrence Livermore National Security, LLC
    Inventors: Kedar G. Shah, Satinderpall S. Pannu, Vanessa Tolosa, Angela C. Tooker, Heeral J. Sheth, Sarah H. Felix, Terri L. Delima
  • DEPOSITING BULK OR MICRO-SCALE ELECTRODES
    Publication number: 20140262462
    Abstract: Thicker electrodes are provided on microelectronic device using thermo-compression bonding. A thin-film electrical conducting layer forms electrical conduits and bulk depositing provides an electrode layer on the thin-film electrical conducting layer. An insulating polymer layer encapsulates the electrically thin-film electrical conducting layer and the electrode layer. Some of the insulating layer is removed to expose the electrode layer.
    Type: Application
    Filed: March 13, 2014
    Publication date: September 18, 2014
    Inventors: Kedar G. Shah, Satinderpall S. Pannu, Vanessa Tolosa, Angela C. Tooker, Heeral J. Sheth, Sarah H. Felix, Terri L. Delima