Abstract: A method for forming a shielding layer on a semiconductor device is disclosed. The semiconductor device comprises a bond pad formed on a front side of a substrate and extends to a first lateral surface of the substrate. The method comprises: etching a portion of the bond pad adjacent to the first lateral surface, to form a gap between the bond pad and the first lateral surface; attaching a filler onto the bond pad to fill the gap; and applying a shielding layer to a back side of the substrate.

Abstract: Disclosed herein is a method and an apparatus using microfluidic channel array for converting mechanical energy into electric energy by streaming potential and streaming current caused when the electrolyte liquid flows in a charged surface due to a pressure drop. The present invention relates to a method and an apparatus for designing channels with hierarchical structure in which a primary multi-channel is provided by radially arranging one or more unit channels, and each of the unit channels includes an inflow channel, an outflow channel, and a secondary multi-channel provided by arranging one or more channels in parallel, thereby improving output power and flow stability.

Abstract: Disclosed herein is a method and an apparatus using microfluidic channel array for converting mechanical energy into electric energy by streaming potential and streaming current caused when the electrolyte liquid flows in a charged surface due to a pressure drop. The present invention relates to a method and an apparatus for designing channels with hierarchical structure in which a primary multi-channel is provided by radially arranging one or more unit channels, and each of the unit channels includes an inflow channel, an outflow channel, and a secondary multi-channel provided by arranging one or more channels in parallel, thereby improving output power and flow stability.