Abstract: The present disclosure relates to an organic electroluminescent device. The organic electroluminescent device of the present disclosure shows high luminous efficiency and good lifespan by comprising a specific combination of the plural kinds of host compounds and a specific hole transport compound.

Abstract: The present invention relates to a phosphine precursor for the preparation of a quantum dot, and a quantum dot prepared therefrom. Using the phosphine precursor for the preparation of a quantum dot of the present invention, a quantum dot with improved luminous efficiency and higher luminous color purity can be provided.

Abstract: The present disclosure relates to an organic electroluminescent device. The organic electroluminescent device of the present disclosure shows high luminous efficiency and good lifespan by comprising a specific combination of the plural kinds of host compounds and a specific hole transport compound.

Abstract: An encoding apparatus is provided. The encoding apparatus includes a track structure determiner determining a track structure using frequency coefficients, a frequency coefficient allocator allocating the frequency coefficients to each track according to the determined track structure, and a quantizer quantizing one or more pulses in each track based on a number of frequency coefficients allocated to a corresponding track. The encoding apparatus can prevent the degradation of sound quality by avoiding the problem faced by most sinusoidal quantization techniques using a fixed track structure, i.e., a failure to quantize all pulses due to mismatches between the pulse distribution of frequency coefficients and a track structure.

Abstract: A method for isolating elements in a silicon semiconductor device is disclosed. The invention discloses the steps of: (1) forming a thermal silicon oxide layer on a silicon substrate, depositing a layer of polysilicon, and depositing a first silicon nitride layer thereon, (2) patterning an active region and a field region, and etching the thermal oxidation layer, the polysilicon layer and the first silicon nitride layer on the field region to forth an active region pattern, (3) depositing a second silicon nitride layer, and, thereupon, depositing a silicon oxide layer, (4) etching back the oxide layer by application of a reactive ion etch technique, forming a silicon oxide side wall on the side of the active region pattern, and etching back the second silicon nitride layer using the oxide side wall as a mask to expose the silicon substrate, (5) removing the oxide side wall, and performing a channel stop field ion implantation, and (6) performing a field oxidation process to form a field oxide layer.